Abstract: A transducer device for attachment to one end of a shaft of an electric drive, the shaft having a shaft axis. The transducer device includes at least one recess in the shaft end. Means are provided for engaging the transducer device with the at least one recess to create a form fitting connection acting in the direction of the shaft axis. Finally, a securing means is provided for preventing detachment of the form-fitting connection.

Abstract: A power semiconductor device comprises a substrate; and power semiconductor components disposed on and connected thereto. The device includes a housing part with a housing wall having a first cutout. The device has, for making electrical contact therewith, a unitary load connection element which passes through the first cutout in an X direction, is electrically conductive, and has an outer connection section disposed outside the housing part and an inner connection section disposed within the housing part. A first bush which has an internal thread running in the X direction is rotationally fixed and movable in the X direction in the housing wall. The first outer connection section has a second cutout aligned with the first bush. The load connection element has a first holding element disposed near the first cutout, the holding element engaging in a groove in the housing wall which runs perpendicular to the X direction.

Abstract: A power semiconductor device comprises a substrate; and power semiconductor components disposed on and connected thereto. The device includes a housing part with a housing wall having a first cutout. The device has, for making electrical contact therewith, a unitary load connection element which passes through the first cutout in an X direction, is electrically conductive, and has an outer connection section disposed outside the housing part and an inner connection section disposed within the housing part. A first bush which has an internal thread running in the X direction is rotationally fixed and movable in the X direction in the housing wall. The first outer connection section has a second cutout aligned with the first bush. The load connection element has a first holding element disposed near the first cutout, the holding element engaging in a groove in the housing wall which runs perpendicular to the X direction.

Abstract: A transducer device for attachment to one end of a shaft of an electric drive, the shaft having a shaft axis. The transducer device includes at least one recess in the shaft end. Means are provided for engaging the transducer device with the at least one recess to create a form fitting connection acting in the direction of the shaft axis. Finally, a securing means is provided for preventing detachment of the form-fitting connection.

Abstract: A power semiconductor module is presented. The power semiconductor module includes a plurality of capacitors coupled in parallel with each other. Each of the plurality of capacitors each includes a first and a second connection element. The power semiconductor module further includes a first and a second busbar. The first connection element of each of the plurality of capacitors is bonded to the first busbar, and the second connection element of each of the plurality of capacitors is bonded to the second busbar. The power semiconductor module further includes an insulating element disposed between the first busbar and the second busbar, and a pressure assembly that includes at least one pressure body and one associated counterpart pressure body. The first connection element and the second connection element of each of the plurality of capacitors is subjected to pressure and electrically bonded to the associated busbars by the pressure assembly.

Abstract: Introduced is a power semiconductor module preferably a disk cell with a power semiconductor element arranged in the interior of the housing. In a preferred embodiment, the disk cell has two load and at least one auxiliary connection and the auxiliary connection extends from the power semiconductor element and ends at a corresponding exterior connection element. The exterior connection element of the auxiliary connection penetrates the housing and is a pen-type metal preform in the interior.

Abstract: A power semiconductor module is presented. The power semiconductor module includes a plurality of capacitors coupled in parallel with each other. Each of the plurality of capacitors each includes a first and a second connection element. The power semiconductor module further includes a first and a second busbar. The first connection element of each of the plurality of capacitors is bonded to the first busbar, and the second connection element of each of the plurality of capacitors is bonded to the second busbar. The power semiconductor module further includes an insulating element disposed between the first busbar and the second busbar, and a pressure assembly that includes at least one pressure body and one associated counterpart pressure body. The first connection element and the second connection element of each of the plurality of capacitors is subjected to pressure and electrically bonded to the associated busbars by the pressure assembly.

Abstract: Introduced is a power semiconductor module preferably a disk cell with a power semiconductor element arranged in the interior of the housing. In a preferred embodiment, the disk cell has two load and at least one auxiliary connection and the auxiliary connection extends from the power semiconductor element and ends at a corresponding exterior connection element. The exterior connection element of the auxiliary connection penetrates the housing and is a pen-type metal preform in the interior.

Abstract: The invention relates to a method for preparing homogeneous dispersions of fluidizable bulk materials, wherein, in a first step, fluidizable bulk materials are blended with liquid to produce a raw dispersion and, in a second step, the raw dispersion is conveyed through a continuous enclosed dispersing apparatus by means of a forced-conveyance apparatus.

Abstract: A process for the continuous preparation of organopolysiloxane by condensation and/or equilibration reaction of organosilicon compounds comprisingin a first stepconveying an organosilicon compound, catalyst which is solid in the reaction mixture at least at the reaction temperature and, optionally, additives continuously from the bottom upwards through a heated cylindrical reactor which is arranged in a standing position and whose contents can be agitated mechanically andin a second steppassing the reaction mixture obtained after leaving the reactor at the upper end thereof continuously through a cylindrical reactor andin a third stepfreeing the reaction mixture obtained of catalyst after exit from the reactor.

Abstract: A process for purifying organopolysiloxanes, which comprises treating organopolysiloxanes after their preparation with an elemental metal. Impurities which are related to the preparation of organopolysiloxanes and cause changes in color, in particular during storage under the influence of heat, subsequent clouding, inhibition of catalysts, a lack of heat stability, a lack of dielectric strength or the formation of odors, especially after exposure to light, are removed by the process of this invention.