Abstract: A high performance, wafer-shaped semiconductor device of the type including a wafer-shaped semiconductor element, a pair of electrodes located on the surfaces of the element, a pair of cylindrical metal bodies contacting the electrodes, an insulating ring enclosing and centering the metal bodies and the semiconductor element and a plastic jacket surrounding the insulating ring for tightly encasing the semiconductor device. In addition, there is provided a pair of annular sheet metal strips each of which has an inner edge region fastened to one of the cylindrical metal bodies and a corrugated chemically roughened outer edge region which is embedded in the plastic jacket. A powder coating is applied to the chemically roughened outer edge region for the purpose of providing a pressure and oil-tight housing for the semiconductor device.

Abstract: A high output semiconductor device of the type which is tightly encased in a plastic coating, and includes a wafer-shaped semiconductor body having electrodes at its opposed major surfaces, two cylindrical metal bodies serving as current connecting and heat dissipating members contacting the electrodes of the semiconductor body at the respective major surfaces, and an insulating ring which encloses the metal bodies and the semiconductor body thereby centering the same. A pair of annular sheet metal strips, each having a dished portion adjacent the inner periphery, are each fastened at their inner peripheries to the superficies of a respective one of the two metal bodies.