Abstract: A cooling device includes an electronic computing device where the electronic computing device has a housing with a receiving space and an electronic component disposed in the receiving space. A cooler is formed separately from the housing where the cooler is disposed at least partially in the receiving space, is connected to the housing, and has a first cooling channel which is disposed at least partially in the receiving space and through which a cooling medium is flowable for cooling a subregion of the electronic computing device. A connector is formed separately from the housing and separately from the cooler, where the connector has a second cooling channel through which the cooling medium is flowable and which is fluidically connected to the first cooling channel.

Abstract: A plug component for arrangement on a housing has an inner part with a receiving region and a fastening region which are able to be plugged simultaneously through a first aperture and a second aperture in a wall of the housing. The plug component also has an outer part for plugging onto the receiving region of the inner part. The outer part and the fastening region in this case have mutually corresponding fastening features for fastening the outer part and the fastening region together.

Abstract: A cooling device for a power electronics module for cooling a power electronic assembly of the power electronics module includes a heatsink for dissipating waste heat from at least one power electronic component arranged on a circuit board, and at least one heat-conducting element for providing a local heat-conducting path between the at least one power electronic component and the heatsink. Heat-conducting element is formed as a cooling adapter and is separate from the heatsink and has a heat-conducting core, which can be arranged between the heat sink and the power electronic assembly and is designed to bridge a distance between the at least one power electronic component and the heatsink.

Abstract: A cooling device includes an electronic computing device where the electronic computing device has a housing with a receiving space and an electronic component disposed in the receiving space. A cooler is formed separately from the housing where the cooler is disposed at least partially in the receiving space, is connected to the housing, and has a first cooling channel which is disposed at least partially in the receiving space and through which a cooling medium is flowable for cooling a subregion of the electronic computing device. A connector is formed separately from the housing and separately from the cooler, where the connector has a second cooling channel through which the cooling medium is flowable and which is fluidically connected to the first cooling channel.

Abstract: A cooling device for a power electronics module for cooling a power electronic assembly of the power electronics module includes a heatsink for dissipating waste heat from at least one power electronic component arranged on a circuit board, and at least one heat-conducting element for providing a local heat-conducting path between the at least one power electronic component and the heatsink. Heat-conducting element is formed as a cooling adapter and is separate from the heatsink and has a heat-conducting core, which can be arranged between the heat sink and the power electronic assembly and is designed to bridge a distance between the at least one power electronic component and the heatsink.

Abstract: A log shaping machine for cutting logs to a desired diameter and for cutting off root outgrowths, has a cutting ring with inwardly pointing tools which rotate with the ring. For the purpose of changing the effective cutting diameter of the tools the ring is rotatably supported on a gyratory frame moving generally parallel to itself so that each point of the gyratory frame moves periodically on a circle while the orientation in space of the gyratory frame is maintained. This gyratory motion of the gyratory frame may undergo adjustment in size by changing the radius of the said circle within the range from zero up to a maximum value by means of adjustable eccentrics on which the gyratory frame is suspended and which are also used for driving the gyratory frame.