Abstract: A two-component solventless adhesive composition including: (A) at least one isocyanate component formulated for application to a first substrate comprising either at least one aromatic-based isocyanate, or a blend of: (Ai) at least one aromatic-based isocyanate; and (Aii) at least one aliphatic-based isocyanate; and (B) at least one isocyanate-reactive component formulated for application to a second substrate comprising a blend of: (Bi) at least one amine-initiated polyol comprising two or more primary hydroxyl groups and a backbone incorporating tertiary amines; (Bii) at least one hydroxyl terminated polyurethane polyol; (Biii) at least one phosphate ester polyol; (Biv) at least one polyester polyol; (Bv) at least one polyether polyol and (Bvi) optionally, at least one silane adhesion promoter; and a process for preparing the above two-component solventless adhesive composition; and a laminate structure made using the above two-component solventless adhesive composition.

Abstract: Methods for preparing waterborne heat seal coating compositions are disclosed, including (A) melt blending an ethylene vinyl acetate copolymer, a tackifier, and a wax in a first mixing apparatus to form a melt blend, (B) contacting the melt blend with an initial aqueous stream comprising a neutralizing agent, water, and a surfactant in an emulsification zone of the second mixing apparatus to form a dispersion, and (C) diluting the dispersion with water in a dilution zone of the second mixing apparatus to form the waterborne heat seal coating composition.

Abstract: Methods and apparatus for etching a high aspect ratio feature in a stack on a substrate are provided. The feature may be formed in the process of forming a 3D NAND device. Typically, the stack includes alternating layers of material such as silicon oxide and silicon nitride or silicon oxide and polysilicon. WF6 is provided in the etch chemistry, which substantially reduces or eliminates problematic sidewall notching. Advantageously, this improvement in sidewall notching does not introduce other tradeoffs such as increased bowing, decreased selectivity, increased capping, or decreased etch rate.

Abstract: Solvent-based adhesive compositions are disclosed herein. In some embodiments, the solvent-based adhesive compositions include (A) an isocyanate component comprising an isocyanate curing agent and (B) a hydroxyl component comprising a polyester polyol, a polyether polyol, and a phosphate ester compound. The isocyanate curing agent of the isocyanate component (A) crosslinks the components of the hydroxyl component. In some embodiments, the phosphate ester compound has the structure (I): (I) wherein R1 is any organic group. Methods for preparing solvent-based adhesive compositions are also disclosed.

Abstract: Methods for preparing waterborne heat seal coating compositions are disclosed, including (A) melt blending an ethylene vinyl acetate copolymer, a tackifier, and a wax in a first mixing apparatus to form a melt blend, (B) contacting the melt blend with an initial aqueous stream comprising a neutralizing agent, water, and a surfactant in an emulsification zone of the second mixing apparatus to form a dispersion, and (C) diluting the dispersion with water in a dilution zone of the second mixing apparatus to form the waterborne heat seal coating composition.

Abstract: Solvent-based adhesive compositions are disclosed herein. In some embodiments, the solvent-based adhesive compositions include (A) an isocyanate component comprising an isocyanate curing agent and (B) a hydroxyl component comprising a polyester polyol, a polyether polyol, and a phosphate ester compound. The isocyanate curing agent of the isocyanate component (A) crosslinks the components of the hydroxyl component. In some embodiments, the phosphate ester compound has the structure (I): (I) wherein R1 is any organic group. Methods for preparing solvent-based adhesive compositions are also disclosed.