Abstract: Embodiments of this application disclose a camera assembly and a terminal device. The camera assembly includes a transmission mechanism, a base, a rear housing, and a guide ring. A first end of the base is connected to the transmission mechanism, and a second end of the base is hinged to the rear housing. The rear housing has space for accommodating a camera, and at least two guide slots are disposed on the rear housing. A fixing part and a guide post are disposed on the guide ring, the fixing part is configured to fasten the guide ring to the terminal device, and the guide post adapts to the at least two guide slots. In a process in which the rear housing protrudes out of the terminal device, the guide post of the guide ring moves on the at least two guide slots of the rear housing, so that a movement direction of the rear housing is offset by a preset included angle. Therefore, a shooting angle of the camera disposed in the rear housing also changes, and the shooting angle of the camera is adjusted.

Abstract: The present invention discloses an electronic device enclosure and an electronic device. The electronic device enclosure includes: a housing enclosing an exterior of an electronic component; and a baffle plate which is away from the housing by a preset distance and is disposed on an inner side of the housing, where at least one opening is disposed on each of the housing and the baffle plate, where positions of the opening of the baffle plate and the opening of the housing are mutually staggered in a perpendicular direction, and the opening of the housing faces a non-opening area of the baffle plate in the perpendicular direction.

Abstract: A chip heat dissipation structure disposed on a printed circuit board (PCB), where the chip heat dissipation structure includes a chip card holder and at least one isolation groove; the chip card holder and the PCB are molded into one body; and the at least one isolation groove is disposed on the PCB and located around the chip card holder, and the at least one isolation groove is configured to isolate an area in which the chip card holder is located from another area on the PCB. The chip heat dissipation structure may be part of a terminal device.

Abstract: The present invention discloses an electronic device enclosure and an electronic device. The electronic device enclosure includes: a housing enclosing an exterior of an electronic component; and a baffle plate which is away from the housing by a preset distance and is disposed on an inner side of the housing, where at least one opening is disposed on each of the housing and the baffle plate, where positions of the opening of the baffle plate and the opening of the housing are mutually staggered in a perpendicular direction, and the opening of the housing faces a non-opening area of the baffle plate in the perpendicular direction.