Patents by Inventor Luen-Chian Sun

Luen-Chian Sun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Probing of device elements
    Patent number: 6902941
    Abstract: A new and improved method for the probing of integrated circuits (ICs) and is particularly suitable for probing various elements of an IC for failure analysis or other electrical testing and/or measurement of the IC. The method includes providing a probe access trench in the IMD (intermetal dielectric) or other substrate adjacent to the circuit element to be tested and then providing direct electrical contact between the test probe and the sidewall of the element through the trench, during the testing process. Such direct electrical contact between the test probe and the sidewall of the element prevents excessively high contact resistance which may otherwise occur in the use of a probing pad between the test probe and the element.
    Type: Grant
    Filed: March 11, 2003
    Date of Patent: June 7, 2005
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventor: Luen-Chian Sun
  • Acess trench probing of device elements
    Publication number: 20040180456
    Abstract: A new and improved method for the probing of integrated circuits (ICs) and is particularly suitable for probing various elements of an IC for failure analysis or other electrical testing and/or measurement of the IC. The method includes providing a probe access trench in the IMD (intermetal dielectric) or other substrate adjacent to the circuit element to be tested and then providing direct electrical contact between the test probe and the sidewall of the element through the trench, during the testing process. Such direct electrical contact between the test probe and the sidewall of the element prevents excessively high contact resistance which may otherwise occur in the use of a probing pad between the test probe and the element.
    Type: Application
    Filed: March 11, 2003
    Publication date: September 16, 2004
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventor: Luen-Chian Sun