Abstract: The present technology is related to optics and optical systems, particularly to photonic packaging, optical coupling, optical interconnects, micro-optics, and their fabrication. The present technology includes free-form micro-optical coupler architectures and systems with superb optical performance and a high-throughput method of fabricating large-area coupler arrays for scalable manufacturing. Embodiments include chip-to-fiber-array, chip-to-chip, chip-to-interposer, and chip-to-free-space couplers for applications including photonic packaging, optical communications, LiDAR, optical trapping and manipulation, augmented reality, virtual reality, and sensing.

Abstract: The present technology is related to optics, optical systems, and optically induced micro-/nano-fabrication methods. It includes metasurface optics, direct laser writing, and microscopy. Flat optic devices, architectures, and methods can achieve superb optical performance and structural simplicity compared to traditional bulk optical systems.