Abstract: In a filter arrangement comprising a frequency filter (F) that has a bad or non-ideal ground connection (GC1, 2, 3, 4, 5, 6, 7), the defects arising from bad ground are compensated by a capacitance (CC) coupled in parallel to the frequency filter. The value of the capacitance is chosen between 1 and 50 fF. The filter arrangement may be a receiving filter (RF) in a duplexer (DU).

Abstract: In a filter arrangement comprising a frequency filter (F) that has a bad or non-ideal ground connection (GC1, 2, 3, 4, 5, 6, 7), the defects arising from bad ground are compensated by a capacitance (CC) coupled in parallel to the frequency filter. The value of the capacitance is chosen between 1 and 50 fF. The filter arrangement may be a receiving filter (RF) in a duplexer (DU).

Abstract: An electrical component includes a first signal path and a second signal path electrically connected to a common signal path. The electrical component also includes a first filter in the first signal path and a second filter in the second signal path. The electrical component also includes a first matching circuit comprising a shunt arm to ground. The first matching circuit is electrically connected to the first signal path, the second signal path, and the common signal path.

Abstract: An electrical component is described with a first signal path (TX, RX1) and a second signal path (RX, RX2) that are connected to a common signal path (ANT, RX12). In the first signal path a first filter (F1) is arranged, and in the second signal path a second filter (F2) is arranged. The component comprises a first matching circuit (MA1) that comprises a shunt arm to ground. In the shunt arm, an inductor (L) is arranged, which is connected to the first signal path, the second signal path, and the common signal path. The component comprises a carrier substrate (SU) on which the filters (F1, F2), which are preferably implemented as chips, are mounted. The inductor (L) is integrated in the carrier substrate (SU).