Patents by Inventor Luis A. Gomez

Luis A. Gomez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11686006
    Abstract: Crystal plane orientation enrichment compounds are applied to copper to modify copper grain orientation distribution to the favorable crystal plain orientation to enhance copper electroplating. Electroplating copper on the modified copper enables faster and selective electroplating.
    Type: Grant
    Filed: April 1, 2022
    Date of Patent: June 27, 2023
    Assignee: ROHM AND HAAS ELECTRONIC MATERIALS LLC
    Inventors: Alejo M. Lifschitz Arribio, Jonathan D. Prange, Michael K. Gallagher, Alexander Zielinski, Luis A. Gomez, Joseph F. Lachowski
  • Patent number: 11512406
    Abstract: Crystal plane orientation enrichment compounds are applied to copper to modify copper grain orientation distribution to the favorable crystal plain orientation to enhance copper electroplating. Electroplating copper on the modified copper enables faster and selective electroplating.
    Type: Grant
    Filed: September 21, 2020
    Date of Patent: November 29, 2022
    Assignee: ROHM AND HAAS ELECTRONIC MATERIALS LLC
    Inventors: Alejo M. Lifschitz Arribio, Jonathan D. Prange, Michael K. Gallagher, Alexander Zielinski, Luis A. Gomez, Joseph F. Lachowski
  • Publication number: 20220228282
    Abstract: Crystal plane orientation enrichment compounds are applied to copper to modify copper grain orientation distribution to the favorable crystal plain orientation to enhance copper electroplating. Electroplating copper on the modified copper enables faster and selective electroplating.
    Type: Application
    Filed: April 1, 2022
    Publication date: July 21, 2022
    Inventors: Alejo M. Lifschitz Arribio, Jonathan D. Prange, Michael K. Gallagher, Alexander Zielinski, Luis A. Gomez, Joseph F. Lachowski
  • Publication number: 20210115581
    Abstract: Crystal plane orientation enrichment compounds are applied to copper to modify copper grain orientation distribution to the favorable crystal plain orientation to enhance copper electroplating. Electroplating copper on the modified copper enables faster and selective electroplating.
    Type: Application
    Filed: September 21, 2020
    Publication date: April 22, 2021
    Inventors: Alejo M. Lifschitz Arribio, Jonathan D. Prange, Michael K. Gallagher, Alexander Zielinski, Luis A. Gomez, Joseph F. Lachowski
  • Patent number: 9809891
    Abstract: Copper electroplating baths having a surface tension of ?40 mN/m are suitable for filling vias with copper, where such copper deposits are substantially void-free and substantially free of surface defects.
    Type: Grant
    Filed: June 30, 2014
    Date of Patent: November 7, 2017
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Matthew A. Thorseth, Mark A. Scalisi, Luis A. Gomez, Bryan Lieb, Rebecca Lea Hazebrouck, Mark Lefebvre
  • Publication number: 20150376807
    Abstract: Copper electroplating baths having a surface tension of ?40 mN/m are suitable for filling vias with copper, where such copper deposits are substantially void-free and substantially free of surface defects.
    Type: Application
    Filed: June 30, 2014
    Publication date: December 31, 2015
    Inventors: Matthew A. THORSETH, Mark A. SCALISI, Luis A. GOMEZ, Bryan LIEB, Rebecca Lea Hazebrouck, Mark LEFEBVRE
  • Patent number: 8012883
    Abstract: Methods are provided for manufacturing optical display devices which remove an etch resist and residual post-etch metal in a single step. These methods are particularly useful in the manufacture of LCDs.
    Type: Grant
    Filed: August 29, 2007
    Date of Patent: September 6, 2011
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Luis A. Gomez, Jason A. Reese
  • Publication number: 20080053956
    Abstract: Methods are provided for manufacturing optical display devices which remove an etch resist and residual post-etch metal in a single step. These methods are particularly useful in the manufacture of LCDs.
    Type: Application
    Filed: August 29, 2007
    Publication date: March 6, 2008
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Luis A. Gomez, Jason A. Reese
  • Patent number: 6508924
    Abstract: Disclosed are methods for analyzing additive breakdown products in electroplating baths as well as methods of controlling the presence of such breakdown products in electroplating baths.
    Type: Grant
    Filed: May 31, 2000
    Date of Patent: January 21, 2003
    Assignee: Shipley Company L.L.C.
    Inventors: Luis A. Gomez, Rozalia Beica, Denis Morrissey, Eugene N. Step