Abstract: An apparatus is provided to cool high-performance instruments within a semiconductor test head using direct facility water. The direct facility water cooling apparatus consists of an air chamber, a first base to receive and removably mount the instrument within the air chamber, a test head inlet in fluid communication with the first base and a facility water supply, a test head discharge in fluid communication with the first base and a facility drain, and a fan in fluid communication with the air chamber inlet to induce the flow of air from the air chamber inlet to the air chamber outlet.

Abstract: A test cell for use in a semiconductor manufacturing operation allowing alignment of semiconductor devices to be tested to a test station. The test cell is well suited for testing semiconductor devices on carrier strips. To aid in alignment, the test cell includes a down-ward looking camera and a simple upward looking sensor. Fiducials are acurately positioned relative to the test site, which are easily detected by the simple sensor. A controller within the test cell uses the output of the camera and the sensor, in conjunction with position sensors on a robotic assembly, to determine relative positions of the devices to be tested and the test station and issue the appropriate commands to align the devices to the test station.

Abstract: A test cell for use in a semiconductor manufacturing operation allowing alignment of semiconductor devices to be tested to a test station. The test cell is well suited for testing semiconductor devices on carrier strips. To aid in alignment, the test cell includes a down-ward looking camera and a simple upward looking sensor. Fiducials are acurately positioned relative to the test site, which are easily detected by the simple sensor. A controller within the test cell uses the output of the camera and the sensor, in conjunction with position sensors on a robotic assembly, to determine relative positions of the devices to be tested and the test station and issue the appropriate commands to align the devices to the test station.

Abstract: An integral unit for use in testing semiconductor components. The unit is designed to manipulate either packaged semiconductor components or semiconductor wafers and present them to a test head. It provides significant space savings because it replaces the need for separate prober, handler and tester units. The integrated unit includes a positioning mechanism with a tool plate that can be changed to grasp either a semiconductor wafer or a tray of semiconductor components. The tool plate uses a vacuum plate. To hold a tray of semiconductor parts, the vacuum plate has numerous independently operable holes. Each hole is positioned behind one semiconductor component and can be engaged or released separately so that the components can be sorted into separate output bins. To hold a wafer, the tool plate has an extendible tongue member that can be inserted into a stack of semiconductor wafers to pick up one wafer in the stack.

Abstract: A semiconductor chip tray holding chips in individual bins that can each be independently moved with six degrees of freedom. The bins are held in the tray with a flexural bearing system. The flexural bearing system centers the chips at a nominal position allows compliant motion of the bins. The flexural bearing system is made of four beams, with pairs joined at right angles through flexural bearings.