Abstract: A flux beam is generated as a function of flux magnitude patterns. A plurality of flux signals is detected via a sensor array comprising a plurality of sensors. A plurality of flux patterns is generated based on the plurality of flux signals, each of the plurality of flux patterns representing a respective one of the plurality of flux signals. A plurality of flux magnitude patterns is generated based on the plurality of flux patterns, each of the plurality of flux magnitude patterns representing an absolute value of a respective one of the plurality of flux patterns. A flux beam is then generated as a function of the plurality of flux magnitude patterns.

Abstract: In one embodiment, a disposable surgical rode deburrer has a shank configured to be rotated by a drive device and a housing assembly coupled to the shank. The housing assembly includes a rod guide having an opening sized to receive and stabilize a surgical rod when inserted therethrough into an inner cavity. The housing assembly also includes a cutting bit disposed within the inner cavity that is rotated to deburr an end of the surgical rod. A membrane wiper is disposed between the rod guide and the cutting bit. The membrane wiper has a seal that opens to allow the surgical rod to be inserted therethrough, and substantially closes when the surgical rod is removed. The housing assembly also includes a drive body. The membrane wiper retains within the inner cavity chips, particles or dust created by the cutting bit.

Abstract: In one embodiment, a surgical instrument is provided for grasping spherical implants. The surgical instrument includes a first lever arm having distal and proximate ends, as well as a second lever arm having distal and proximate ends. A first concave grasping cup is disposed at the distal end of the first lever arm. A second concave grasping cup is disposed at the distal end of the second lever arm. The first grasping cup and the second grasping cup are of differing sizes to enable the instrument to securely grasp spherical implants of a plurality of differing sizes.

Abstract: A circuit includes a digital-to-analog converter configured to produce an analog output signal (1) proportional to a reference signal and (2) as a function of a digital input signal. The converter comprises a plurality of non-trivially complex admittances configured so that each non-trivially complex admittance can be selectively switched as a function of the digital input signal so as to be coupled between a reference terminal configured to receive a reference signal and an output terminal. The method comprises selectively switching non-trivially complex admittances as a function of the digital signal between a reference terminal and an output terminal.

Abstract: A circuit includes a digital-to-analog converter configured to produce an analog output signal (1) proportional to a reference signal and (2) as a function of a digital input signal. The converter comprises a plurality of non-trivially complex admittances configured so that each non-trivially complex admittance can be selectively switched as a function of the digital input signal so as to be coupled between a reference terminal configured to receive a reference signal and an output terminal. The method comprises selectively switching non-trivially complex admittances as a function of the digital signal between a reference terminal and an output terminal.

Abstract: The circuits and methods of the present invention provide sample and hold circuits that incorporate an auxiliary sampling leg that cancels distortion produced in a main sampling leg of the sample and hold circuit. The auxiliary sampling leg of the circuit produces canceling distortion that is proportionally larger than the distortion produced in the main sampling leg. The distortion in the auxiliary sampling leg is then reduced in size so that the canceling distortion becomes proportionally equal to the distortion in the main sampling leg. Finally, the proportionally equal canceling distortion of the auxiliary sampling leg is subtracted from the distortion of the main sampling leg so that substantially all of the distortion is canceled out while retaining a substantial portion of the input signal.

Abstract: An edge clip is disclosed for electrically connecting a conductive pad on the surface of a printed circuit board or its edge to an external connector. The edge clip is substantially U-shaped, with first and second opposing, non-parallel sides defining a space therebetween. For connection, the printed circuit board edge is fitted into the space such that the opposing sides provide spring-like deflective force against the pad and the printed circuit board, thereby providing a more reliable connection. The edge clip may include an alignment feature for facilitating alignment prior to soldering. The alignment feature may include small projections formed on the edge clip to align with, and fit into, holes on the print circuit board. Scored sections may be disposed on one edge of the clip to facilitate removal of the edge clip from a carrier during assembly.

Abstract: An edge clip is disclosed for electrically connecting a conductive pad on the surface of a printed circuit board or its edge to an external connector. The edge clip is substantially U-shaped, with first and second opposing, non-parallel sides defining a space therebetween. For connection, the printed circuit board edge is fitted into the space such that the opposing sides provide spring-like deflective force against the pad and the printed circuit board, thereby providing a more reliable connection. The edge clip may include an alignment feature for facilitating alignment prior to soldering. The alignment feature may include small projections formed on the edge clip to align with, and fit into, holes on the print circuit board. Scored sections may be disposed on one edge of the clip to facilitate removal of the edge clip from a carrier during assembly.

Abstract: An improved electrical lead socket assembly is disclosed comprising a stamped and formed one-piece lead socket fabricated from a composite strip of at least two materials, at least one material having resilient mechanical characteristics, and at least one other material having different mechanical characteristics. The lead socket assembly may be further provided with superimposed strips of materials which have improved electrical conductivity characteristics or which are suitable for impeding the flow of solder.