Patents by Inventor Luis Antonio Valiente

Luis Antonio Valiente has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Coaxial structure for transmission of signals in test equipment
    Patent number: 10451652
    Abstract: An example system includes a circuit board having electrical elements; a wafer having contacts; and an interconnect to route signals between the electrical elements and the contacts. The interconnect includes multiple layers, each of which includes a flexible circuit. The flexible circuit includes a conductive trace disposed thereon. The interconnect also includes shielding between adjacent layers of the multiple layers. The shielding is electrically connected to ground.
    Type: Grant
    Filed: July 16, 2014
    Date of Patent: October 22, 2019
    Assignee: Teradyne, Inc.
    Inventors: Roger Allen Sinsheimer, David Walter Lewinnek, Luis Antonio Valiente
  • Interconnect for transmitting signals between a device and a tester
    Patent number: 9435855
    Abstract: A system includes: a circuit board including electrical elements arranged at a first pitch; a wafer including contacts arranged at a second pitch, where the second pitch is less than the first pitch; and an interconnect including additively-manufactured electrical conduits that are part of an electrical pathway between the electrical elements and the contacts, where the additively-manufactured electrical conduits include electrically-conductive material.
    Type: Grant
    Filed: November 19, 2013
    Date of Patent: September 6, 2016
    Assignee: Teradyne, Inc.
    Inventors: David Walter Lewinnek, Roger Allen Sinsheimer, Luis Antonio Valiente, Craig Anthony DiPalo
  • COAXIAL STRUCTURE FOR TRANSMISSION OF SIGNALS IN TEST EQUIPMENT
    Publication number: 20160018442
    Abstract: An example system includes a circuit board having electrical elements; a wafer having contacts; and an interconnect to route signals between the electrical elements and the contacts. The interconnect includes multiple layers, each of which includes a flexible circuit. The flexible circuit includes a conductive trace disposed thereon. The interconnect also includes shielding between adjacent layers of the multiple layers. The shielding is electrically connected to ground.
    Type: Application
    Filed: July 16, 2014
    Publication date: January 21, 2016
    Inventors: Roger Allen Sinsheimer, David Walter Lewinnek, Luis Antonio Valiente
  • INTERCONNECT FOR TRANSMITTING SIGNALS BETWEEN A DEVICE AND A TESTER
    Publication number: 20150137848
    Abstract: A system includes: a circuit board including electrical elements arranged at a first pitch; a wafer including contacts arranged at a second pitch, where the second pitch is less than the first pitch; and an interconnect including additively-manufactured electrical conduits that are part of an electrical pathway between the electrical elements and the contacts, where the additively-manufactured electrical conduits include electrically-conductive material.
    Type: Application
    Filed: November 19, 2013
    Publication date: May 21, 2015
    Inventors: David Walter Lewinnek, Roger Allen Sinsheimer, Luis Antonio Valiente, Craig Anthony DiPalo