Patents by Inventor Luis Daniel Borges

Luis Daniel Borges has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for improving bonding of circuit board substrates to metal surfaces and the articles formed thereby
    Publication number: 20030108764
    Abstract: A method for enhancing the adhesion between a metal surface and a circuit board substrate comprises contacting the metal surface with adhesion promoting solution comprising poly(vinyl butyral) having a molecular weight of about 70,000 to about 200,000 and a carrier; allowing the carrier to evaporate and forming an adhesion promoting layer; contacting the adhesion promoting layer with a curable thermosetting circuit board substrate composition; and curing the thermosetting composition. Use of an adhesion promoting layer comprising poly(vinyl butyral) having a molecular weight of about 70,000 to about 200,000 causes a large increase in both the tensile bond strength between the metal surface and thermoset resin and the uniformity of the tensile bond strength.
    Type: Application
    Filed: December 4, 2001
    Publication date: June 12, 2003
    Inventors: John Thomas Neill, Luis Daniel Borges