Patents by Inventor Luis Eduardo Herrera
Luis Eduardo Herrera has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11063002Abstract: A method for fabricating a radio-frequency (RF) module is disclosed, the method including forming or providing a first assembly that includes a packaging substrate and an RF component mounted thereon, the first assembly further including one or more shielding-wirebonds formed relative to the RF component, forming an overmold over the packaging substrate to substantially encapsulate the RF component and the one or more shielding-wirebonds, the overmold formed by compression molding, and forming a conductive layer on an upper surface of the overmold such that the conductive layer is in electrical contact with some or all of the shielding-wirebonds.Type: GrantFiled: January 5, 2020Date of Patent: July 13, 2021Assignee: Skyworks Solutions, Inc.Inventors: Hoang Mong Nguyen, Luis Eduardo Herrera, Sergio Joaquin Gonzalez Flores, Matthew Sean Read, Anthony James Lobianco, Heliodoro Osuna
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Publication number: 20200258845Abstract: A method for fabricating a radio-frequency (RF) module is disclosed, the method including forming or providing a first assembly that includes a packaging substrate and an RF component mounted thereon, the first assembly further including one or more shielding-wirebonds formed relative to the RF component, forming an overmold over the packaging substrate to substantially encapsulate the RF component and the one or more shielding-wirebonds, the overmold formed by compression molding, and forming a conductive layer on an upper surface of the overmold such that the conductive layer is in electrical contact with some or all of the shielding-wirebonds.Type: ApplicationFiled: January 5, 2020Publication date: August 13, 2020Inventors: Hoang Mong NGUYEN, Luis Eduardo HERRERA, Sergio Joaquin GONZALEZ FLORES, Matthew Sean READ, Anthony James LOBIANCO, Heliodoro OSUNA
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Patent number: 10529669Abstract: A method for fabricating a radio-frequency (RF) module is disclosed, the method including forming or providing a first assembly that includes a packaging substrate and an RF component mounted thereon, the first assembly further including one or more shielding-wirebonds formed relative to the RF component, and forming an overmold over the packaging substrate to substantially encapsulate the RF component and the one or more shielding-wirebonds, the overmold formed by compression molding that includes reducing a volume of melted resin in a direction having a component perpendicular to a plane defined by the packaging substrate.Type: GrantFiled: July 7, 2018Date of Patent: January 7, 2020Assignee: Skyworks Solutions, Inc.Inventors: Hoang Mong Nguyen, Luis Eduardo Herrera, Sergio Joaquin Gonzalez Flores, Matthew Sean Read, Anthony James Lobianco, Heliodoro Osuna
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Patent number: 10290585Abstract: A method for fabricating a radio-frequency (RF) module is disclosed, the method including forming or providing a first assembly that includes a packaging substrate and an RF component mounted thereon, the first assembly further including one or more shielding-wirebonds formed relative to the RF component, and forming an overmold over the packaging substrate to substantially encapsulate the RF component and the one or more shielding-wirebonds, the overmold formed by compression molding that includes reducing a volume of melted resin in a direction having a component perpendicular to a plane defined by the packaging substrate.Type: GrantFiled: May 26, 2016Date of Patent: May 14, 2019Assignee: Skyworks Solutions, Inc.Inventors: Hoang Mong Nguyen, Luis Eduardo Herrera, Sergio Joaquin Gonzalez Flores, Matthew Sean Read, Anthony James Lobianco, Heliodoro Osuna
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Publication number: 20180315717Abstract: A method for fabricating a radio-frequency (RF) module is disclosed, the method including forming or providing a first assembly that includes a packaging substrate and an RF component mounted thereon, the first assembly further including one or more shielding-wirebonds formed relative to the RF component, and forming an overmold over the packaging substrate to substantially encapsulate the RF component and the one or more shielding-wirebonds, the overmold formed by compression molding that includes reducing a volume of melted resin in a direction having a component perpendicular to a plane defined by the packaging substrate.Type: ApplicationFiled: July 7, 2018Publication date: November 1, 2018Inventors: Hoang Mong NGUYEN, Luis Eduardo HERRERA, Sergio Joaquin GONZALEZ FLORES, Matthew Sean READ, Anthony James LOBIANCO, Heliodoro OSUNA
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Publication number: 20180019212Abstract: An automated system for maintaining paint thickness uniformity over the surface of a cap encapsulating at least one integrated circuit (IC) module on a panel of IC modules is provided. The system can be computer implemented and applies a layer of conductive paint that electrically couples with wirebonds on the panel to form at least part of an electromagnetic interference (EMI) or radio frequency interference (RFI) shield that attenuates EMI or RFI during operation of the IC module. The system optimizes the spray nozzle diameter, fluid pressure, coaxial air pressure, spray heights, speeds, and spray pattern achieves paint thickness control. A uniform coating of conductive paint provides a more effective EMI or RFI shield during the operation of the IC modules.Type: ApplicationFiled: August 2, 2017Publication date: January 18, 2018Inventors: Matthew Sean Read, Hoang Mong Nguyen, Sergio Joaquin Gonzalez, Luis Eduardo Herrera
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Patent number: 9754896Abstract: Systems and methods disclose maintaining paint thickness uniformity over the surface of a cap encapsulating at least one integrated circuit (IC) module on a panel of IC modules. The layer of conductive paint electrically couples with wirebonds on the panel to form at least part of an electromagnetic interference (EMI) or radio frequency interference (RFI) shield that attenuates EMI or RFI during operation of the IC module. Optimizing the spray nozzle diameter, fluid pressure, coaxial air pressure, spray heights, speeds, and spray pattern achieves paint thickness control. A uniform coating of conductive paint provides a more effective EMI or RFI shield during the operation of the IC modules.Type: GrantFiled: May 14, 2013Date of Patent: September 5, 2017Assignee: SKYWORKS SOLUTIONS, INC.Inventors: Matthew Sean Read, Hoang Mong Nguyen, Sergio Joaquin Gonzalez, Luis Eduardo Herrera
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Publication number: 20170025362Abstract: A method for fabricating a radio-frequency (RF) module is disclosed, the method including forming or providing a first assembly that includes a packaging substrate and an RF component mounted thereon, the first assembly further including one or more shielding-wirebonds formed relative to the RF component, and forming an overmold over the packaging substrate to substantially encapsulate the RF component and the one or more shielding-wirebonds, the overmold formed by compression molding that includes reducing a volume of melted resin in a direction having a component perpendicular to a plane defined by the packaging substrate.Type: ApplicationFiled: May 26, 2016Publication date: January 26, 2017Inventors: Hoang Mong NGUYEN, Luis Eduardo HERRERA, Sergio Joaquin GONZALEZ FLORES, Matthew Sean READ, Anthony James LOBIANCO, Heliodoro OSUNA
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Publication number: 20140083459Abstract: Disclosed are systems and methods related to cleaning during manufacture of radio-frequency (RF) modules. Such modules can be manufactured in an array on a panel. At one or more stages, it can be desirable to perform cleaning operations for such panels. In some embodiments, a cleaning system can include a first belt transport apparatus configured to support a first surface of the panel and move the panel during a cleaning process. The cleaning system can further include a second belt transport apparatus configured to engage a second surface of the panel to keep the panel on the first belt transport apparatus during the cleaning process. At least the second belt transport apparatus can include a mesh, with the mesh having a coating configured to reduce the likelihood of damage to the second surface of the panel and to provide desired electrostatic discharge protection for the panel.Type: ApplicationFiled: September 7, 2013Publication date: March 27, 2014Inventors: Matthew Sean READ, Hoang Mong NGUYEN, Sergio Joaquin GONZALEZ, Luis Eduardo HERRERA, Heliodoro OSUNA
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Publication number: 20140087633Abstract: Disclosed are systems and methods related to removal of materials by techniques such as ablation during manufacture of radio-frequency (RF) modules. Such modules can be manufactured in an array on a panel, and an overmold structure can be formed on the panel. In some situations, it can be desirable to remove a portion of an upper surface of the overmold to, for example, better expose upper portions of shielding wirebonds. In some embodiments, an ablation system can include a blasting apparatus configured to provide a stream of ablating particles to a blasting region. A first transport section that moves a panel through the blasting region can be separate from a second transport section that feeds or removes the panel to or from the first transport section. Such a configuration can substantially isolate the second transport section from the stream of ablating particles.Type: ApplicationFiled: September 7, 2013Publication date: March 27, 2014Inventors: Matthew Sean READ, Hoang Mong NGUYEN, Sergio Joaquin GONZALEZ, Luis Eduardo HERRERA, Heliodoro OSUNA
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Publication number: 20130323409Abstract: Systems and methods disclose reduction of conductive paint overspray while maintaining paint thickness uniformity over the perimeter of a cap encapsulating at least one integrated circuit (IC) module on a panel of IC modules. The layer of conductive paint electrically couples with wirebonds on the panel to form at least part of an electromagnetic interference (EMI) or radio frequency interference (RFI) shield that attenuates EMI or RFI during operation of the IC module. Optimizing the spray nozzle diameter, fluid pressure, coaxial air pressure, spray heights, speeds, and spray pattern reduces paint waste and achieves edge uniformity. The reduction in paint overspray reduces paint waste, which in turn, reduces production costs. With the reduced amount of paint needed for coating a panel, the cost per unit can be significantly reduced.Type: ApplicationFiled: May 14, 2013Publication date: December 5, 2013Applicant: Skyworks Solutions, Inc.Inventors: Matthew Sean Read, Hoang Mong Nguyen, Sergio Joaquin Gonzalez, Luis Eduardo Herrera
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Publication number: 20130323408Abstract: Systems and methods disclose maintaining paint thickness uniformity over the surface of a cap encapsulating at least one integrated circuit (IC) module on a panel of IC modules. The layer of conductive paint electrically couples with wirebonds on the panel to form at least part of an electromagnetic interference (EMI) or radio frequency interference (RFI) shield that attenuates EMI or RFI during operation of the IC module. Optimizing the spray nozzle diameter, fluid pressure, coaxial air pressure, spray heights, speeds, and spray pattern achieves paint thickness control. A uniform coating of conductive paint provides a more effective EMI or RFI shield during the operation of the IC modules.Type: ApplicationFiled: May 14, 2013Publication date: December 5, 2013Applicant: Skyworks Solutions, Inc.Inventors: Matthew Sean Read, Hoang Mong Nguyen, Sergio Joaquin Gonzalez, Luis Eduardo Herrera