Abstract: An adapter frame has channels that hold multiple die carriers in each channel. The die carriers, such as 2?×2? or 4?×4? waffle packs or GEL-PAK die carriers, slide into the channels and are secured by a spring clip retention mechanism. In other embodiments, the adapter frame has molded individual cavities to hold single die carriers. The adapter frame has the same exterior dimensions as a conventional wafer frame. This allows the adapter frame to be handled at the die sorter output in the same or similar manner as output wafer frames, thereby eliminating the need to change handlers when switching the output from a wafer frame to a specific die carrier.