Patents by Inventor Luis J. DaSilva

Luis J. DaSilva has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12151502
    Abstract: A card includes a layer of deformable material embossed with a three dimensional (3-D) pattern. A first layer is in direct contact with and overlies the embossed deformable layer. A second layer is in direct contact with and underlies the embossed deformable layer. The first layer is of conformable material and extends within the embossed pattern for filling, setting and maintaining the embossed pattern in a fixed condition. The second layer is of conformable material and conforms to the embossed pattern set in the deformable layer.
    Type: Grant
    Filed: October 7, 2019
    Date of Patent: November 26, 2024
    Assignee: CompoSecure, LLC
    Inventors: John Herslow, Luis J. DaSilva
  • Publication number: 20200039280
    Abstract: A card includes a layer of deformable material embossed with a three dimensional (3-D) pattern. A first layer is in direct contact with and overlies the embossed deformable layer. A second layer is in direct contact with and underlies the embossed deformable layer. The first layer is of conformable material and extends within the embossed pattern for filling, setting and maintaining the embossed pattern in a fixed condition. The second layer is of conformable material and conforms to the embossed pattern set in the deformable layer.
    Type: Application
    Filed: October 7, 2019
    Publication date: February 6, 2020
    Applicant: CompoSecure, LLC
    Inventors: John Herslow, Luis J. DaSilva
  • Patent number: 10479130
    Abstract: The invention includes a method for forming a card with an embedded three dimensional (3-D) image and the resultant card formed by the method. The method includes forming a first assembly which includes a layer of deformable material and an overlying layer of pattern conforming material. An engraved laminating plate is applied to the deformable layer during an engraving and laminating step applied to the first sub-assembly under predetermined pressure and selected temperature conditions for embossing the deformable layer with a well defined and sharp pattern. Then, a second assembly including a pattern conforming layer is laminated with the first assembly to embed and secure the pattern between the two conformable layers.
    Type: Grant
    Filed: July 24, 2009
    Date of Patent: November 19, 2019
    Assignee: COMPOSECURE, L.L.C.
    Inventors: John Herslow, Luis J. DaSilva
  • Publication number: 20110020606
    Abstract: The invention includes a method for forming a card with an embedded three dimensional (3-D) image and the resultant card formed by the method. The method includes forming a first assembly which includes a layer of deformable material and an overlying layer of pattern conforming material. An engraved laminating plate is applied to the deformable layer during an engraving and laminating step applied to the first sub-assembly under predetermined pressure and selected temperature conditions for embossing the deformable layer with a well defined and sharp pattern. Then, a second assembly including a pattern conforming layer is laminated with the first assembly to embed and secure the pattern between the two conformable layers.
    Type: Application
    Filed: July 24, 2009
    Publication date: January 27, 2011
    Inventors: John Herslow, Luis J. DaSilva