Patents by Inventor Luis J Morenilla

Luis J Morenilla has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated vehicle power distribution and gateway system
    Patent number: 7064658
    Abstract: A universal vehicle electric power distribution module employs reconfigurable inputs and outputs enabling use of the same hardware across vehicle lines. The module is scalable for ease of expansion and is capable of handling both low current and high current load management on the same module.
    Type: Grant
    Filed: March 5, 2004
    Date of Patent: June 20, 2006
    Assignee: DaimlerChrysler Corporation
    Inventors: Gary Burlak, Rod S Fraser, Michael A Cox, Marian Mirowski, Michael C Long, Bradley S Chupp, Frank Trovato, John M Gaynier, Luis J Morenilla, Peter J Narbus
  • Integrated vehicle power distribution and gateway system
    Publication number: 20040189092
    Abstract: A universal vehicle electric power distribution module employs reconfigurable inputs and outputs enabling use of the same hardware across vehicle lines. The module is scalable for ease of expansion and is capable of handling both low current and high current load management on the same module.
    Type: Application
    Filed: March 5, 2004
    Publication date: September 30, 2004
    Inventors: Gary Burlak, Rod S. Fraser, Michael A. Cox, Marian Mirowski, Michael C. Long, Bradley S. Chupp, Frank Trovato, John M. Gaynier, Luis J. Morenilla, Peter J. Narbus
  • Heat sink assembly for electrical components
    Patent number: 6043981
    Abstract: A heat sink assembly to remove heat from electrical components mounted on a circuit board is disclosed. The assembly contains a housing that is formed from a suitable heat sinking material and is appropriate for receiving a circuit board with surface mounted electrical components. The invention provides an improved apparatus for establishing thermal contact from a heat generating, surface mounted electrical component to the housing. A resilient biasing element is fixed in relation to the circuit board and the housing in order to urge the circuit board with a plurality of surface mounted electrical components in thermal contact with the housing. Once the heat sink is assembled the invention provides various means for which heat can be readily transferred from the electrical components to the housing.
    Type: Grant
    Filed: November 13, 1997
    Date of Patent: March 28, 2000
    Assignee: Chrysler Corporation
    Inventors: Paul A. Markow, Karl W. Shock, Bradley S. Chupp, Luis J. Morenilla, Frank R. Holmes, Stephen W. Burcham