Patents by Inventor Luis Lau

Luis Lau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polishing pad shaping and patterning
    Patent number: 6315857
    Abstract: Polishing pads are provided for a linear chemical mechanical polishing apparatus used in manufacturing integrated circuits. The polishing pads, which are attached to a polishing belt, are grooved in patterns to advantageously transport slurry from the point of introduction to the point at which semiconductor wafers are polished. The patterns include at least one set of multiple parallel grooves extending across the polishing pads. The grooves form an angle with the direction of travel of the belt that is unequal to zero.
    Type: Grant
    Filed: July 10, 1998
    Date of Patent: November 13, 2001
    Assignee: Mosel Vitelic, Inc.
    Inventors: Tsungnan Cheng, Ethan C. Wilson, Shou-sung Chang, Gregory C. Lee, Huey M. Tzeng, David E. Weldon, Linh X. Can, Luis Lau, Siyuan Yang