Abstract: A concentrate carrier system for adding colorants and/or other additives to resin formulations over a broad range of processing temperatures is described. The carrier system includes at least 20 wt. % of a base acrylate copolymer, such as ethyl-methyl acrylate, provided in combination with less than 55 or less than 30 wt. % of a ring-opened cyclic ester or ether derivative, such as polycaprolactone, polyhydroxyalkonates, polyglycolide, polylactide, poly(butylene succinate), other aliphatic linear polyesters. The remainder, which may include an optional organic plasticizer such as epoxidized soybean oil, is dedicated to an additive package that may include colorants, property enhancers, and/or non-property fillers.

Abstract: A method of processing a plurality of substrates includes immersing the plurality of substrates into a bath solution contained in a bath chamber; generating gas bubbles in the bath solution; projecting light from a light source toward the bath chamber; generating light sensor data by capturing light emanating off the bath chamber after interacting with the gas bubbles with a light sensor; and converting the light sensor data into a metric for the bath solution.

Abstract: A method of processing a plurality of substrates includes immersing the plurality of substrates into a bath solution contained in a bath chamber; generating gas bubbles in the bath solution; projecting light from a light source toward the bath chamber; generating light sensor data by capturing light emanating off the bath chamber after interacting with the gas bubbles with a light sensor; and converting the light sensor data into a metric for the bath solution.

Abstract: In one example, a method for wafer drying includes providing a surface of a first wafer, the surface of the first wafer including a liquid to be removed with a drying process. The method further includes replacing the liquid with a first solid film in a first processing chamber, the first solid film covering the surface of the first wafer. The method further includes transferring the first wafer from the first processing chamber to a second processing chamber. The method further includes processing the first wafer in the second processing chamber by flowing a supercritical fluid through the second processing chamber, where the supercritical fluid removes the first solid film.

Abstract: A method of processing a plurality of substrates includes immersing the plurality of substrates into a bath solution contained in a bath chamber; generating gas bubbles in the bath solution; projecting light from a light source toward the bath chamber; generating light sensor data by capturing light emanating off the bath chamber after interacting with the gas bubbles with a light sensor; and converting the light sensor data into a metric for the bath solution.

Abstract: In one example, a method for wafer drying includes providing a surface of a first wafer, the surface of the first wafer including a liquid to be removed with a drying process. The method further includes replacing the liquid with a first solid film in a first processing chamber, the first solid film covering the surface of the first wafer. The method further includes transferring the first wafer from the first processing chamber to a second processing chamber. The method further includes processing the first wafer in the second processing chamber by flowing a supercritical fluid through the second processing chamber, where the supercritical fluid removes the first solid film.

Abstract: In one exemplary embodiment, described herein are innovative techniques for reducing the attractive force between particles and a substrate surface to aid in the removal of particles from the substrate surface. More specifically, a multi-electrode chuck is utilized to assist in cleaning a substrate. The multi-electrode chuck is utilized to reduce the attractive forces between particles and the substrate and to move the loosened particles that are present on the substrate surface. The electrodes of the chuck are biased with alternating current (AC) voltages with a phase shift between the electrode bias waves. The resulting electric field wave on the substrate surface loosens the particles by polarizing the particles and moves the loosened particles across the substrate.

Abstract: A wet etch system comprises an etching bath comprising an etching solution in a process tank inside an overflow tank flowing over an open top into the overflow tank. The etching bath has a top cover, a gas inlet, and a gas outlet above the etching solution. A gas flow system pumps inert gas into the gas inlet and extracts the gas through the gas outlet under positive pressure. The gas flow system may also bubble inert gas through the etching solution via injectors of a gas sparger in the process tank. A recirculation path connects a liquid outlet port coupled to the overflow tank to a liquid inlet port coupled to the process tank. A pump drives the etching solution to flow from the overflow tank, through a degasser in the recirculation path, back into the process tank, and overflow from the process tank into the overflow tank.

Abstract: A concentrate carrier system for adding colorants and/or other additives to resin formulations over a broad range of processing temperatures is described. The carrier system includes at least 20 wt. % of a base acrylate copolymer, such as ethyl-methyl acrylate, provided in combination with less than 55 or less than 30 wt. % of a ring-opened cyclic ester or ether derivative, such as polycaprolactone, polyhydroxyalkonates, polyglycolide, polylactide, poly(butylene succinate), other aliphatic linear polyesters. The remainder, which may include an optional organic plasticizer such as epoxidized soybean oil, is dedicated to an additive package that may include colorants, property enhancers, and/or non-property fillers.

Abstract: In one example, a method for wafer drying includes providing a surface of a first wafer, the surface of the first wafer including a liquid to be removed with a drying process. The method further includes replacing the liquid with a first solid film in a first processing chamber, the first solid film covering the surface of the first wafer. The method further includes transferring the first wafer from the first processing chamber to a second processing chamber. The method further includes processing the first wafer in the second processing chamber by flowing a supercritical fluid through the second processing chamber, where the supercritical fluid removes the first solid film.

Abstract: A concentrate carrier system for adding colorants and/or other additives to resin formulations over a broad range of processing temperatures is described. The carrier system includes at least 20 wt. % of a base acrylate copolymer, such as ethyl-methyl acrylate, provided in combination with less than 30 wt. % of polycarpolactone, or a similar ring-opened cyclic ester or ether derivatives. The remainder, which may include an optional organic plasticizer such as epoxidized soybean oil, is dedicated to an additive package that may include colorants, property enhancers, and/or non-property fillers.

Abstract: A concentrate carrier system for adding colorants and/or other additives to resin formulations over a broad range of processing temperatures is described. The carrier system includes at least 20 wt. % of a base acrylate copolymer, such as ethyl-methyl acrylate, provided in combination with less than 30 wt. % of polycarpolactone, or a similar ring-opened cyclic ester or ether derivatives. The remainder, which may include an optional organic plasticizer such as epoxidized soybean oil, is dedicated to an additive package that may include colorants, property enhancers, and/or non-property fillers.

Abstract: In one exemplary embodiment, described herein are innovative techniques for reducing the attractive force between particles and a substrate surface to aid in the removal of particles from the substrate surface. More specifically, a multi-electrode chuck is utilized to assist in cleaning a substrate. The multi-electrode chuck is utilized to reduce the attractive forces between particles and the substrate and to move the loosened particles that are present on the substrate surface. The electrodes of the chuck are biased with alternating current (AC) voltages with a phase shift between the electrode bias waves. The resulting electric field wave on the substrate surface loosens the particles by polarizing the particles and moves the loosened particles across the substrate.

Abstract: Locking systems for ammunition cans, including locking systems configured to removably attach to the ammunition can front side. In some examples, the locking system includes a latch frame, a front plate, and a cover panel. In some further examples, the front plate is parallelly affixed to the latch frame. In other examples, the latch frame is removably fitted over a plate. Finally, in even further examples, the locking system may be secured with a device such as a padlock or a combination lock.

Abstract: Embodiments of the invention provide a method for treating a microelectronic substrate with dilute TMAH. In the method, a microelectronic substrate is received into a process chamber, the microelectronic substrate having a layer, feature or structure of silicon. A treatment solution is applied to the microelectronic substrate to etch the silicon, where the treatment solution includes a dilution solution and TMAH. A controlled oxygen content is provided in the treatment solution or in an environment in the process chamber to achieve a target etch selectivity of the silicon, or a target etch uniformity across the layer, feature or structure of silicon, or both by the treatment solution.

Abstract: A method for controlling the temperature profile of phosphoric acid process over a wafer surface through the dynamic control of radial dispensing of sulfuric acid at a selected temperature, which includes providing a substrate with a layer formed thereupon; dispensing a first chemical and second chemicals onto the layer while adjusting at least one parameter of the second chemical dispense to vary the etch rate across a region of the substrate.

Abstract: Locking systems for ammunition cans, including locking systems configured to removably attach to the ammunition can front side. In some examples, the locking system includes a latch frame, a front plate, and a cover panel. In some further examples, the front plate is paralelly affixed to the latch frame. In other examples, the latch frame is removably fitted over a plate. Finally, in even further examples, the locking system may be secured with a device such as a padlock or a combination lock.

Abstract: Embodiments of the invention provide a method for treating a microelectronic substrate with dilute TMAH. In the method, a microelectronic substrate is received into a process chamber, the microelectronic substrate having a layer, feature or structure of silicon. A treatment solution is applied to the microelectronic substrate to etch the silicon, where the treatment solution includes a dilution solution and TMAH. A controlled oxygen content is provided in the treatment solution or in an environment in the process chamber to achieve a target etch selectivity of the silicon, or a target etch uniformity across the layer, feature or structure of silicon, or both by the treatment solution.

Abstract: A method for controlling the temperature profile of phosphoric acid process over a wafer surface through the dynamic control of radial dispensing of sulfuric acid at a selected temperature, which includes providing a substrate with a layer formed thereupon; dispensing a first chemical and second chemicals onto the layer while adjusting at least one parameter of the second chemical dispense to vary the etch rate across a region of the substrate.

Abstract: Method and apparatus for rinsing and drying a semiconductor substrate having a first rinse liquid such as water on the substrate in a substrate processing system. The method includes dispensing onto the substrate liquid carbon dioxide to displace any liquid present on the substrate and to dry the substrate. The apparatus includes a chamber for rinsing and drying the substrate.