Patents by Inventor Luis Ricardo Luzardo Pereira

Luis Ricardo Luzardo Pereira has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7525809
    Abstract: A packaged electrical system includes an enclosure and a main interior volume for component supports. The component supports may support electrical, electronic, power electronic and similar components, as well as switchgear and the like. A main power wireway is provided adjacent to the main interior volume of the enclosure for accommodating three phase power conductors. A network and control power wireway is formed separately from the main power wireway. The network and control power wireway may be formed toward the rear of the main interior volume, and may accommodate plug-in connections between component supports and network conductors and control power conductors. The network and control power wireway is thus accessible through a separate door from the main power wireway.
    Type: Grant
    Filed: November 11, 2005
    Date of Patent: April 28, 2009
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Herberto Bergmann, Arnaldo Hiroyuki Omoto, Luis Ricardo Luzardo Pereira, José Batista Ferreira Neto, David L. Jensen, Chester Malkowski, Jr.
  • Patent number: 7417848
    Abstract: A reduced form factor component support is provided for motor control centers and similar packaged electrical systems. The reduced form factor component support may be used with smaller components, such as small motor starters, motor drives, and so forth. Electrical connections with standard bus bars in the enclosure are made through special connectors mounted on subplates in the rear of the enclosure, or by an invertible stab housing that can allow the reduced form factor component support to share conventional slots in a bus cover, thereby providing access to the supply power in the enclosure.
    Type: Grant
    Filed: November 11, 2005
    Date of Patent: August 26, 2008
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Herberto Bergmann, Eric Krieg, Chester Malkowski, Jr., Arnaldo Hiroyuki Omoto, Luis Ricardo Luzardo Pereira, José Batista Ferreira Neto