Abstract: In one embodiment, an apparatus includes an integrated circuit (IC) socket and an interposer. The IC socket includes a cavity to receive an IC package including first and second sets of IC contacts, the cavity defined by a base including a set of IC socket interconnects and a frame extending from the base with at least one opening through the frame. The interposer includes a cavity portion disposed adjacent the base of the IC socket, an external portion extending from the cavity portion through one of the at least one opening, at least one connector disposed on the external portion, a first set of interposer interconnects to electrically couple each of the first set of IC contacts with a corresponding one of the set of IC socket interconnects, and a second set of interposer interconnects to electrically couple each of the second set of IC contacts with one of the at least one connector. Other embodiments are described and claimed.

Abstract: Embodiments herein describe techniques for an IC package including a package substrate. The package substrate includes a set of validation connectors formed on a first side of the package substrate, a first set of functional connectors formed on the first side of the package substrate, and a second set of functional connectors formed on a second side of the package substrate opposite to the first side. A validation connector of the set of validation connectors is arranged to be coupled with a validation connector of an IC die placed above the first side of the package substrate. A first functional connector of the first set of functional connectors is arranged to be coupled with a functional connector of the IC die. A second functional connector of the second set of functional connectors is arranged to be coupled through the first functional connector to the functional connector of the IC die.