Patents by Inventor Luis Rochin

Luis Rochin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Eutectic bonding of ultrathin semiconductors
    Patent number: 7476606
    Abstract: Ultra-high speed semiconductors that are usually very thin and therefore very fragile still require connection to a circuit board and a heat transfer pathway. Ultra-high speed circuits and semiconductor devices are provided with a carrier plate formed on the backside of a wafer or substrate by a variety of deposition methods. The carrier plate is a series of metal layers, each being selected to enable the attachment of a relatively thick copper carrier plate to the backside of the substrate or wafer.
    Type: Grant
    Filed: March 28, 2006
    Date of Patent: January 13, 2009
    Assignee: Northrop Grumman Corporation
    Inventors: Dean Tran, Alan Hirschberg, Ha K. DeMarco, Luis Rochin, Thomas Chung, Mark Kintis, Steven J. Mass
  • Eutectic bonding of ultrathin semiconductors
    Publication number: 20070235744
    Abstract: Ultra-high speed semiconductors that are usually very thin and therefore very fragile still require connection to a circuit board and a heat transfer pathway. Ultra-high speed circuits and semiconductor devices are provided with a carrier plate formed on the backside of a wafer or substrate by a variety of deposition methods. The carrier plate is a series of metal layers, each being selected to enable the attachment of a relatively thick copper carrier plate to the backside of the substrate or wafer.
    Type: Application
    Filed: March 28, 2006
    Publication date: October 11, 2007
    Inventors: Dean Tran, Alan Hirschberg, Ha DeMarco, Luis Rochin, Thomas Chung, Mark Kintis, Steven Mass
  • Light weight x-ray radiation shield for electronics components and related fabrication method
    Publication number: 20070184285
    Abstract: Protection against x-ray radiation is provided by a thin layer of a zinc-based alloy. An electronics component housing and lid are made to include a base of a lightweight alloy, a thin coating of the zinc-based alloy and an exterior finish metal layer. The zinc-based alloy provides excellent radiation protection and other advantages, without a significant weight penalty.
    Type: Application
    Filed: February 8, 2006
    Publication date: August 9, 2007
    Inventors: Dean Tran, Thomas Chung, Alan Hirschberg, Luis Rochin, Mark Kintis