Abstract: The technology of this application relates to, at least, a cooling module. The cooling module includes a liquid mixing cavity, a first and a second cooling plate. The first cooling plate is disposed on a side of a first chip and is fastened to the first chip. The second cooling plate is disposed on a side of a second chip and is fastened to the second chip. A temperature of the first chip is not equal to a temperature of the second chip. A flow channel is provided in each of the first cooling plate and the second cooling plate. The first cooling plate and the second cooling plate are each provided with a liquid outlet and a liquid return opening that are communicated with the flow channel. Both the liquid outlet and the liquid return opening are communicated with the liquid mixing cavity. A liquid medium flows between the flow channel and the liquid mixing cavity.

Abstract: An electronic device system, a manufacturing method, and a method for controlling the electronic device system, in field of heat dissipation technologies. The electronic device system includes a heat source, a plurality of fans, and a plurality of air guiding apparatuses. The heat source is located on air inlet sides of the plurality of fans, and the plurality of air guiding apparatuses are located on air outlet sides of the plurality of fans. The plurality of air guiding apparatuses are configured such that, when there is a faulty fan, an air guiding direction of an air guiding apparatus corresponding to the faulty fan and an air guiding direction of an air guiding apparatus corresponding to a neighboring fan deviate from each other.

Abstract: An air deflection plug-in unit includes a housing and a flow guiding structure. The housing is provided with a first air intake vent and a first air exhaust vent, and there is an included angle between planes on which the first air intake vent and the first air exhaust vent are located. The flow guiding structure is located in the housing. The flow guiding structure is configured to guide an airflow flowing into the first air intake vent to the first air exhaust vent. This disclosure can improve a heat dissipation capability of an electronic component.

Abstract: An electronic device system, a manufacturing method, and a method for controlling the electronic device system, in field of heat dissipation technologies. The electronic device system includes a heat source, a plurality of fans, and a plurality of air guiding apparatuses. The heat source is located on air inlet sides of the plurality of fans, and the plurality of air guiding apparatuses are located on air outlet sides of the plurality of fans. The plurality of air guiding apparatuses are configured such that, when there is a faulty fan, an air guiding direction of an air guiding apparatus corresponding to the faulty fan and an air guiding direction of an air guiding apparatus corresponding to a neighboring fan deviate from each other.