Abstract: Wedged lamella can be prepared by milling multiple sample slices from at least one side of a sample. The milling is monitored based on an SEM image acquired after removing one or more of the sample slices. The milling may be terminated responsive to an estimated distance between a first structure and a second structure along the height of the milled sample not greater than a threshold distance.

Abstract: Methods and apparatus are disclosed for determining a distance from a cut face of an active sample to a target plane, using data acquired from a reference sample. The active and reference samples have congruent structure, allowing reference data to be used as an index. An SEM image of the cut face is compared with the reference data to determine position within the active sample, and thereby the remaining distance to the target plane. The technique can be applied repeatedly between phases of ion beam milling until an endpoint at the target plane is reached. Consistent, accurate endpointing is achieved. The technique is suitable for preparing 5-100 nm thick lamella for TEM analysis of electronic circuits and can be used in a wide range of applications. Variations are disclosed.

Abstract: Methods and systems for generating high resolution reconstructions of 3D samples imaged using slice and view processes where the electron interaction depth of the imaging beam is greater than slice thicknesses. Data obtained via such slice and view processes is enhanced with a depth blur reducing algorithm, that is configured to reduce depth blur caused by portions of the first data and second data that are resultant from electron interactions outside the first layer and second layer, respectively, to create enhanced first data and second enhanced data. A high-resolution 3D reconstruction of the sample is then generated using the enhanced first data and the enhanced second data. In some embodiments, the depth blur reducing algorithm may be selected from a set of such algorithms that have been individually configured for certain microscope conditions, sample conditions, or a combination thereof.

Abstract: Methods and systems include acquiring instances of data relating to multiple layers of a sample obtained via slice and view imaging where the electron interaction depth of the charged particle beam during each irradiation of the sample is larger than the thickness of the first layer and/or the thickness of the second layer. A simulated model is then accessed that identifies a plurality of yield values that identify expected portions/ratios of detected emissions that are expected to be generated by material in corresponding layers/depths of the sample. The yield values are used to segregate the instances of data into component portions based on the particular layer of the sample in which the structures expected to have generated the associated emissions are located. The component portions are then used to create reconstructions of individual layers and/or 3D reconstructions of the sample with reduced depth blur.

Abstract: Apparatuses and methods for aligning lamella to charged particle beams based on a volume reconstruction are disclosed herein. An example method at least includes forming a reconstructed volume of a portion of a sample, the sample including a plurality of structures, and the reconstructed volume including a portion of the plurality of structures, performing, over a range of angles, a mathematical transform on each plane of a plurality of planes of the reconstructed volume, and based on the mathematical transform on each plane of the plurality of planes, determining a target orientation of the sample within the range of angles, wherein the target orientation aligns the plurality of structures parallel to an optical axis of a charged particle beam.