Abstract: An integrated circuit (IC) device includes a substrate with a power control circuit, front and back side metal layers, and first and second feed through vias (FTVs). The front side metal layer has first and second front side power rails. The back side metal layer has first and second back side power rails. The first FTV extends through the substrate, and couples the first front side power rail to the first back side power rail. The second FTV extends through the substrate, and couples the second front side power rail to the second back side power rail. The power control circuit is coupled to the first and second front side power rails, and is controllable to electrically connect the first front side power rail to the second front side power rail, or electrically disconnect the first front side power rail from the second front side power rail.

Abstract: A method includes fabricating at least one circuit over a substrate having opposite front and back sides, fabricating a front side redistribution structure on the front side of the substrate, fabricating feed through vias (FTVs) extending through the substrate, and fabricating a back side redistribution structure on the back side of the substrate. A front side metal layer in the front side redistribution structure has a first front side power rail coupled to a first source/drain of a transistor of the at least one circuit, and a second front side power rail coupled to a second source/drain of the transistor. The FTVs include first and second FTVs correspondingly coupled to the first and second front side power rails. A back side metal layer in the back side redistribution structure includes first and second back side power rails correspondingly coupled to the first and second FTVs.

Abstract: An integrated circuit (IC) device includes a substrate with a power control circuit, front and back side metal layers, and first and second feed through vias (FTVs). The front side metal layer has first and second front side power rails. The back side metal layer has first and second back side power rails. The first FTV extends through the substrate, and couples the first front side power rail to the first back side power rail. The second FTV extends through the substrate, and couples the second front side power rail to the second back side power rail. The power control circuit is coupled to the first and second front side power rails, and is controllable to electrically connect the first front side power rail to the second front side power rail, or electrically disconnect the first front side power rail from the second front side power rail.