Abstract: A method for connecting a film (102) to a substrate (101) includes providing (402) a film (102) and a substrate (101), bringing (403) the film (102) and the substrate (101) together, applying (404) at least one clamping force in at least one clamping region (201), in which the clamping force acts to establish a contact of the film (102) with the substrate (101), and heating (405) the film (102) and/or substrate (101) in at least a respective connecting region (103) in which the film (102) and the substrate (101) are connected together. The clamping force is maintained during the heating process, yet the film (102) and the substrate (101) can be moved relative to one another in the clamping region (201).

Abstract: A contact arrangement. The contact arrangement has at least one electrically conductive substrate, in particular a circuit carrier. The contact arrangement also has a flexible circuit board having at least one reversibly bendable, electrically insulating film and at least one or only one electrically conductive layer. The electrically conductive layer is electrically conductively connected to the substrate. The contact arrangement has an electrically conductive connecting element, which is arranged on the electrically conductive layer of the flexible circuit board so that the connecting element and the substrate enclose the flexible circuit board between them. The connecting element is welded to the electrically conductive layer of the flexible circuit board and to the substrate such that a welded connection extends from the connecting element through the electrically conductive layer of the flexible circuit board, in particular transversely to a flat extent of the flexible circuit board, into the substrate.

Abstract: A method for welding a flexible film (10) to a carrier component (20) having the following steps: 1) pressing the film (10) on the carrier component (20) by a volumetric flow of a fluid, and 2) laser welding the film (10) on the carrier component (20).

Abstract: A method for connecting a film (102) to a substrate (101) includes providing (402) a film (102) and a substrate (101), bringing (403) the film (102) and the substrate (101) together, applying (404) at least one clamping force in at least one clamping region (201), in which the clamping force acts to establish a contact of the film (102) with the substrate (101), and heating (405) the film (102) and/or substrate (101) in at least a respective connecting region (103) in which the film (102) and the substrate (101) are connected together. The clamping force is maintained during the heating process, yet the film (102) and the substrate (101) can be moved relative to one another in the clamping region (201).

Abstract: A production method for welding a copper conductor to an electrical contact element of a workpiece for electrical contacting. The contact element has a first copper alloy, and the method has the following method steps: mechanical contacting between the copper conductor and the contact element at a join of the contact element, the welding of the copper conductor to the contact element being carried out with the aid of a focused laser beam, the laser beam having a wavelength of less than or equal to 0.6 ?m, and a welded seam is produced which has a welding depth that is greater than or equal to 100 ?m.

Abstract: A method for welding a flexible film (10) to a carrier component (20) having the following steps: 1) pressing the film (10) on the carrier component (20) by a volumetric flow of a fluid, and 2) laser welding the film (10) on the carrier component (20).