Abstract: A method for connecting a film (102) to a substrate (101) includes providing (402) a film (102) and a substrate (101), bringing (403) the film (102) and the substrate (101) together, applying (404) at least one clamping force in at least one clamping region (201), in which the clamping force acts to establish a contact of the film (102) with the substrate (101), and heating (405) the film (102) and/or substrate (101) in at least a respective connecting region (103) in which the film (102) and the substrate (101) are connected together. The clamping force is maintained during the heating process, yet the film (102) and the substrate (101) can be moved relative to one another in the clamping region (201).

Abstract: A production method for welding a copper conductor to an electrical contact element of a workpiece for electrical contacting. The contact element has a first copper alloy, and the method has the following method steps: mechanical contacting between the copper conductor and the contact element at a join of the contact element, the welding of the copper conductor to the contact element being carried out with the aid of a focused laser beam, the laser beam having a wavelength of less than or equal to 0.6 ?m, and a welded seam is produced which has a welding depth that is greater than or equal to 100 ?m.

Abstract: A method for welding a flexible film (10) to a carrier component (20) having the following steps: 1) pressing the film (10) on the carrier component (20) by a volumetric flow of a fluid, and 2) laser welding the film (10) on the carrier component (20).