Patents by Inventor Lukas HERRES

Lukas HERRES has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Forming Through Hole in Component Carrier by Laser Drilling Blind Hole and Extending the Latter by Etching
    Publication number: 20230085035
    Abstract: A method of manufacturing a component carrier includes laser drilling a blind hole in a layer stack, and subsequently extending the blind hole to a through hole by etching. A component carrier includes an electrically insulating layer structure, an electrically conductive layer structure directly on an electrically insulating layer structure, and a tapering through hole extending through the electrically conductive layer structure and through the electrically insulating layer structure with a lateral overhang of the electrically conductive layer structure beyond the electrically insulating layer structure at the tapering through hole of not more than 20% of a maximum diameter of the tapering through hole.
    Type: Application
    Filed: September 16, 2022
    Publication date: March 16, 2023
    Inventors: Abderrazzaq IFIS, Jens RIEDLER, Lukas HERRES, Felix SKRIVANEK, Julia PLATZER