Abstract: An electronic device comprising a cover plate is disclosed. The cover plate comprises one or more sapphire layers, wherein at least one of the layers has a low level of inclusions.

Abstract: Automatic winding of a wire field in a wire slicing machine is disclosed. In one embodiment, a wire field is automatically generated in a wire slicing machine by unloading wire from at least one wire spool and winding the wire about one or more wire guides to form the wire field.

Abstract: Automatic winding of a wire field in a wire slicing machine is disclosed. In one embodiment, a wire field is automatically generated in a wire slicing machine by unloading wire from at least one wire spool and winding the wire about one or more wire guides to form the wire field.

Abstract: Methods for cylindrical grinding a workpiece are disclosed. The method includes cylindrical grinding, with a bonded abrasive wheel having a permeable structure that includes interconnected porosity, a workpiece at a specific cutting energy of less than about 12 Hp/in3·min (29.7 J/mm3), and a material removal rate of at least about 1 in3/min·in (10.8 mm3/sec/mm)grinding. The bonded abrasive wheel may include at least about 3 volume percent of a filamentary sol-gel alpha-alumina abrasive grain having an average length-to-cross-sectional-width ratio of greater than about 4:1, or agglomerates thereof. In one embodiment, the workpiece is ground in the presence of a water soluble oil.

Abstract: A wire slicing system and method for using it include one or more of the following features: arrangements and/or operations that relate to handling the wire; apparatus and methods that relate to wire tensioning; equipment and techniques for manipulating the workpiece; arrangements and/or operations designed for cooling and swarf (debris) removal; controls and/or automation that can be used in conjunction with these features.

Abstract: Methods for cylindrical grinding a workpiece are disclosed. The method includes cylindrical grinding, with a bonded abrasive wheel having a permeable structure that includes interconnected porosity, a workpiece at a specific cutting energy of less than about 12 Hp/in3·min (29.7 J/mm3), and a material removal rate of at least about 1 in3/min·in (10.8 mm3/sec/mm)grinding. The bonded abrasive wheel may include at least about 3 volume percent of a filamentary sol-gel alpha-alumina abrasive grain having an average length-to-cross-sectional-width ratio of greater than about 4:1, or agglomerates thereof. In one embodiment, the workpiece is ground in the presence of a water soluble oil.