Abstract: A crushing method for galvanic cells with high energy densities in which mixture of used cells is placed inside an insulated container and carbon dioxide as dry ice is added to this mixture as a cooling medium. Dry ice is added to the mixture of used galvanic cells at a volumetric ration of 0.5:1 to 2:1. The mixture of used cells with dry ice is cooled down from ?20° C. to ?50° C. and is subsequently fed to the crushing device and subjected to crushing. A stream of used galvanic cells and a stream of dry ice granules are preferably fed simultaneously to the insulated container of the crushing device, and this mixture is forwarded to the working part of the crushing device. At the end of galvanic cell crushing, the mixture of air and gaseous carbon dioxide is returned to the insulated container.

Abstract: Several embodiments of cleaning systems using polyelectrolyte and various associated methods for cleaning microelectronic substrates are disclosed herein. One embodiment is directed to a system that has a substrate support for holding the microelectronic substrate, a dispenser positioned above the substrate support and facing a surface of the microelectronic substrate, a reservoir in fluid communication with the dispenser via a conduit, and a washing solution contained in the reservoir. The washing solution includes a polyelectrolyte.

Abstract: Several embodiments of cleaning systems using polyelectrolyte and various associated methods for cleaning microelectronic substrates are disclosed herein. One embodiment is directed to a system that has a substrate support for holding the microelectronic substrate, a dispenser positioned above the substrate support and facing a surface of the microelectronic substrate, a reservoir in fluid communication with the dispenser via a conduit, and a washing solution contained in the reservoir. The washing solution includes a polyelectrolyte.

Abstract: Several embodiments of cleaning systems using polyelectrolyte and various associated methods for cleaning microelectronic substrates are disclosed herein. One embodiment is directed to a system that has a substrate support for holding the microelectronic substrate, a dispenser positioned above the substrate support and facing a surface of the microelectronic substrate, a reservoir in fluid communication with the dispenser via a conduit, and a washing solution contained in the reservoir. The washing solution includes a polyelectrolyte.