Patents by Inventor Lukasz Jerzy Macht
Lukasz Jerzy Macht has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11181828Abstract: Techniques for determining a value of a parameter of interest of a patterning process are described. One such technique involves obtaining a plurality of calibration data units from one or more targets in a metrology process. Each calibration data unit of at least two of the calibration data units represents detected radiation obtained using different respective polarization settings in the metrology process, each polarization setting defining a polarization property of incident radiation of the metrology process and of detected radiation of the metrology process. The calibration data units are used to obtain calibration information about the metrology process. A measurement data unit representing detected radiation scattered from a further target is obtained, the further target having a structure formed using the patterning process on the substrate or on a further substrate. A value of the parameter of interest is determined using the measurement data unit and the obtained calibration information.Type: GrantFiled: October 15, 2019Date of Patent: November 23, 2021Assignee: ASML Netherlands B.V.Inventors: Patrick Warnaar, Hilko Dirk Bos, Hendrik Jan Hidde Smilde, Mohammadreza Hajiahmadi, Lukasz Jerzy Macht, Karel Hendrik Wouter Van Den Bos, Sergei Sokolov, Lucas Tijn Kunneman
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Patent number: 11022892Abstract: An inspection apparatus (140) measures asymmetry or other property of target structures (T) formed by a lithographic process on a substrate. For a given set of illumination conditions, accuracy of said measurement is influenced strongly by process variations across the substrate and/or between substrates. The apparatus is arranged to collect radiation scattered by a plurality of structures under two or more variants of said illumination conditions (p1?, p1, p1+; ?1?, ?1, ?1+). A processing system (PU) is arranged to derive the measurement of said property using radiation collected under a different selection or combination of said variants for different ones of said structures. The variants may be for example in wavelength, or in angular distribution, or in any characteristic of the illumination conditions. Selection and/or combination of variants is made with reference to a signal quality (302, Q, A) observed in the different variants.Type: GrantFiled: October 30, 2019Date of Patent: June 1, 2021Assignee: ASML Netherlands B.V.Inventors: Patrick Warnaar, Simon Philip Spencer Hastings, Alberto Da Costa Assafrao, Lukasz Jerzy Macht
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Publication number: 20200133140Abstract: Techniques for determining a value of a parameter of interest of a patterning process are described. One such technique involves obtaining a plurality of calibration data units from one or more targets in a metrology process. Each calibration data unit of at least two of the calibration data units represents detected radiation obtained using different respective polarization settings in the metrology process, each polarization setting defining a polarization property of incident radiation of the metrology process and of detected radiation of the metrology process. The calibration data units are used to obtain calibration information about the metrology process. A measurement data unit representing detected radiation scattered from a further target is obtained, the further target having a structure formed using the patterning process on the substrate or on a further substrate. A value of the parameter of interest is determined using the measurement data unit and the obtained calibration information.Type: ApplicationFiled: October 15, 2019Publication date: April 30, 2020Applicant: ASML NETHERLANDS B.V.Inventors: Patrick WARNAAR, Hilko Dirk BOS, Hendrik Jan Hidde SMILDE, Mohammadreza HAJIAHMADI, Lukasz Jerzy MACHT, Karel Hendrik Wouter VAN DEN BOS, Sergei SOKOLOV, Lucas Tijn KUNNEMAN
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Publication number: 20200064744Abstract: An inspection apparatus (140) measures asymmetry or other property of target structures (T) formed by a lithographic process on a substrate. For a given set of illumination conditions, accuracy of said measurement is influenced strongly by process variations across the substrate and/or between substrates. The apparatus is arranged to collect radiation scattered by a plurality of structures under two or more variants of said illumination conditions (p1?, p1, p1+; ?1?, ?1, ?1+). A processing system (PU) is arranged to derive the measurement of said property using radiation collected under a different selection or combination of said variants for different ones of said structures. The variants may be for example in wavelength, or in angular distribution, or in any characteristic of the illumination conditions. Selection and/or combination of variants is made with reference to a signal quality (302, Q, A) observed in the different variants.Type: ApplicationFiled: October 30, 2019Publication date: February 27, 2020Applicant: ASML Netherlands B.V.Inventors: Patrick WARNAAR, Simon Philip Spencer Hastings, Alberto Da Costa Assafrao, Lukasz Jerzy MACHT
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Publication number: 20200050114Abstract: An overlay metrology target (600, 900, 1000) contains a plurality of overlay gratings (932-935) formed by lithography. First diffraction signals (740(1)) are obtained from the target, and first asymmetry values (As) for the target structures are derived. Second diffraction signals (740(2)) are obtained from the target, and second asymmetry values (As?) are derived. The first and second diffraction signals are obtained using different capture conditions and/or different designs of target structures and/or bias values. The first asymmetry signals and the second asymmetry signals are used to solve equations and obtain a measurement of overlay error. The calculation of overlay error makes no assumption whether asymmetry in a given target structure results from overlay in the first direction, in a second direction or in both directions. With a suitable bias scheme the method allows overlay and other asymmetry-related properties to be measured accurately, even in the presence of two-dimensional overlay structure.Type: ApplicationFiled: October 17, 2019Publication date: February 13, 2020Applicant: ASML Netherlands B.V.Inventors: Murat Bozkurt, Maurits Van Der Schaar, Patrick Warnaar, Martin Jacobus Johan Jak, Mohammadreza Hajiahmadi, Grzegorz Grzela, Lukasz Jerzy Macht
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Patent number: 10481506Abstract: An overlay metrology target (600, 900, 1000) contains a plurality of overlay gratings (932-935) formed by lithography. First diffraction signals (740(1)) are obtained from the target, and first asymmetry values (As) for the target structures are derived. Second diffraction signals (740(2)) are obtained from the target, and second asymmetry values (As?) are derived. The first and second diffraction signals are obtained using different capture conditions and/or different designs of target structures and/or bias values. The first asymmetry signals and the second asymmetry signals are used to solve equations and obtain a measurement of overlay error. The calculation of overlay error makes no assumption whether asymmetry in a given target structure results from overlay in the first direction, in a second direction or in both directions. With a suitable bias scheme the method allows overlay and other asymmetry-related properties to be measured accurately, even in the presence of two-dimensional overlay structure.Type: GrantFiled: May 1, 2018Date of Patent: November 19, 2019Assignee: ASML Netherlands B.V.Inventors: Murat Bozkurt, Maurits Van Der Schaar, Patrick Warnaar, Martin Jacobus Johan Jak, Mohammadreza Hajiahmadi, Grzegorz Grzela, Lukasz Jerzy Macht
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Patent number: 10466594Abstract: An inspection apparatus (140) measures asymmetry or other property of target structures (T) formed by a lithographic process on a substrate. For a given set of illumination conditions, accuracy of said measurement is influenced strongly by process variations across the substrate and/or between substrates. The apparatus is arranged to collect radiation scattered by a plurality of structures under two or more variants of said illumination conditions (p1?, p1, p1+; ?1?, ?1, ?1+). A processing system (PU) is arranged to derive the measurement of said property using radiation collected under a different selection or combination of said variants for different ones of said structures. The variants may be for example in wavelength, or in angular distribution, or in any characteristic of the illumination conditions. Selection and/or combination of variants is made with reference to a signal quality (302, Q, A) observed in the different variants.Type: GrantFiled: February 21, 2017Date of Patent: November 5, 2019Assignee: ASML Netherlands B.V.Inventors: Patrick Warnaar, Simon Philip Spencer Hastings, Alberto Da Costa Assafrao, Lukasz Jerzy Macht
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Publication number: 20180321599Abstract: An overlay metrology target (600, 900, 1000) contains a plurality of overlay gratings (932-935) formed by lithography. First diffraction signals (740(1)) are obtained from the target, and first asymmetry values (As) for the target structures are derived. Second diffraction signals (740(2)) are obtained from the target, and second asymmetry values (As?) are derived. The first and second diffraction signals are obtained using different capture conditions and/or different designs of target structures and/or bias values. The first asymmetry signals and the second asymmetry signals are used to solve equations and obtain a measurement of overlay error. The calculation of overlay error makes no assumption whether asymmetry in a given target structure results from overlay in the first direction, in a second direction or in both directions. With a suitable bias scheme the method allows overlay and other asymmetry-related properties to be measured accurately, even in the presence of two-dimensional overlay structure.Type: ApplicationFiled: May 1, 2018Publication date: November 8, 2018Applicant: ASML Netherlands B.V.Inventors: Murat BOZKURT, Maurits Van Der Schaar, Patrick Warnaar, Martin Jacobus Johan Jak, Mohammadreza Hajiahmadi, Grzegorz Grzela, Lukasz Jerzy Macht
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Publication number: 20170248852Abstract: An inspection apparatus (140) measures asymmetry or other property of target structures (T) formed by a lithographic process on a substrate. For a given set of illumination conditions, accuracy of said measurement is influenced strongly by process variations across the substrate and/or between substrates. The apparatus is arranged to collect radiation scattered by a plurality of structures under two or more variants of said illumination conditions (p1?, p1, p1+; ?1?, ?1, ?1+). A processing system (PU) is arranged to derive the measurement of said property using radiation collected under a different selection or combination of said variants for different ones of said structures. The variants may be for example in wavelength, or in angular distribution, or in any characteristic of the illumination conditions. Selection and/or combination of variants is made with reference to a signal quality (302, Q, A) observed in the different variants.Type: ApplicationFiled: February 21, 2017Publication date: August 31, 2017Applicant: ASML Netherlands B.V.Inventors: Patrick WARNAAR, Simon Philip Spencer HASTINGS, Alberto DA COSTA ASSAFRAO, Lukasz Jerzy MACHT
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Patent number: 9696638Abstract: A lithographic apparatus including a substrate table position measurement system and a projection system position measurement system to measure a position of the substrate table and the projection system, respectively. The substrate table position measurement system includes a substrate table reference element mounted on the substrate table and a first sensor head. The substrate table reference element extends in a measurement plane substantially parallel to the holding plane of a substrate on substrate table. The holding plane is arranged at one side of the measurement plane and the first sensor head is arranged at an opposite side of the measurement plane. The projection system position measurement system includes one or more projection system reference elements and a sensor assembly. The sensor head and the sensor assembly or the associated projection system measurement elements are mounted on a sensor frame.Type: GrantFiled: December 10, 2015Date of Patent: July 4, 2017Assignee: ASML NETHERLANDS B.V.Inventors: Engelbertus Antonius Fransiscus Van Der Pasch, Joost Jeroen Ottens, Emiel Jozef Melanie Eussen, Johannes Henricus Wilhelmus Jacobs, William Peter Van Drent, Frank Staals, Lukasz Jerzy Macht, Erik Willem Bogaart
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Patent number: 9488465Abstract: The invention provides a level sensor configured to determine a height level of a surface of a substrate, comprising a detection unit arranged to receive a measurement beam after reflection on the substrate, wherein the detection unit comprises an array of detection elements, wherein each detection element is arranged to receive a part of the measurement beam reflected on a measurement subarea of the measurement area, and is configured to provide a measurement signal based on the part of the measurement beam received by the respective detection element, and wherein the processing unit is configured to calculate, in dependence of a selected resolution at the measurement subarea, a height level of the measurement subarea, or to calculate a height level of a combination of multiple measurement subareas.Type: GrantFiled: November 16, 2012Date of Patent: November 8, 2016Assignee: ASML Netherlands B.VInventors: Laurent Khuat Duy, Martinus Cornelis Reijnen, Lukasz Jerzy Macht, Erik Johan Koop
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Publication number: 20160109812Abstract: A lithographic apparatus including a substrate table position measurement system and a projection system position measurement system to measure a position of the substrate table and the projection system, respectively. The substrate table position measurement system includes a substrate table reference element mounted on the substrate table and a first sensor head. The substrate table reference element extends in a measurement plane substantially parallel to the holding plane of a substrate on substrate table. The holding plane is arranged at one side of the measurement plane and the first sensor head is arranged at an opposite side of the measurement plane. The projection system position measurement system includes one or more projection system reference elements and a sensor assembly. The sensor head and the sensor assembly or the associated projection system measurement elements are mounted on a sensor frame.Type: ApplicationFiled: December 10, 2015Publication date: April 21, 2016Applicant: ASML NETHERLANDS B.V.Inventors: Engelbertus Antonius Fransiscus VAN DER PASCH, Joost Jeroen OTTENS, Emiel Jozef Melanie EUSSEN, Johannes Henricus Wilhelmus JACOBS, William Peter VAN DRENT, Frank STAALS, Lukasz Jerzy MACHT, Erik Willem BOGAART
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Patent number: 9229340Abstract: A lithographic apparatus including a substrate table position measurement system and a projection system position measurement system to measure a position of the substrate table and the projection system, respectively. The substrate table position measurement system includes a substrate table reference element mounted on the substrate table and a first sensor head. The substrate table reference element extends in a measurement plane substantially parallel to the holding plane of a substrate on substrate table. The holding plane is arranged at one side of the measurement plane and the first sensor head is arranged at an opposite side of the measurement plane. The projection system position measurement system includes one or more projection system reference elements and a sensor assembly. The sensor head and the sensor assembly or the associated projection system measurement elements are mounted on a sensor frame.Type: GrantFiled: September 25, 2013Date of Patent: January 5, 2016Assignee: ASML NETHERLANDS B.V.Inventors: Engelbertus Antonius Fransiscus Van Der Pasch, Joost Jeroen Ottens, Emiel Jozef Melanie Eussen, Johannes Henricus Wilhelmus Jacobs, William Peter Van Drent, Frank Staals, Lukasz Jerzy Macht, Erik Willem Bogaart
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Patent number: 8842293Abstract: A level sensor arrangement is useable for measuring a height of a surface of a substrate in a lithographic apparatus. The level sensor arrangement is provided with a light source emitting detection radiation towards the substrate, and a detector unit for measuring radiation reflected from the substrate in operation. The light source is arranged to emit detection radiation in a wavelength range in which a resist to be used for processing the substrate in the lithographic apparatus is sensitive.Type: GrantFiled: March 12, 2010Date of Patent: September 23, 2014Assignee: ASML Netherlands B.V.Inventors: Arie Jeffrey Den Boef, Jozef Petrus Henricus Benschop, Ralph Brinkhof, Lukasz Jerzy Macht
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Patent number: 8675210Abstract: A level sensor for measuring a position of a surface of a substrate includes a projection unit including an emitter for emitting a radiation beam towards the substrate and a projection grating including a measurement grating and an aperture, such that the radiation beam incident on the projection grating is divided into a measurement radiation beam and a capture radiation beam. The level sensor further includes a detection unit including a first and second measurement detector, a first and second capture detector, a detection grating, and a first and second optical unit. The detection grating includes a ruled grating with multiple rules, which direct radiation towards the first and second measurement detector via the first and second optical unit, and a capture element directing radiation towards the first and second capture detector via the first and second optical unit.Type: GrantFiled: September 4, 2012Date of Patent: March 18, 2014Assignee: ASML Netherlands B.V.Inventors: Arie Jeffrey Den Boef, Jozef Petrus Henricus Benschop, Ralph Brinkhof, Willem Jurrianus Venema, Lukasz Jerzy Macht, Laurent Khuat Duy, Dimitra Sarri
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Publication number: 20140022527Abstract: A lithographic apparatus including a substrate table position measurement system and a projection system position measurement system to measure a position of the substrate table and the projection system, respectively. The substrate table position measurement system includes a substrate table reference element mounted on the substrate table and a first sensor head. The substrate table reference element extends in a measurement plane substantially parallel to the holding plane of a substrate on substrate table. The holding plane is arranged at one side of the measurement plane and the first sensor head is arranged at an opposite side of the measurement plane. The projection system position measurement system includes one or more projection system reference elements and a sensor assembly. The sensor head and the sensor assembly or the associated projection system measurement elements are mounted on a sensor frame.Type: ApplicationFiled: September 25, 2013Publication date: January 23, 2014Applicant: ASML NETHERLANDS B.V.Inventors: Engelbertus Antonius Fransiscus VAN DER PASCH, Joost Jeroen Ottens, Emiel Jozef Melanie Eussen, Johannes Henricus Wilhelmus Jacobs, William Peter Van Drent, Frank Staals, Lukasz Jerzy Macht, Erik Willem Bogaart
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Patent number: 8570492Abstract: A lithographic apparatus including a substrate table position measurement system and a projection system position measurement system to measure a position of the substrate table and the projection system, respectively. The substrate table position measurement system includes a substrate table reference element mounted on the substrate table and a first sensor head. The substrate table reference element extends in a measurement plane substantially parallel to the holding plane of a substrate on substrate table. The holding plane is arranged at one side of the measurement plane and the first sensor head is arranged at an opposite side of the measurement plane. The projection system position measurement system includes one or more projection system reference elements and a sensor assembly. The sensor head and the sensor assembly or the associated projection system measurement elements are mounted on a sensor frame.Type: GrantFiled: March 7, 2012Date of Patent: October 29, 2013Assignee: ASML Netherlands B.V.Inventors: Engelbertus Antonius Fransiscus Van Der Pasch, Emiel Jozef Melanie Eussen, Johannes Henricus Wilhelmus Jacobs, Joost Jeroen Ottens, Frank Staals, Lukasz Jerzy Macht, William Peter Van Drent, Erik Willem Bogaart
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Patent number: 8488107Abstract: The invention provides a level sensor configured to determine a height level of a surface of a substrate supported on a movable substrate support, the level sensor including multiple projection units, multiple detection units, and a processing unit to calculate a height level for each of a plurality of measurement locations on the basis of the measurement beams from the projection units, wherein the level sensor is configured to measure height levels simultaneously at multiple measurement locations on the substrate, wherein the substrate support is configured to move the substrate in a first direction substantially parallel to the surface of the substrate to measure a height level at different locations on the substrate, and wherein at least part of the multiple measurement locations are at least spaced in a second direction that is substantially parallel to the surface of the substrate and perpendicular to the first direction.Type: GrantFiled: July 8, 2011Date of Patent: July 16, 2013Assignee: ASML Netherlands B.V.Inventors: Arie Jeffrey Den Boef, Frank Staals, Lukasz Jerzy Macht
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Publication number: 20130077079Abstract: A level sensor for measuring a position of a surface of a substrate includes a projection unit including an emitter for emitting a radiation beam towards the substrate and a projection grating including a measurement grating and an aperture, such that the radiation beam incident on the projection grating is divided into a measurement radiation beam and a capture radiation beam. The level sensor further includes a detection unit including a first and second measurement detector, a first and second capture detector, a detection grating, and a first and second optical unit. The detection grating includes a ruled grating with multiple rules, which direct radiation towards the first and second measurement detector via the first and second optical unit, and a capture element directing radiation towards the first and second capture detector via the first and second optical unit.Type: ApplicationFiled: September 4, 2012Publication date: March 28, 2013Applicant: ASML NETHERLANDS B.V.Inventors: Arie Jeffrey DEN BOEF, Jozef Petrus Henricus Benschop, Ralph Brinkhof, Willem Jurrianus Venema, Lukasz Jerzy Macht, Laurent Khuat Duy, Dimitra Sarri
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Publication number: 20120242969Abstract: A lithographic apparatus including a substrate table position measurement system and a projection system position measurement system to measure a position of the substrate table and the projection system, respectively. The substrate table position measurement system includes a substrate table reference element mounted on the substrate table and a first sensor head. The substrate table reference element extends in a measurement plane substantially parallel to the holding plane of a substrate on substrate table. The holding plane is arranged at one side of the measurement plane and the first sensor head is arranged at an opposite side of the measurement plane. The projection system position measurement system includes one or more projection system reference elements and a sensor assembly. The sensor head and the sensor assembly or the associated projection system measurement elements are mounted on a sensor frame.Type: ApplicationFiled: March 7, 2012Publication date: September 27, 2012Applicant: ASML NETHERLANDS B.V.Inventors: Engelbertus Antonius Fransiscus VAN DER PASCH, Emiel Jozef Melanie Eussen, Johannes Henricus Wilhelmus Jacobs, Joost Jeroen Ottens, Frank Staals, Lukasz Jerzy Macht, William Peter Van Drent, Erik Willem Bogaart