Abstract: A retainer device which connects to a printed circuit board (PCB) to provide added structural rigidity to a capacitor (or other electrical component) mounted to the PCB. The retainer device is able to provide increased durability of capacitor leads against vibrational fatigue. The retainer device is designed to add structural rigidity to single or multiple capacitors soldered to a PCB. The retainer device exerts a positive force against the capacitor, pressing the capacitor against the PCB. This in turn limits the fatigue deflection of the capacitor leads. The retainer device has at least one spring retention ring, where the spring retention ring is able to apply force to the capacitor, which aids in ensuring that the capacitor is flush to the surface of the PCB, which reduces the load on the leads of the capacitor.

Abstract: An electronic control module which has a housing, a cavity formed as part of the housing, and a connector. The control module also includes a plurality of pins, and a portion of the housing is integrally formed around the pins such that a first end of each of the pins are part of the connector, and a second end of each of the pins is located in the cavity. The control module also has a cover with a large portion and a small portion. A sealant is disposed between part of the cover and the housing to provide a seal between the cover and the housing. The small portion of the cover is bendable relative to the large portion to allow an inspection of the pins after the pins are press-fitted into the circuit board as the cover is connected to the housing.

Abstract: A lead frame assembly which allows for the connection of multiple individual fixed components in various locations, while alleviating tolerance concerns by having a flexible lead frame. The lead frame assembly includes several sub-lead frames, and a plurality of interconnects which connect each of the sub-lead frames together. The lead frame assembly also includes a plurality of segments, and each segment surrounds one of the sub-lead frames, to electrically isolate each sub-lead frame. Various components are electrically connected by incorporating stamped receptacles, or slot terminals, in the sub-lead frames. The interconnects along with plastic voids allow the various attached components to have tolerance flexibility relative to one another, as various components are attached to each of the slot terminals.

Abstract: A lead frame assembly which allows for the connection of multiple individual fixed components in various locations, while alleviating tolerance concerns by having a flexible lead frame. The lead frame assembly includes several sub-lead frames, and a plurality of interconnects which connect each of the sub-lead frames together. The lead frame assembly also includes a plurality of segments, and each segment surrounds one of the sub-lead frames, to electrically isolate each sub-lead frame. Various components are electrically connected by incorporating stamped receptacles, or slot terminals, in the sub-lead frames. The interconnects along with plastic voids allow the various attached components to have tolerance flexibility relative to one another, as various components are attached to each of the slot terminals.