Patents by Inventor Luke Bonecutter

Luke Bonecutter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11443973
    Abstract: Exemplary substrate processing systems may include a transfer region housing defining a transfer region fluidly coupled with a plurality of processing regions. A sidewall of the transfer region housing may define a sealable access for providing and receiving substrates. The systems may include a plurality of substrate supports disposed within the transfer region. The systems may also include a transfer apparatus having a central hub including a first shaft and a second shaft counter-rotatable with the first shaft. The transfer apparatus may include an eccentric hub extending at least partially through the central hub, and which is radially offset from a central axis of the central hub. The transfer apparatus may also include an end effector coupled with the eccentric hub. The end effector may include a plurality of arms having a number of arms equal to the number of substrate supports of the plurality of substrate supports.
    Type: Grant
    Filed: July 7, 2020
    Date of Patent: September 13, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Jason M. Schaller, Luke Bonecutter, Charles T. Carlson, Rajkumar Thanu, Karuppasamy Muthukamatchi, Jeff Hudgens, Benjamin Riordon
  • Patent number: 11355367
    Abstract: Exemplary substrate processing systems may include a transfer region housing defining a transfer region, and including substrate supports and a transfer apparatus. The transfer apparatus may include a central hub having a housing, and including a first shaft and a second shaft. The housing may be coupled with the second shaft, and may define an internal housing volume. The transfer apparatus may include a plurality of arms equal to a number of substrate supports of the plurality of substrate supports. Each arm of the plurality of arms may be coupled about an exterior of the housing. The transfer apparatus may include a plurality of arm hubs disposed within the internal housing volume. Each arm hub of the plurality of arm hubs may be coupled with an arm of the plurality of arms through the housing. The arm hubs may be coupled with the first shaft of the central hub.
    Type: Grant
    Filed: July 7, 2020
    Date of Patent: June 7, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Jason M. Schaller, Charles T. Carlson, Luke Bonecutter, David Blahnik, Karuppasamy Muthukamatchi, Jeff Hudgens, Benjamin Riordon
  • Patent number: 11326256
    Abstract: Embodiments described herein relate to apparatus and techniques for mechanical isolation and thermal insulation in a process chamber. In one embodiment, an insulating layer is disposed between a dome assembly and a gas ring. The insulating layer is configured to maintain a temperature of the dome assembly and prevent thermal energy transfer from the dome assembly to the gas ring. The insulating layer provides mechanical isolation of the dome assembly from the gas ring. The insulating layer also provides thermal insulation between the dome assembly and the gas ring. The insulating layer may be fabricated from a polyimide containing material, which substantially reduces an occurrence of deformation of the insulating layer.
    Type: Grant
    Filed: November 21, 2019
    Date of Patent: May 10, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Luke Bonecutter, Yunzhe Yang, Rupankar Choudhury, Abhijit Kangude
  • Publication number: 20220093426
    Abstract: Exemplary substrate processing systems may include a base. The systems may include a chamber body having a transfer region housing that defines a transfer region. The transfer region housing may include a first portion and a second portion. The systems may include a lid assembly positioned atop the chamber body. The lid assembly may include a lid and a lid stack. The systems may include one or more lift mechanisms that elevate the first portion of the transfer region housing and at least a portion of the lid assembly relative to the base. The first portion and the second portion may mate with one another when the transfer region housing is in an operational configuration. The first portion and the second portion may be separated when the first portion of the transfer region housing is elevated.
    Type: Application
    Filed: September 21, 2020
    Publication date: March 24, 2022
    Applicant: Applied Materials, Inc.
    Inventors: Samuel W. Shannon, Luke Bonecutter, Viren Kalsekar, Chahal Neema
  • Patent number: 11227746
    Abstract: Embodiments described herein provide a backside gas delivery assembly that prevents inert gas from forming parasitic plasma. The backside gas delivery assembly includes a first gas channel disposed in a stem of a substrate support assembly. The substrate support assembly includes a substrate support having a second gas channel extending from the first gas channel. The backside gas delivery assembly further includes a porous plug disposed within the first gas channel positioned at an interface of the stem and the substrate support, a gas source connected to the first gas channel configured to deliver an inert gas to a backside surface of a substrate disposed on an upper surface of the substrate support, and a gas tube in the first gas channel extending to the porous plug positioned at the interface of the stem and the substrate support.
    Type: Grant
    Filed: February 20, 2019
    Date of Patent: January 18, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Luke Bonecutter, Abhijit Kangude
  • Patent number: 10984990
    Abstract: A plasma processing apparatus is provided including a radio frequency power source; a direct current power source; a chamber enclosing a process volume; and a substrate support assembly disposed in the process volume. The substrate support assembly includes a substrate support having a substrate supporting surface; an electrode disposed in the substrate support; and an interconnect assembly coupling the radio frequency power source and the direct current power source with the electrode.
    Type: Grant
    Filed: April 17, 2018
    Date of Patent: April 20, 2021
    Assignee: Applied Materials, Inc.
    Inventors: Ramesh Bokka, Jason M. Schaller, Jay D. Pinson, II, Luke Bonecutter
  • Publication number: 20210032748
    Abstract: Embodiments presented herein are directed to radio frequency (RF) grounding in process chambers. In one embodiment, a dielectric plate is disposed between a chamber body and a lid of a process chamber. The dielectric plate extends laterally into a volume defined by the chamber body and the lid. A substrate support is disposed in the volume opposite the lid. The substrate support includes a support body disposed on a stem. The support body includes a central region and a peripheral region. The peripheral region is radially outward of the central region. The central region has a thickness less than a thickness of the peripheral region. A flange is disposed adjacent to a bottom surface of the peripheral region. The flange extends radially outward from an outer edge of the peripheral region. A bellows is disposed on the flange and configured to sealingly couple to the dielectric plate.
    Type: Application
    Filed: July 29, 2020
    Publication date: February 4, 2021
    Inventors: Luke BONECUTTER, David BLAHNIK, Tuan Anh NGUYEN, Amit Kumar BANSAL
  • Publication number: 20210013068
    Abstract: Exemplary substrate processing systems may include a transfer region housing defining a transfer region, and including substrate supports and a transfer apparatus. The transfer apparatus may include a central hub having a housing, and including a first shaft and a second shaft. The housing may be coupled with the second shaft, and may define an internal housing volume. The transfer apparatus may include a plurality of arms equal to a number of substrate supports of the plurality of substrate supports. Each arm of the plurality of arms may be coupled about an exterior of the housing. The transfer apparatus may include a plurality of arm hubs disposed within the internal housing volume. Each arm hub of the plurality of arm hubs may be coupled with an arm of the plurality of arms through the housing. The arm hubs may be coupled with the first shaft of the central hub.
    Type: Application
    Filed: July 7, 2020
    Publication date: January 14, 2021
    Applicant: Applied Materials, Inc.
    Inventors: Jason M. Schaller, Charles T. Carlson, Luke Bonecutter, David Blahnik, Karuppasamy Muthukamatchi, Jeff Hudgens, Benjamin Riordon
  • Publication number: 20210013084
    Abstract: Exemplary substrate processing systems may include a transfer region housing defining a transfer region fluidly coupled with a plurality of processing regions. A sidewall of the transfer region housing may define a sealable access for providing and receiving substrates. The systems may include a plurality of substrate supports disposed within the transfer region. The systems may also include a transfer apparatus having a central hub including a first shaft and a second shaft counter-rotatable with the first shaft. The transfer apparatus may include an eccentric hub extending at least partially through the central hub, and which is radially offset from a central axis of the central hub. The transfer apparatus may also include an end effector coupled with the eccentric hub. The end effector may include a plurality of arms having a number of arms equal to the number of substrate supports of the plurality of substrate supports.
    Type: Application
    Filed: July 7, 2020
    Publication date: January 14, 2021
    Applicant: Applied Materials, Inc.
    Inventors: Jason M. Schaller, Luke Bonecutter, Charles T. Carlson, Rajkumar Thanu, Karuppasamy Muthukamatchi, Jeff Hudgens, Benjamin Riordon
  • Publication number: 20210013067
    Abstract: Exemplary substrate processing systems may include a transfer region housing defining an internal volume. A sidewall of the transfer region housing may define a sealable access for providing and receiving substrates. The systems may include a plurality of substrate supports disposed within the transfer region. The systems may also include a transfer apparatus having a central hub including a first shaft and a second shaft concentric with and counter-rotatable to the first shaft. The transfer apparatus may include a first end effector coupled with the first shaft. The first end effector may include a plurality of first arms. The transfer apparatus may also include a second end effector coupled with the second shaft. The second end effector may include a plurality of second arms having a number of second arms equal to the number of first arms of the first end effector.
    Type: Application
    Filed: July 7, 2020
    Publication date: January 14, 2021
    Applicant: Applied Materials, Inc.
    Inventors: Charles T. Carlson, Jason M. Schaller, Luke Bonecutter, David Blahnik
  • Publication number: 20200411283
    Abstract: Embodiments described herein provide a backside gas delivery assembly that prevents inert gas from forming parasitic plasma. The backside gas delivery assembly includes a first gas channel disposed in a stem of a substrate support assembly. The substrate support assembly includes a substrate support having a second gas channel extending from the first gas channel. The backside gas delivery assembly further includes a porous plug disposed within the first gas channel positioned at an interface of the stem and the substrate support, a gas source connected to the first gas channel configured to deliver an inert gas to a backside surface of a substrate disposed on an upper surface of the substrate support, and a gas tube in the first gas channel extending to the porous plug positioned at the interface of the stem and the substrate support.
    Type: Application
    Filed: February 20, 2019
    Publication date: December 31, 2020
    Inventors: Luke BONECUTTER, Abhijit KANGUDE
  • Publication number: 20200219698
    Abstract: Embodiments of the present disclosure generally relate to a semiconductor processing apparatus. More specifically, embodiments of the disclosure relate to generating and controlling plasma. A process chamber includes a chamber body that includes one or more chamber walls and defines a processing region. The process chamber also includes two or more inductively driven radio frequency (RF) coils in a concentric axial alignment, the RF coils arranged near the chamber walls to strike and sustain a plasma inside the chamber body, where at least two of the two or more RF coils are in a recursive configuration.
    Type: Application
    Filed: November 8, 2019
    Publication date: July 9, 2020
    Inventors: Zheng John YE, Abhijit KANGUDE, Luke BONECUTTER, Rupankar CHOUDHURY, Jay D. PINSON, II
  • Publication number: 20200181772
    Abstract: Embodiments described herein relate to apparatus and techniques for mechanical isolation and thermal insulation in a process chamber. In one embodiment, an insulating layer is disposed between a dome assembly and a gas ring. The insulating layer is configured to maintain a temperature of the dome assembly and prevent thermal energy transfer from the dome assembly to the gas ring. The insulating layer provides mechanical isolation of the dome assembly from the gas ring. The insulating layer also provides thermal insulation between the dome assembly and the gas ring. The insulating layer may be fabricated from a polyimide containing material, which substantially reduces an occurrence of deformation of the insulating layer.
    Type: Application
    Filed: November 21, 2019
    Publication date: June 11, 2020
    Inventors: Luke BONECUTTER, Yunzhe YANG, Rupankar CHOUDHURY, Abhijit KANGUDE
  • Publication number: 20190326138
    Abstract: Embodiments of the present disclosure generally provide apparatus and methods for cooling a substrate support. In one embodiment the present disclosure provides a cooling system for a substrate support. The cooling system includes a substrate support with cooling channels located within the substrate support, a heat exchanger fluidly coupled to the cooling channels, a compressor fluidly coupled to the heat exchanger, a cooling fluid supply source fluidly coupled to the cooling fluid system and a vacuum pump.
    Type: Application
    Filed: April 18, 2019
    Publication date: October 24, 2019
    Inventors: Paul F. FORDERHASE, Luke BONECUTTER, Jason M. SCHALLER
  • Publication number: 20180308669
    Abstract: A plasma processing apparatus is provided including a radio frequency power source; a direct current power source; a chamber enclosing a process volume; and a substrate support assembly disposed in the process volume. The substrate support assembly includes a substrate support having a substrate supporting surface; an electrode disposed in the substrate support; and an interconnect assembly coupling the radio frequency power source and the direct current power source with the electrode.
    Type: Application
    Filed: April 17, 2018
    Publication date: October 25, 2018
    Inventors: Ramesh BOKKA, Jason M. SCHALLER, Jay D. PINSON, II, Luke BONECUTTER
  • Patent number: 9145271
    Abstract: A system and method for the handling of workpieces in a workpiece processing system is disclosed. The system utilizes three conveyor belts, where one may be a loading belt, feeding unprocessed workpieces from its associated workpiece carrier to a processing system. A second conveyor belt may be an unloading belt, receiving processed workpieces from the processing system and filling its associated workpiece carrier. The third conveyor belt may be exchanging its workpiece carrier during this time, so that it is available to start operating as the loading belt once all of the workpieces have been removed from the workpiece carrier associated with the first conveyor belt.
    Type: Grant
    Filed: September 5, 2013
    Date of Patent: September 29, 2015
    Assignee: Varian Semiconductor Equipment Associates, Inc.
    Inventors: Robert Brent Vopat, Malcolm N. Daniel, Luke Bonecutter, Jason M. Schaller, Charles T. Carlson, William T. Weaver
  • Publication number: 20140169402
    Abstract: An ion implant apparatus configured to measure the temperature or monitor the degradation of components in the apparatus is provided. The ion implant apparatus may include a platen configured to move in a first direction, a mask frame to hold one or more masks disposed on the platen, a first optical sensor configured to project an optical beam to a second optical sensor, and a measurement bar disposed on the mask frame, the measurement bar raised above the surface of the mask frame to interrupt the optical beam when the platen moves in the first direction.
    Type: Application
    Filed: December 10, 2013
    Publication date: June 19, 2014
    Applicant: Varian Semiconductor Equipment Associates, Inc.
    Inventors: Aaron P. Webb, Benjamin B. Riordon, Charles T. Carlson, Christopher N. Grant, Luke Bonecutter, William T. Weaver
  • Publication number: 20140076688
    Abstract: A system and method for the handling of workpieces in a workpiece processing system is disclosed. The system utilizes three conveyor belts, where one may be a loading belt, feeding unprocessed workpieces from its associated workpiece carrier to a processing system. A second conveyor belt may be an unloading belt, receiving processed workpieces from the processing system and filling its associated workpiece carrier. The third conveyor belt may be exchanging its workpiece carrier during this time, so that it is available to start operating as the loading belt once all of the workpieces have been removed from the workpiece carrier associated with the first conveyor belt.
    Type: Application
    Filed: September 5, 2013
    Publication date: March 20, 2014
    Inventors: Robert Brent Vopat, Malcolm N. Daniel, Luke Bonecutter, Jason M. Schaller, Charles T. Carlson, William T. Weaver
  • Publication number: 20060250788
    Abstract: An adjustable downlight fixture includes an adjustable mounting for a light source. The adjustable mounting for the light source may be rotated about a substantially vertical axis and tilted about a substantially horizontal axis from underneath the adjustable downlight fixture without having to remove the adjustable downlight fixture from its mounting within the ceiling.
    Type: Application
    Filed: April 12, 2006
    Publication date: November 9, 2006
    Inventors: Michael Hodge, Luke Bonecutter