Patents by Inventor Luke Dupin

Luke Dupin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatuses for executing a direct transfer of a semiconductor device die disposed on a first substrate to a second substrate
    Publication number: 20240038564
    Abstract: An apparatus for executing a direct transfer of a semiconductor device die from a first substrate to a second substrate. The apparatus includes a first substrate conveyance mechanism movable in two axes. A micro-adjustment mechanism is coupled with the first substrate conveyance mechanism and is configured to hold the first substrate and to make positional adjustments on a scale smaller than positional adjustments caused by the first substrate conveyance mechanism. The micro-adjustment mechanism includes a micro-adjustment actuator having a distal end and a first substrate holder frame that is movable via contact with the distal end of the micro-adjustment actuator. A second frame is configured to secure the second substrate such that a transfer surface is disposed facing the semiconductor device die disposed on a surface of the first substrate. A transfer mechanism is configured to press the semiconductor device die into contact with the transfer surface of the substrate.
    Type: Application
    Filed: August 14, 2023
    Publication date: February 1, 2024
    Inventors: Andrew Huska, Justin Wendt, Luke Dupin, Cody Peterson
  • Apparatuses for executing a direct transfer of a semiconductor device die disposed on a first substrate to a second substrate
    Patent number: 11728195
    Abstract: An apparatus for executing a direct transfer of a semiconductor device die from a first substrate to a second substrate. The apparatus includes a first substrate conveyance mechanism movable in two axes. A micro-adjustment mechanism is coupled with the first substrate conveyance mechanism and is configured to hold the first substrate and to make positional adjustments on a scale smaller than positional adjustments caused by the first substrate conveyance mechanism. The micro-adjustment mechanism includes a micro-adjustment actuator having a distal end and a first substrate holder frame that is movable via contact with the distal end of the micro-adjustment actuator. A second frame is configured to secure the second substrate such that a transfer surface is disposed facing the semiconductor device die disposed on a surface of the first substrate. A transfer mechanism is configured to press the semiconductor device die into contact with the transfer surface of the substrate.
    Type: Grant
    Filed: August 16, 2021
    Date of Patent: August 15, 2023
    Assignee: Rohinni, Inc.
    Inventors: Andrew Huska, Justin Wendt, Luke Dupin, Cody Peterson
  • Method and Apparatus to Increase Transfer Speed of Semiconductor Devices With Micro-Adjustment
    Publication number: 20210375656
    Abstract: An apparatus for executing a direct transfer of a semiconductor device die from a first substrate to a second substrate. The apparatus includes a first substrate conveyance mechanism movable in two axes. A micro-adjustment mechanism is coupled with the first substrate conveyance mechanism and is configured to hold the first substrate and to make positional adjustments on a scale smaller than positional adjustments caused by the first substrate conveyance mechanism. The micro-adjustment mechanism includes a micro-adjustment actuator having a distal end and a first substrate holder frame that is movable via contact with the distal end of the micro-adjustment actuator. A second frame is configured to secure the second substrate such that a transfer surface is disposed facing the semiconductor device die disposed on a surface of the first substrate. A transfer mechanism is configured to press the semiconductor device die into contact with the transfer surface of the substrate.
    Type: Application
    Filed: August 16, 2021
    Publication date: December 2, 2021
    Inventors: Andrew Huska, Justin Wendt, Luke Dupin, Cody Peterson
  • Apparatus to increase transferspeed of semiconductor devices with micro-adjustment
    Patent number: 11094571
    Abstract: An apparatus for executing a direct transfer of a semiconductor device die from a first substrate to a second substrate. The apparatus includes a first substrate conveyance mechanism movable in two axes. A micro-adjustment mechanism is coupled with the first substrate conveyance mechanism and is configured to hold the first substrate and to make positional adjustments on a scale smaller than positional adjustments caused by the first substrate conveyance mechanism. The micro-adjustment mechanism includes a micro-adjustment actuator having a distal end and a first substrate holder frame that is movable via contact with the distal end of the micro-adjustment actuator. A second frame is configured to secure the second substrate such that a transfer surface is disposed facing the semiconductor device die disposed on a surface of the first substrate. A transfer mechanism is configured to press the semiconductor device die into contact with the transfer surface of the substrate.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: August 17, 2021
    Assignee: Rohinni, LLC
    Inventors: Andrew Huska, Cody Peterson, Justin Wendt, Luke Dupin
  • Method and Apparatus to Increase Transfer Speed of Semiconductor Devices With Micro-Adjustment
    Publication number: 20200105566
    Abstract: An apparatus for executing a direct transfer of a semiconductor device die from a first substrate to a second substrate. The apparatus includes a first substrate conveyance mechanism movable in two axes. A micro-adjustment mechanism is coupled with the first substrate conveyance mechanism and is configured to hold the first substrate and to make positional adjustments on a scale smaller than positional adjustments caused by the first substrate conveyance mechanism. The micro-adjustment mechanism includes a micro-adjustment actuator having a distal end and a first substrate holder frame that is movable via contact with the distal end of the micro-adjustment actuator. A second frame is configured to secure the second substrate such that a transfer surface is disposed facing the semiconductor device die disposed on a surface of the first substrate. A transfer mechanism is configured to press the semiconductor device die into contact with the transfer surface of the substrate.
    Type: Application
    Filed: September 28, 2018
    Publication date: April 2, 2020
    Inventors: Andrew Huska, Cody Peterson, Justin Wendt, Luke Dupin