Abstract: A computing system includes an electronic device connected to a substrate via electrical interconnects. The system includes one or more protective features to reduce the exposure of the electrical interconnects to the coolant liquid of a two-phase immersion cooling system. For example, a sealant may be applied along the edges of the device such that the device, the substrate, 2024/243146 and the sealant together form a cavity to trap gas bubbles, which surround the electrical interconnects and displace the coolant liquid. In another example, an underfill may encapsulate the electrical interconnects, thus providing a physical barrier between the electrical interconnects and the coolant liquid. In another example, a protective coating may be applied to a portion of the device to suppress boiling of the coolant liquid at that portion. The coating is thermally insulating, hydrophobic and/or oleophobic, and provides a smooth surface with little to no nucleation sites for boiling.

Abstract: Methods to form a boiling enhancement coating (BEC) directly on a protective lid or directly on a semiconductor die are described. The BEC can improve heat dissipation from the protective lid or semiconductor die into a coolant liquid of a two-phase immersion-cooling system. In some cases, a heat spreader is not needed to cool the semiconductor die.

Abstract: Cooling assemblies and related methods to cool a plurality of semiconductor dies mounted to a printed circuit board are described. A valved boiling enhancement enclosure located adjacent to a heat spreader that thermally couples to one or more semiconductor dies. The boiling enhancement enclosure can actively manage boiling of coolant liquid near the heat spreader in a two-phase immersion-cooling chamber to make the temperatures across the semiconductor dies more uniform.

Abstract: Cooling assemblies and related methods to cool a plurality of semiconductor dies mounted to a printed circuit board are described. A valved boiling enhancement enclosure located adjacent to a heat spreader that thermally couples to one or more semiconductor dies. The boiling enhancement enclosure can actively manage boiling of coolant liquid near the heat spreader in a two-phase immersion-cooling chamber to make the temperatures across the semiconductor dies more uniform.

Abstract: Methods to form a boiling enhancement coating (BEC) directly on a protective lid or directly on a semiconductor die are described. The BEC can improve heat dissipation from the protective lid or semiconductor die into a coolant liquid of a two-phase immersion-cooling system. In some cases, a heat spreader is not needed to cool the semiconductor die.