Abstract: The invention comprises methods for fabricating and using a plurality of sensors on a substrate surface, such as ultrasonic sensor probes. The methods for fabricating sensors directly on the substrate surface includes the use of a template to dispose sensor material in an array and form a first layer on the substrate surface and a second template to dispose sensor electrode material in a corresponding array to form a second layer on top of the first layer. The invention provides a sensor housing that electrically connects the sensors and a computing device. The sensor housing may comprise a flexible circuit having a plurality of sensor electrode contact points corresponding to each of the sensors, at least one spring plate, a force distribution plate, and a plurality of cable wires attached to the flexible circuit and corresponding to each of sensor electrode contact points.

Abstract: The invention comprises an apparatus for testing mechanical materials, including, but not limited to, plates, welded pipes, metal shells, and the like. The apparatus may include an outer module; an inner module, wherein the inner module is affixed to a target mechanical material to be tested; and at least one main bolt, wherein the at least one main bolt physically contacts the outer module and the inner module. In some embodiments, the inner module may include a plurality of clasps for holding the target material. A mechanical force can be applied to the main bolt, which results in application of mechanical force to the target mechanical material for testing. Additionally, the apparatus does not require any hydraulic elements or electrical elements.

Abstract: The invention comprises methods for fabricating and using a plurality of sensors on a substrate surface, such as ultrasonic sensor probes. The methods for fabricating sensors directly on the substrate surface includes the use of a template to dispose sensor material in an array and form a first layer on the substrate surface and a second template to dispose sensor electrode material in a corresponding array to form a second layer on top of the first layer. The invention provides a sensor housing that electrically connects the sensors and a computing device. The sensor housing may comprise a flexible circuit having a plurality of sensor electrode contact points corresponding to each of the sensors, at least one spring plate, a force distribution plate, and a plurality of cable wires attached to the flexible circuit and corresponding to each of sensor electrode contact points.

Abstract: The invention comprises an apparatus for testing mechanical materials, including, but not limited to, plates, welded pipes, metal shells, and the like. The apparatus may include an outer module; an inner module, wherein the inner module is affixed to a target mechanical material to be tested; and at least one main bolt, wherein the at least one main bolt physically contacts the outer module and the inner module. In some embodiments, the inner module may include a plurality of clasps for holding the target material. A mechanical force can be applied to the main bolt, which results in application of mechanical force to the target mechanical material for testing. Additionally, the apparatus does not require any hydraulic elements or electrical elements.