Abstract: Methods of improving the adhesion of metal layers to a substrate, such as an optical substrate, are provided. Such methods employ a layer of an adhesion promoting composition including a plating catalyst on the substrate before metal deposition. Also provided are devices made by such processes.

Abstract: Provided are methods of forming an optical device. The methods involve: (a) applying over a first substrate a dry-film including: a carrier substrate and a first polymeric layer over the carrier substrate; (b) forming a second polymeric layer over the first substrate by a method that includes coating over the first substrate a liquid composition; and (c) patterning the first polymeric layer and/or the second polymeric layer. Also provided are methods of forming printed wiring boards having optical functionality. The invention finds particular applicability in the optoelectronics industry.

Abstract: Provided is a dry-film suitable for use in forming an optical component. The dry-film includes a carrier substrate having a front surface and a back surface. A negative-working photoimageable polymeric layer is disposed over the front surface of the carrier substrate, and includes a photoactive component and units of the formula (RSiO1.5), wherein R is a substituted or unsubstituted organic group. In each of the units, R is free of hydroxy groups. The units include units of the formula (R1SiO1.5) and (R2SiO1.5), wherein R1 is a substituted or unsubstituted aliphatic group and R2 is a substituted or unsubstituted aromatic group. A protective cover layer is disposed over the front surface or back surface of the carrier substrate. Also provided are methods of forming optical devices with dry-films. The invention finds particular applicability in the optoelectronics industry.

Abstract: Provided is a dry-film suitable for use in forming an optical component. The dry-film includes a carrier substrate having a front surface and a back surface. A non-photoimageable, thermally curable polymeric layer is provided over the front surface of the carrier substrate. The polymeric layer includes a thermally active component and units of the formula (RSiO1.5), wherein R is a substituted or unsubstituted organic group. A protective cover layer is disposed over the front or back surface of the carrier substrate. Also provided are methods of forming optical devices with dry-films. The invention finds particular applicability in the optoelectronics industry.