Patents by Inventor Luke Prenger

Luke Prenger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LASER-RELEASABLE BONDING MATERIALS FOR 3-D IC APPLICATIONS
    Publication number: 20230187257
    Abstract: Novel polyketanil-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, at wavelengths from about 300 nm to about 360 nm, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are resistant to common solvents used in semiconductor processing. The compositions can also be used as build-up layers for redistribution layer formation.
    Type: Application
    Filed: January 31, 2023
    Publication date: June 15, 2023
    Inventors: Luke Prenger, Arthur O. Southard, Qi Wu, Xiao Liu
  • Laser-releasable bonding materials for 3-D IC applications
    Patent number: 11610801
    Abstract: Novel polyketanil-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, at wavelengths from about 300 nm to about 360 nm, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are resistant to common solvents used in semiconductor processing. The compositions can also be used as build-up layers for redistribution layer formation.
    Type: Grant
    Filed: January 20, 2020
    Date of Patent: March 21, 2023
    Assignee: Brewer Science, Inc.
    Inventors: Luke Prenger, Arthur O. Southard, Qi Wu, Xiao Liu
  • LASER-RELEASABLE BONDING MATERIALS FOR 3-D IC APPLICATIONS
    Publication number: 20200234993
    Abstract: Novel polyketanil-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, at wavelengths from about 300 nm to about 360 nm, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are resistant to common solvents used in semiconductor processing. The compositions can also be used as build-up layers for redistribution layer formation.
    Type: Application
    Filed: January 20, 2020
    Publication date: July 23, 2020
    Inventors: Luke Prenger, Arthur O. Southard, Qi Wu, Xiao Liu