Abstract: A thermal management device includes a heat spreader and a folded graphite sheet. The heat spreader is configured to receive heat from a heat source. The folded graphite sheet is connected to the heat spreader to receive and exhaust heat from the heat spreader. The folded graphite sheet includes a first fin, a second fin, and a segment connecting the first fin and second fin. The first fin is oriented at least partially vertically away from the heat spreader. The second fin is oriented at least partially vertically away from the heat spreader. The folded graphite sheet is continuous through the first fin, the segment, and the second fin.

Abstract: A leak detection system for a thermal interface material (TIM) includes a sensor located proximate to a processor. As thermal fluctuations or other events cause the TIM to flow out of the gap between the processor and a thermal management device, a leak detection sensor may detect the presence of the TIM. This allows an operator of the computing device to identify TIM leaks, thereby preventing or reducing damage to the processor or other electronic components of a computing device.

Abstract: A cooling system may include a first domain having a first fluid inlet and a first fluid outlet. A cooling system may include a second domain having a second fluid inlet and a second fluid outlet. A cooling system may include a thermal break between the first domain and the second domain. The thermal break includes a thermal gap separating the first domain and the second domain by 1 mm or less.

Abstract: A vibration reduction system may include a base. A vibration reduction system may include a computing component connected to the base. The computing component has a vibration frequency. A vibration reduction system may include a tuned mass dampener having a tuned frequency to reduce a magnitude of vibration of the computing component.

Abstract: A thermal management system for a computing device includes a support board, a heat-generating component fixed to the support board, an enclosure, and a PCM. The heat-generating component is fixed to the support board on a first side of the support board, and the enclosure is fixed to the first side of the support board and encloses at least the heat-generating component. The PCM is positioned in the enclosure and configured to receive heat from the heat-generating component. The PCM is solid at 10° C.

Abstract: A commonly designed processor heat exchanger decouples the mounting hardware used to mount the heat exchanger to a processor from the heat exchanger itself. This allows a single heat exchanger design to be mounted to various different types of processors using processor customized mounting brackets that engage with flanges extending out from a body of the heat exchanger.

Abstract: In some aspects, the techniques described herein relate to a cooling system for a computing device. The cooling system includes an air-cooled cooling system located in a housing. The air-cooled cooling system includes a heat sink thermally connected to a processor, an air-cooling radiator, and a heat pipe connecting the heat sink to the air-cooling radiator. The cooling system includes a liquid-cooled cooling system located in the housing. The liquid-cooled cooling system includes a cold plate thermally connected to a to the heat sink, a pump, a fluid radiator, and a fluid piping system connecting the pump, the cold plate, and the fluid radiator.

Abstract: An electrically conducting substrate includes a plurality of layers. A strain gauge is deposited on a layer of the plurality of layers. The strain gauge measures the stress and/or strain of the electrically conducting substrate. This allows the strain gauge to determine whether a stress or strain of the electrically conducting substrate has caused the electrically conducting substrate to deform, crack, or break.

Abstract: A leak detection system for a thermal interface material (TIM) includes a sensor located proximate to a processor. As thermal fluctuations or other events cause the TIM to flow out of the gap between the processor and a thermal management device, a leak detection sensor may detect the presence of the TIM. This allows an operator of the computing device to identify TIM leaks, thereby preventing or reducing damage to the processor or other electronic components of a computing device.

Abstract: A status monitoring system includes a status sensor configured to monitor a status of an electronic circuit. If the status monitoring system detects a status that exceeds a threshold, the status monitoring system records the details of the event on the electronic circuit. The status monitoring system operates in a low-power power mode during transit from a manufacturing facility to an installation location.

Abstract: A computing system and related methods are described. The computing system includes a heat-generating component. The computing system includes an evaporation plate thermally connected to the heat-generating component. The computing system includes a cryogenic cooling system positioned proximate to the evaporation plate. The cryogenic cooling system is configured to release a cryogenic fluid onto the evaporation plate to cool the heat-generating component. The cryogenic fluid has a boiling point of less than 273 K.

Abstract: A rack security system includes a locking mechanism connected to a server. The locking mechanism is configured to lock onto the busbar of a rack. When the locking mechanism is locked to the busbar, the locking mechanism may prevent removal of the server from the rack. When the locking mechanism is unlocked, the server may be removable from the rack.

Abstract: A leak mitigation system for a fluid-cooled computing device includes an absorbent pad having a fluid sensor connected to an absorbent material. The absorbent pad is placed in a position relative to the fluid-cooled computing device to collect fluid from the cooling system. The sensor detects the presence of a fluid absorbed by the absorbent material and the leak mitigation system implements a leak mitigation protocol to prevent or reduce damage to the computing device.

Abstract: A thermal management device includes a heat spreader and a folded graphite sheet. The heat spreader is configured to receive heat from a heat source. The folded graphite sheet is connected to the heat spreader to receive and exhaust heat from the heat spreader. The folded graphite sheet includes a first fin, a second fin, and a segment connecting the first fin and second fin. The first fin is oriented at least partially vertically away from the heat spreader. The second fin is oriented at least partially vertically away from the heat spreader. The folded graphite sheet is continuous through the first fin, the segment, and the second fin.

Abstract: A thermal management system for a computing device includes a support board, a heat-generating component fixed to the support board, an enclosure, and a PCM. The heat-generating component is fixed to the support board on a first side of the support board, and the enclosure is fixed to the first side of the support board and encloses at least the heat-generating component. The PCM is positioned in the enclosure and configured to receive heat from the heat-generating component. The PCM is solid at 10° C.

Abstract: A system and method for controlling a cooling system for an electronic datacenter component using a two-phase thermal management system with dynamic thermoelectric regulation. The system includes a thermoelectric cooler to transfer heat to a hot conduit of the thermal management system and initialize or maintain a natural convective flow of working fluid by maintaining a temperature difference between a hot and cold conduit.

Abstract: A modular data storage tape library includes a modular frame having a form factor similar to other types of computing racks. The modular data storage tape library includes a hermetically sealed enclosure within the modular frame and a cooling portion within the modular frame. Data storage tapes, data storage drives and robotics for moving the data storage tapes are included within the hermetically sealed enclosure. A heat exchanger transfers heat from the hermetically sealed enclosure to the cooling portion outside of the sealed enclosure through a boundary of the hermetically sealed enclosure without introducing air from the data center into the hermetically sealed enclosure. Because air is neither introduced nor removed from the hermetically sealed enclosure, humidity fluctuations are minimal, if existent, and contaminants are prevented from entering the hermetically sealed enclosure, thus increasing the life spans of the data storage tapes included in the hermetically sealed enclosure.

Abstract: A system and method for cooling an electronic datacenter component using a two-phase thermal management system with dynamic thermoelectric regulation. The system includes a thermoelectric cooler to transfer heat to a hot conduit of the thermal management system and initialize or maintain a natural convective flow of working fluid by maintaining a temperature difference between a hot and cold conduit.

Abstract: A sensor may detect a coolant leak at or near an appliance that is slidable between a seated position and an ejected position relative to a rack. In the seated position, a coolant supply line may be coupled with a conduit of the appliance to convey coolant past the appliance. A biaser can bias the appliance toward the ejected position, and a latch may secure the appliance in a seated position against the biaser. A releaser can release the latch in response to coolant leak detection by the sensor and permit the biaser to move the appliance toward the ejected position, for example, which may cause the conduit to become disconnected from the coolant supply line to cut off flow to the leak.

Abstract: A self-installing connector for a liquid cooling system of a datacenter component rack system. A datacenter component rack may include manifolds for conveying coolant to or from one or more datacenter electronic components for liquid cooling components of the datacenter electronic component. The self-installing connector provides a fluid connection between the manifold and a liquid cooling system of a datacenter electronic component. The self-installing connector may puncture the manifold at the time the datacenter electronic component is installed. The self-installing connector may form an opening in the manifold and secure one end of the self-installing connector into the opening upon installation of the datacenter electronic component into the datacenter component rack. The self-installing connector can separate at a dripless quick-disconnect coupling for datacenter electronic component maintenance.