Patents by Inventor Luke Young Chang

Luke Young Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package level power gating
    Patent number: 10957651
    Abstract: A die package is disclosed through which power domains within the chip may be isolated by removing vias within the package substrate, rather than power gating. Multiple substrate options may be configured without specific vias. This eliminates the need to design power gating circuitry into the die, freeing up that die area for more functional logic. The solution allows the die package to retain the same pinout for use by PCB designers, regardless of which power domains are gated.
    Type: Grant
    Filed: August 7, 2019
    Date of Patent: March 23, 2021
    Assignee: NVIDIA Corp.
    Inventors: Don Templeton, Luke Young Chang, Narayan Kulshrestha
  • PACKAGE LEVEL POWER GATING
    Publication number: 20210043574
    Abstract: A die package is disclosed through which power domains within the chip may be isolated by removing vias within the package substrate, rather than power gating. Multiple substrate options may be configured without specific vias. This eliminates the need to design power gating circuitry into the die, freeing up that die area for more functional logic. The solution allows the die package to retain the same pinout for use by PCB designers, regardless of which power domains are gated.
    Type: Application
    Filed: August 7, 2019
    Publication date: February 11, 2021
    Applicant: NVIDIA Corp.
    Inventors: Don Templeton, Luke Young Chang, Narayan Kulshrestha