Abstract: A micro-electromechanical systems (MEMS) package comprising: a MEMS package comprising a substrate and a lid coupled to the substrate; a piezoelectric valve coupled to the substrate and comprising a number of movable members operable to be deformed in opposite directions upon application of a voltage to modify an acoustic resistance of an acoustic port; and a first stopper defined by the substrate and a second stopper defined by the lid, the first stopper and the second stopper being aligned with the number of movable members and operable to prevent an undesirable defection of the number of movable members.

Abstract: A piezoelectric valve comprising: a fixed portion defining an opening; and a number of movable portions extending from the fixed portion over the opening and separated from one another by radially oriented slits, each movable portion of the number of movable portions comprising a first material layer and a second material layer, and at least one of the first material layer or the second material layer comprises a piezoelectric material that is operable to drive a displacement of the movable portion in a direction opposite to an adjacent movable portion sharing a same radially oriented slit upon application of a voltage.

Abstract: A device and a method for generating input control signals of a serialized compressed scan circuit are provided. A control signal generating device receives a test clock signal from a clock input port and a state enable signal from a state enable bus, and correspondingly generates a shift enable signal, a capture enable signal and a strobe signal. A clock gating device is coupled to the control signal generating device, and receives the shift enable signal, the capture enable signal and the strobe signal. When the shift enable signal is enabled, the clock gating device controls the test clock signal as a serialized scan clock signal. When the strobe signal or the capture enable signal is enabled, the clock gating device controls the test clock signal as a scan clock signal.

Abstract: A device and a method for generating input control signals of a serialized compressed scan circuit are provided. A control signal generating device receives a test clock signal from a clock input port and a state enable signal from a state enable bus, and correspondingly generates a shift enable signal, a capture enable signal and a strobe signal. A clock gating device is coupled to the control signal generating device, and receives the shift enable signal, the capture enable signal and the strobe signal. When the shift enable signal is enabled, the clock gating device controls the test clock signal as a serialized scan clock signal. When the strobe signal or the capture enable signal is enabled, the clock gating device controls the test clock signal as a scan clock signal.

Abstract: A repairable multi-layer memory chip stack wherein each of the memory chips of the chip stack includes a control unit, a decoding unit, a memory array module and a redundant repair unit comprising at least one redundant repair element. The decoding unit receives a memory address from an address bus, and correspondingly outputs a decoded address. The memory array module determines whether to allow a data bus to access the data of the memory array module corresponding to a decoded address in accordance with an activation signal of the control unit. The redundant repair element includes a valid field, a chip ID field, a faulty address field and a redundant memory. When the valid field is valid, the value of the chip ID field matches the ID code, and the value of the faulty address field matches the decoded address, the redundant memory is coupled to the data bus.

Abstract: A test device for an SoC test architecture has a test input port, a test output port, a plurality of cores, a register, and a plurality of user defined logics. The register has a plurality of bits corresponding to the cores. Each of the user defined logics is connected to a corresponding bit of the register and a corresponding one of the cores. Each of the user defined logic receives a plurality of test control signals, and receives the corresponding bit of the register to change values of the test control signals. Outputs of each of the user defined logics are connected to the corresponding core to determine whether a test instruction of the corresponding core is or is not needed to be updated.

Abstract: A repairable multi-layer memory chip stack is provided. Each of the memory chips of the chip stack includes a control unit, a decoding unit, a memory array module and a redundant repair unit comprising at least one redundant repair element. The decoding unit receives a memory address from an address bus, and correspondingly outputs a decoded address. The memory array module determines whether to allow a data bus to access the data of the memory array module corresponding to a decoded address in accordance with an activation signal of the control unit. The redundant repair element includes a valid field, a chip ID field, a faulty address field and a redundant memory. When the valid field is valid, the value of the chip ID field matches the ID code, and the value of the faulty address field matches the decoded address, the redundant memory is coupled to the data bus.

Abstract: A test device for an SoC test architecture has a test input port, a test output port, a plurality of cores, a register, and a plurality of user defined logics. The register has a plurality of bits corresponding to the cores. Each of the user defined logics is connected to a corresponding bit of the register and a corresponding one of the cores. Each of the user defined logic receives a plurality of test control signals, and receives the corresponding bit of the register to change values of the test control signals. Outputs of each of the user defined logics are connected to the corresponding core to determine whether a test instruction of the corresponding core is or is not needed to be updated.

Abstract: A test device for a hierarchical test architecture is disclosed. The architecture includes cores for plural test layers, a top-level data register, and a top-level test controller. Cores for each test layer are hierarchical test circuits. The top-level test controller retrieves plural control signals, controls the top-level data register based on first type control signals in the control signals, and controls each core based on second type control signals in the control signals.

Abstract: A test device for the SoC test architecture is disclosed. The device comprises plural test groups connected in parallel and a test control flag register within a controller. Each test group comprises single or plural core circuits. The test control flag register enables a set of test signals to input in one of the test groups, testing the core circuits in the test group.

Abstract: Disclosed is a build-in self-diagnosis and repair method and apparatus in a memory with syndrome identification. It applies a fail-pattern identification and a syndrome-format structure to identify at least one type of faulty syndrome in the memory during a memory testing, then generates and exports fault syndrome information associated with the corresponding faulty syndrome. According to the fault syndrome information, the method applies a redundancy analysis algorithm, allocates spare memory elements and repairs the faulty cells in the memory. The syndrome-format structure respectively applies single-faulty-word-syndrome format, faulty-row-segment-syndrome format, and faulty-column-segment-syndrome format for different faulty syndromes, such as faulty row segments and single faulty words, faulty column segments and single faulty words, all of single faulty words, faulty row segments and faulty column segments, and so on.

Abstract: A test device for a hierarchical test architecture is disclosed. The architecture includes cores for plural test layers, a top-level data register, and a top-level test controller. Cores for each test layer are hierarchical test circuits. The top-level test controller retrieves plural control signals, controls the top-level data register based on first type control signals in the control signals, and controls each core based on second type control signals in the control signals.

Abstract: A wrapper testing circuit of system-on-a-chip for electrical tests of at least a core circuit of an integrated circuit and a wrapper testing method thereof are provided. A controller outputs control signals and test signals and receives result signals executed by the core circuit. The wrapper testing circuit comprises a decoding logic and a plurality of wrapper boundary registers. The decoding logic has a signal decoding table which receives and decodes the control signals and then issues decoded signals according to the signal decoding table. The WBR shifts, updates and captures the test signals for the core circuit to execute and output the result signals according to the decoded signals. In comparison with prior art, the testing time is reduced.

Abstract: Disclosed is a scan test data compression method and decoding apparatus for multiple-scan-chain designs. The apparatus comprises a on-chip decoder connected to a tester. The decoder includes a decoding buffer configured as a multilayer architecture, a controller, and a switching box for receiving a shift signal or a copy signal. The decoding buffer is used to store decoded test data. While the decoder decodes the encoded data, it transmits control signals to both the decoding buffer and the switching box from the controller, and sends the decoded data to scan chains of a CUT for testing through the decoding buffer. This invention has the advantages of simple encoding method, high compression rate, low power consumption in testing, and without the fault coverage loss.

Abstract: A built-in memory current test circuit to test a memory on a chip is disclosed, comprising a built-in self-test circuit and a dynamic current generation module. The built-in self-test circuit is disposed on the chip to receive and process a test signal and generate a control signal to control operation of the memory and a current control code. The dynamic current generation module, also disposed on the chip, produces a test current into the memory based on the current control code. The current switch time is reduced in the built-in memory current test circuit, and an integrated test combining functional and stress tests can thus be performed.

Abstract: Disclosed is a build-in self-diagnosis and repair method and apparatus in a memory with syndrome identification. It applies a fail-pattern identification and a syndrome-format structure to identify at least one type of faulty syndrome in the memory during a memory testing, then generates and exports fault syndrome information associated with the corresponding faulty syndrome. According to the fault syndrome information, the method applies a redundancy analysis algorithm, allocates spare memory elements and repairs the faulty cells in the memory. The syndrome-format structure respectively applies single-faulty-word-syndrome format, faulty-row-segment-syndrome format, and faulty-column-segment-syndrome format for different faulty syndromes, such as faulty row segments and single faulty words, faulty column segments and single faulty words, all of single faulty words, faulty row segments and faulty column segments, and so on.

Abstract: A wrapper testing circuit of system-on-a-chip for electrical tests of at least a core circuit of an integrated circuit and a wrapper testing method thereof are provided. A controller outputs control signals and test signals and receives result signals executed by the core circuit. The wrapper testing circuit comprises a decoding logic and a plurality of wrapper boundary registers. The decoding logic has a signal decoding table which receives and decodes the control signals and then issues decoded signals according to the signal decoding table. The WBR shifts, updates and captures the test signals for the core circuit to execute and output the result signals according to the decoded signals. In comparison with prior art, the testing time is reduced.

Abstract: A built-in memory current test circuit to test a memory on a chip is disclosed, comprising a built-in self-test circuit and a dynamic current generation module. The built-in self-test circuit is disposed on the chip to receive and process a test signal and generate a control signal to control operation of the memory and a current control code. The dynamic current generation module, also disposed on the chip, produces a test current into the memory based on the current control code. The current switch time is reduced in the built-in memory current test circuit, and an integrated test combining functional and stress tests can thus be performed.