Abstract: To minimize the width of a non-light-emitting border region around an opening in the active area, data lines may be stacked in the border region. Data line portions may be formed using three metal layers in three different planes within the border region. A metal layer that forms a positive power signal distribution path in the active area may serve as a data line portion in the border region. A metal layer may be added in the border region to serve as a data line portion in the border region. Data line signals may also be provided to pixels on both sides of an opening in the active area using supplemental data line paths. A supplemental data line path may be routed through the active area of the display to electrically connect data line segments on opposing sides of an opening within the display.

Abstract: A substrate assembly and a display device are provided. The substrate assembly includes a substrate, a first conductive line, and a second conductive line. The first conductive line is disposed on the substrate, wherein a voltage is applied to the first conductive line. The second conductive line is disposed on the substrate, wherein in a top view, at least a portion of the second conductive line extends along a first direction. The first conductive line and the second conductive line are at least partially overlapped in a normal direction of the substrate. A distance between the first conductive line and the second conductive line in the normal direction is greater than or equal to 3500 angstroms, and less than or equal to 4500 angstroms.

Abstract: A rotation exercising ball structure includes two shells, two pivot seats, a weight unit, and two handle protecting members. The two shells are combined to construct a hollow ball. Each of the two shells has a space. Each of the two pivot seats is formed on the space and has a through hole. The weight unit includes a mandrel, a rotation member, two bearings, and a weight. The mandrel has two ends each secured in the through hole of one of the two pivot seats. The rotation member has a first end provided with a mounting hole for mounting the two bearings. The weight connects a second end of the rotation member. The rotation member and the weight are rotated on the mandrel. The two handle protecting members are mounted on the two shells.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Abstract: A laser welding method for steel plates and a profile steel welded by laser welding are disclosed. The laser welding method comprises the following steps of connecting a first steel plate and a second steel plate to form a joint; and using a laser to weld the joint to form a profile steel. The laser has a laser power between 10,000 and 25,000 watts. A weld bead is formed at the joint. The weld bead has a weld depth and a weld width. The ratio of the weld depth to the weld width is between 1 and 5. Thus, the process can be simplified effectively, the welding time can be shortened, and the processing area can be reduced.

Abstract: Devices and methods of manufacture for a hybrid interposer within a semiconductor device. A semiconductor device may include a package substrate and a hybrid interposer. The hybrid interposer may include an organic interposer material layer, and a non-organic interposer material layer positioned between the organic interposer material layer and the package substrate. The semiconductor device may further include an integrated device positioned within the hybrid interposer. In one embodiment, the integrated device may be positioned within the organic interposer material layer. In another embodiment, the integrated device may be positioned within the non-organic interposer material layer. In a further embodiment, the integrated device may be positioned within the organic interposer material layer and the non-organic interposer material layer.

Abstract: The disclosed technology is generally directed to a distributed query-and-command system. In one example of the technology, in a trusted execution environment (TEE) of a first node, database code of the first node and distributed ledger code of the first node is executed, such that execution of the distributed ledger code of the first node instantiates a first instance of a distributed ledger of a consortium blockchain, and such that execution of the query-and-command code of the first node instantiates a first instance of a query-and-command system. The consortium blockchain is distributed among a plurality of nodes, and the query-and-command system is distributed among the plurality of nodes. A first transaction that is associated with modifying the query-and-command system is received. The first transaction is executed. Changes associated with the first transaction to the distributed ledger are persisted.

Abstract: A treadmill includes a treadmill body including a main support unit and a belt mechanism. The main support unit includes at least one first frame, at least one second frame located under the at least one first frame, multiple first elastic shock-absorbing members mounted between the at least one first frame and the at least one second frame, and multiple second elastic shock-absorbing members mounted on a bottom of the at least one second frame. The at least one first frame and the at least one second frame are arranged and combined to construct a multi-layer frame structure. The belt mechanism is mounted on the at least one first frame.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Abstract: A rotation exercising ball structure includes two shells, two pivot seats, a weight unit, and two handle protecting members. The two shells are combined to construct a hollow ball. Each of the two shells has a space. Each of the two pivot seats is formed on the space and has a through hole. The weight unit includes a mandrel, a rotation member, two bearings, and a weight. The mandrel has two ends each secured in the through hole of one of the two pivot seats. The rotation member has a first end provided with a mounting hole for mounting the two bearings. The weight connects a second end of the rotation member. The rotation member and the weight are rotated on the mandrel. The two handle protecting members are mounted on the two shells.

Abstract: A color wheel module and a projection device. The color wheel module includes a driving element, a first rotating member, a second rotating member and an annular optical member. The first rotating member includes a first reflective area, a second reflective area and a wavelength conversion material. The second reflective area is connected to the first reflective area, and the first reflective area is inclined to the second reflective area. The wavelength conversion material is disposed on the first reflective area. The second rotating member is connected to the first reflective area. The annular optical member is disposed between the first rotating member and the second rotating member to form an optical cavity with the first rotating member and the second rotating member, one of the second rotating member and the annular optical member includes a dichroic layer, and the other includes a filter area and a transmission area.

Abstract: The present invention provides a computer system and a method for processing a debug message of a computer system. The method includes the following steps: performing, by a first timer, timing when a computer system starts up; determining whether a first-stage confirmation signal is received within a first specific time; stopping the first timer and enabling a second timer to perform timing if the first-stage confirmation signal is received; determining whether a second-stage confirmation signal is received within a second specific time; stopping the second timer if the second-stage confirmation signal is received; enabling an input pin of a general-purpose input/output (GPIO) device to be at a low level if the first-stage confirmation signal is not received within the first specific time or the second-stage confirmation signal is not received within the second specific time; and outputting a debug message based on the low level.

Abstract: A combination of probiotics for improving body compositions includes Lacticaseibacillus paracasei S38 and Bacillus coagulans BC198. The combination of probiotics can be a medicine composition, a nutrient supplement, healthy food or a combination thereof. The applications of the combination of probiotics include weight loss, reduction of fat, abatement of appetite, production of butyric acid within intestinal tracts and an increased count of Akkermansia muciniphila or Ruminococcaceae inside intestines.

Abstract: Methods of manufacture for a hybrid interposer within a semiconductor device. A method of forming a semiconductor structure may include forming a package substrate and forming a hybrid interposer. Forming a hybrid interposer may include depositing a non-organic interposed material layer over the package substrate and depositing an organic interposer material layer over the non-organic interposer material layer.

Abstract: A substrate assembly and a display device are provided. The substrate assembly includes a substrate, a first conductive line, and a second conductive line. The first conductive line is disposed on the substrate, wherein a voltage is applied to the first conductive line. The second conductive line is disposed on the substrate, wherein in a top view, at least a portion of the second conductive line extends along a first direction. The first conductive line and the second conductive line are at least partially overlapped in a normal direction of the substrate. A distance between the first conductive line and the second conductive line in the normal direction is greater than or equal to 3500 angstroms, and less than or equal to 4500 angstroms.

Abstract: An opening is formed through a dielectric material layer to physically expose a top surface of a conductive material portion in, or over, a substrate. A metallic nitride liner is formed on a sidewall of the opening and on the top surface of the conductive material portion. A metallic adhesion layer including an alloy of copper and at least one transition metal that is not copper is formed on an inner sidewall of the metallic nitride liner. A copper fill material portion may be formed on an inner sidewall of the metallic adhesion layer. The metallic adhesion layer is thermally stable, and remains free of holes during subsequent thermal processes, which may include reflow of the copper fill material portion. An additional copper fill material portion may be optionally deposited after a reflow process.

Abstract: A topical subcutaneous microcirculation detection device includes a first light source module, a second light source module, a lens plate, a first light sensor, and a second light sensor. The first and second light source modules are configured to emit first and second illumination beams, respectively. A flat plate portion of the lens plate is disposed to lean against a first portion of skin of a subject. A convex surface of a first convex lens portion of the lens plate is disposed to push into a second portion of the skin of the subject. The first and second illumination beams are reflected into first and second reflected beams by the first and second portions of the skin, respectively. The first and second reflected beams are transmitted to the first and second light sensors, respectively.

Abstract: An opening is formed through a dielectric material layer to physically expose a top surface of a conductive material portion in, or over, a substrate. A metallic nitride liner is formed on a sidewall of the opening and on the top surface of the conductive material portion. A metallic adhesion layer including an alloy of copper and at least one transition metal that is not copper is formed on an inner sidewall of the metallic nitride liner. A copper fill material portion may be formed on an inner sidewall of the metallic adhesion layer. The metallic adhesion layer is thermally stable, and remains free of holes during subsequent thermal processes, which may include reflow of the copper fill material portion. An additional copper fill material portion may be optionally deposited after a reflow process.

Abstract: An electronic device includes a frame and a display stack. The frame defines a first part of an interior volume. The display stack includes a cover attached to the frame. The cover may define a second part of the interior volume. The display stack also includes an array of organic light-emitting diodes (OLEDs) including an array of emissive electroluminescent (EL) regions, and at least one organic photodetector (OPD) disposed between the cover and at least one emissive EL region in the array of emissive electroluminescent regions. The at least one emissive EL region emits light through the at least one OPD. In alternative embodiments, the OLEDs may be stacked on the OPDs, or the OLEDs and OPDs may be interspersed with each other instead of stacked.

Abstract: To minimize the width of a non-light-emitting border region around an opening in the active area, data lines may be stacked in the border region. Data line portions may be formed using three metal layers in three different planes within the border region. A metal layer that forms a positive power signal distribution path in the active area may serve as a data line portion in the border region. A metal layer may be added in the border region to serve as a data line portion in the border region. Data line signals may also be provided to pixels on both sides of an opening in the active area using supplemental data line paths. A supplemental data line path may be routed through the active area of the display to electrically connect data line segments on opposing sides of an opening within the display.