Abstract: A vehicle-mounted apparatus and vehicle-mounted apparatus control method are provided. The vehicle-mounted apparatus is configured on a vehicle in which a user rides. The apparatus captures an environmental image around the vehicle. The apparatus inputs the environmental image into a composite model to generate a corresponding environmental text, wherein the environmental text is configured to describe the environmental image. The apparatus inputs the environmental text into a language model to generate a response text corresponding to the vehicle. The apparatus executes an interactive operation corresponding to the user based on the response text.

Abstract: A membrane probe card includes probes each having a base electrically connected with a trace of a membrane wiring structure, and a probe tip protruding from the base. The base has a tip placement section and an extension section, which extend from a first side edge to a second side edge of the base in order. The probe tip is made by laser processing and electroplating, located at the tip placement section, and provided with a fixed end portion connected with the base in a way that the width of the tip placement section is greater than the width of the fixed end portion. A distance from a center of the probe tip to the first side edge is less than a distance from the center of the probe tip to the second side edge. As such, requirements of fine pitch and probe height may be achieved.

Abstract: A trace embedded probe device includes a circuit board including an insulating layer unit whose upper surface has first recesses and a second recess located therebetween, grounding traces and a signal trace whose trace main bodies are disposed in the recesses respectively and flush in elevation with the upper surface, and a grounding layer disposed on a lower surface of the insulating layer unit and connected with the grounding traces by conductive vias penetrating through the first recesses and the lower surface and provided therein with conductive layers. The trace main bodies, grounding layer and conductive layers are made of a same metal material. Probes are disposed on the grounding and signal traces respectively. The probe device is easy in control of distance, width, thickness and surface roughness of the traces, and beneficial to achieve the requirements of thin copper traces, fine pitch and high frequency testing.

Abstract: A rotatable shaft assembly suitable for hinge of temple arm of spectacles, lockable by spring pressure at the included angle preferred for different head sizes includes a rotating shaft, a first connecting member, a second connecting member, and an elastic member. The first connecting member includes a rotating barrel and a sliding portion connected to the rotating barrel, and the rotating shaft is rotatably disposed in the rotating barrel. The second connecting member defines an accommodating groove, the sliding portion is movably accommodated in the accommodating groove. The elastic member is connected to the first connecting member and the second connecting member. A terminal device in spectacles form is also provided.

Abstract: A probe installation circuit board includes an insulating layer provided on upper and lower surfaces thereof with a trace structure including two grounding traces and a signal trace located therebetween, and a grounding layer. Each grounding trace is connected with the grounding layer by at least one conductive via including a through hole penetrating through the grounding trace and the insulating layer, and a conductive layer disposed therein to electrically connect the grounding trace and layer. The signal trace and the conductive layers are made of a metal material. The grounding layer and traces are made of another metal material. A probe device includes the circuit board and three probes disposed on the traces respectively. The present invention is capable of thin copper traces and lowered trace surface roughness, easy in control of trace distance, width and thickness, and beneficial to achieve the fine pitch requirement.

Abstract: A trace embedded probe device includes a circuit board including an insulating layer unit whose upper surface has first recesses and a second recess located therebetween, grounding traces and a signal trace whose trace main bodies are disposed in the recesses respectively and flush in elevation with the upper surface, and a grounding layer disposed on a lower surface of the insulating layer unit and connected with the grounding traces by conductive vias penetrating through the first recesses and the lower surface and provided therein with conductive layers. The trace main bodies, grounding layer and conductive layers are made of a same metal material. Probes are disposed on the grounding and signal traces respectively. The probe device is easy in control of distance, width, thickness and surface roughness of the traces, and beneficial to achieve the requirements of thin copper traces, fine pitch and high frequency testing.

Abstract: A probe module includes a circuit board and at least one probe formed on a probe installation surface of the circuit board by a microelectromechanical manufacturing process and including a probe body and a probe tip. The probe body includes first and second end portions and a longitudinal portion having first and second surfaces facing toward opposite first and second directions. The probe tip extends from the probe body toward the first direction and is processed with a gradually narrowing shape by laser cutting. The first and/or second end portion has a supporting seat protruding from the second surface toward the second direction and connected to the probe installation surface, such that the longitudinal portion and the probe tip are suspended above the probe installation surface. The probe has a tiny pinpoint for detecting tiny electronic components, and its manufacturing method is time-saving and high in yield rate.

Abstract: A probe module includes a circuit board and at least one probe formed on a probe installation surface of the circuit board by a microelectromechanical manufacturing process and including a probe body and a probe tip. The probe body includes first and second end portions and a longitudinal portion having first and second surfaces facing toward opposite first and second directions. The probe tip extends from the probe body toward the first direction and is processed with a gradually narrowing shape by laser cutting. The first and/or second end portion has a supporting seat protruding from the second surface toward the second direction and connected to the probe installation surface, such that the longitudinal portion and the probe tip are suspended above the probe installation surface. The probe has a tiny pinpoint for detecting tiny electronic components, and its manufacturing method is time-saving and high in yield rate.

Abstract: A thermosensitive printing device includes a print roller, a printhead module, a printhead pressure adjusting mechanism and a casing. The printhead pressure adjusting mechanism is supported by the casing. When a print medium is transferred through a region between the printhead module and the print roller, the print medium is printed by the printhead module. The printhead pressure adjusting mechanism is located over the printhead module and contacted with the printhead At least a portion of the printhead pressure adjusting mechanism is penetrated through the casing groove and movable within the casing groove according to a width of the print medium. The printhead pressure adjusting mechanism includes an adjusting knob and an identification pattern. When an adjusting knob is rotated, a pressure of the printhead pressure adjusting mechanism applied to the printhead module is adjusted and the pressure is recognized according to the identification pattern.

Abstract: A backlight structure includes a frame body, a light guide plate, a first optical film, a second optical film, and a fixed member. The frame body has a first frame edge and a second frame edge opposite thereto. The light guide plate is disposed in the frame body and has a first and second short border corresponding respectively to the first frame edge and the second frame edge. The light guide plate has a protrusion protruding from an upper surface of the light guide plate and being adjacent to the second short border. The optical films are disposed over the light guide plate and include a first and second short-edge portion disposed respectively over the first short border and the second short border. The second short-edge portion has a notch matching the protrusion. The fixed member fixes the frame body and the optical films.

Abstract: A thermosensitive printing device includes a print roller, a printhead module, a printhead pressure adjusting mechanism and a casing. The printhead pressure adjusting mechanism is supported by the casing. When a print medium is transferred through a region between the printhead module and the print roller, the print medium is printed by the printhead module. The printhead pressure adjusting mechanism is located over the printhead module and contacted with the printhead At least a portion of the printhead pressure adjusting mechanism is penetrated through the casing groove and movable within the casing groove according to a width of the print medium. The printhead pressure adjusting mechanism includes an adjusting knob and an identification pattern. When an adjusting knob is rotated, a pressure of the printhead pressure adjusting mechanism applied to the printhead module is adjusted and the pressure is recognized according to the identification pattern.

Abstract: A microelectromechanical probe has tail, head and body portions, and includes a pinpoint layer having a planarized top surface where a structural layer having first and second sides, a cutting face and a front terminal surface adjoining the first and second sides is disposed. The cutting face descends from the top surface of the structural layer toward the pinpoint layer to the front terminal surface. The front terminal surface extends from a front end of the cutting face to the top surface of the pinpoint layer. The pinpoint layer has a pinpoint protruding over the front terminal surface and located at the head portion. Within the head portion, the pinpoint layer is greater in hardness and less in electrical conductivity than the structural layer. The probe makes small probing marks, is highly recognizable in an automatic pinpoint recognition process, and can be conveniently installed.

Abstract: A semiconductor device and method of fabricating thereof is described that includes a substrate including at least one fin, at least one gate stack formed on a top surface of the at least one fin, a first inter-layer dielectric (ILD) layer formed on the top surface of the at least one fin, and a strained layer formed at least on a top surface of the at least one gate stack, wherein the strained layer is configured to provide a strain force to the at least one gate stack.

Abstract: A microelectromechanical probe is manufactured by a MEMS manufacturing process forming a probe body and a cutting process providing a pinpoint portion a cutting face. The probe has a top surface, a body portion, and a pinpoint portion extended in a probing direction from the body portion and provided with first and second sides and a probing end oriented in the probing direction. The cutting face is provided on the top surface, adjoins the first and second sides and the probing end, and has at least one cut mark formed by the cutting process, extended from the first side to the second side and non-parallel to the probing direction. The cutting face descends from an edge cut mark to the probing end.

Abstract: A backlight module includes a light guide plate, a light source and a plastic frame. The light guide plate includes a light emitting surface, a bottom surface, a light incident surface and a first side surface. The first side surface includes a first inclined surface only. A first angle is between the first inclined surface and the bottom surface, and the first angle is an acute angle. The light source emits a light into the light guide plate through the light incident surface. The plastic frame includes a first portion disposed facing to the first side surface, wherein a portion of the light exits the light guide plate through the first side surface, and the portion of the light is reflected back to the first side surface by the first portion and then being refracted to the bottom surface through the first side surface.

Abstract: A semiconductor device and method of fabricating thereof is described that includes a substrate including at least one fin, at least one gate stack formed on a top surface of the at least one fin, a first inter-layer dielectric (ILD) layer formed on the top surface of the at least one fin, and a strained layer formed at least on a top surface of the at least one gate stack, wherein the strained layer is configured to provide a strain force to the at least one gate stack.

Abstract: A semiconductor device and method of fabricating thereof is described that includes a substrate including at least one fin, at least one gate stack formed on a top surface of the at least one fin, a first inter-layer dielectric (ILD) layer formed on the top surface of the at least one fin, and a strained layer formed at least on a top surface of the at least one gate stack, wherein the strained layer is configured to provide a strain force to the at least one gate stack.

Abstract: A probe for a probe head having lower and upper dies includes a main portion, a conductive portion stacked on at least a part of the main portion, an attachment layer covering the main portion and the conductive portion, a skin effect layer covering the attachment layer, and a stopping portion for being abutted against the lower or upper die. The main portion includes a first material. The conductive portion includes a second material. The skin effect layer includes a third material. The electrical conductivity of the third material is greater than that of the second material. The electrical conductivity of the second material is greater than that of the first material. The hardness of the first material is greater than that of the second material, and also greater than that of the third material.

Abstract: A semiconductor device and method of fabricating thereof is described that includes a substrate including at least one fin, at least one gate stack formed on a top surface of the at least one fin, a first inter-layer dielectric (ILD) layer formed on the top surface of the at least one fin, and a strained layer formed at least on a top surface of the at least one gate stack, wherein the strained layer is configured to provide a strain force to the at least one gate stack.

Abstract: A stereoscopic display device includes a display panel, a first lens array and a second lens array. The display panel has a display surface. The display panel includes a plurality of sub-pixels arranged in an array. The first lens array is disposed on the display surface of the display panel and is a one-dimension lens array. The first lens array includes a plurality of first semi-cylindrical lens extending along a first direction. The first semi-cylindrical lens has a first refractive index. The second lens array is disposed on the first lens array and is a one-dimension lens array. The second lens array includes a plurality of second semi-cylindrical lens extending along a second direction. The second semi-cylindrical lens has a second refractive index. The first direction is not parallel to the second direction.