Abstract: A metal mask and an inspecting method thereof are provided for improving quality standard detection. The metal mask has a first and a second long side and plural pattern regions. The method includes the followings steps Based on the pattern regions adjacent to the first and second long sides, a first and a second reference straight line adjacent to the first and second long sides respectively are defined. Then, a first maximum offset length between the pattern regions and the first reference straight line is measured. A second maximum offset length between the pattern regions and the second reference straight line is measured. When a difference between the first and second maximum offset lengths is less than or equal to 20 ?m, the metal mask is determined to meet an inspecting standard.

Abstract: In a method of manufacturing a semiconductor device, a fin structure having a channel region protruding from an isolation insulating layer disposed over a semiconductor substrate is formed, a cleaning operation is performed, and an epitaxial semiconductor layer is formed over the channel region. The cleaning operation and the forming the epitaxial semiconductor layer are performed in a same chamber without breaking vacuum.

Abstract: An automatic material changing and welding system for stamping materials includes a welding transfer sliding table and a welding platform. The automatic material changing device further includes a feeding system. The feeding system includes a double-head uncoiling machine, an automatic feeding machine and a flattening machine. The automatic material changing device is used for automatic feeding for a stamping machine. The system triggers a material changing signal through a sensor to control and integrate the welding transfer sliding table and the welding platform to act to execute a welding procedure, so that the stamping materials are in welding connection with new and old coiled materials through a welding connection plate to realize continuous production operation of an automated stamping production line.

Abstract: In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.

Abstract: A user equipment assistance information (UAI) negotiation method, for a user equipment (UE) of mobile communication includes receiving a first OtherConfig element of an RRC reconfiguration message comprising a plurality of configuration parameters with SETUP values from a network terminal; sending a first UAI including a first value of a first configuration parameter of the configuration parameters to the network terminal; and receiving a first RRC reconfiguration message corresponding to the first UAI from the network terminal.

Abstract: An electronic device and a method for manufacturing the same are provided. The electronic device includes a substrate, an encapsulant and an electronic component. The encapsulant is disposed over the substrate, and has a first top surface, a second top surface and a first lateral surface extending between the first top surface and the second top surface. A roughness of the first lateral surface is less than or equal to a roughness of the second top surface. The electronic component is disposed over the second top surface of the encapsulant and electrically connected to the substrate.

Abstract: A portable training device for plantar core muscles includes: a supporting portion corresponding in position to a transverse arch of a human sole and having a supporting-portion thickness and an allowable deformation in a Z direction; an inner cushioning portion connected to the supporting portion, corresponding in position to a first metatarsophalangeal joint of the sole, and having an inner-cushioning-portion thickness in the Z direction; and an outer cushioning portion connected to the supporting portion, corresponding in position to a fifth metatarsophalangeal joint of the sole, and having an outer-cushioning-portion thickness in the Z direction. The supporting-portion thickness is greater than the inner- and the outer-cushioning-portion thicknesses.

Abstract: The present disclosure provides a semiconductor device and a method of manufacturing the semiconductor device. The semiconductor device includes channel members disposed over a substrate, a gate structure engaging the channel members, and an epitaxial feature adjacent the channel members. At least one of the channel members has an end portion in physical contact with an outer portion of the epitaxial feature. The end portion of the at least one of the channel members includes a first dopant of a first concentration. The outer portion of the epitaxial feature includes a second dopant of a second concentration. The first concentration is higher than the second concentration.

Abstract: Semiconductor device and the manufacturing method thereof are disclosed herein. An exemplary semiconductor device comprises a semiconductor fin disposed over a substrate, wherein the semiconductor fin includes a channel region and a source/drain region; a gate structure disposed over the channel region of the semiconductor fin, wherein the gate structure includes a gate spacer and a gate stack; a source/drain structure disposed over the source/drain region of the semiconductor fin; and a fin top hard mask vertically interposed between the gate spacer and the semiconductor fin, wherein the fin top hard mask includes a dielectric layer, and wherein a sidewall of the fin top hard mask directly contacts the gate stack, and another sidewall of the fin top hard mask directly contacts the source/drain structure.

Abstract: A computer implemented method for managing the scope of permissions granted by users to application that includes collecting a set of permissions for an application from an application provider publication; and collecting a process flow for functional steps of the application from a review of the application that is published on a product review type publication. The computer implemented method further includes dividing the functional steps of the application into a plurality of journeys, each of said plurality of journeys having a function associated with a stage of a functional step from a perspective of a user; and matching permissions from the set of permissions for each journey of said plurality of journeys to provide matched permissible permissions to journeys stored in a customer journey store.

Abstract: A fan includes a fan hub and multiple blades. At least one blade includes a blade body and two extended blade portions. The two extended blade portions are connected to a first edge and a second edge on the blade body. The first edge and the second edge are opposite to sides of the blade body. In a top view, at least one of the two extended blade portions has a first width that is adjacent to the fan hub, and a second width that is away from the fan hub. The second width is larger than the first width. The second width and the first width are connected by a continuous surface. The width of the continuous surface increases away from the first width.

Abstract: A manufacturing method of a multi-screen display is provided. The manufacturing method includes the following steps. A first panel is provided. A second panel is provided. The first panel and the second panel are spliced. The first color coordinate of the first panel includes a first horizontal coordinate and a first vertical coordinate, and the second color coordinate of the second panel includes a second horizontal coordinate and a second vertical coordinate. The difference between the horizontal coordinate and the second horizontal coordinate is ?x, the difference between the first vertical coordinate and the second vertical coordinate is ?y, and ?x and ?y satisfy the following relationship: ?=arctan(?x/?y), 46 degrees???126 degrees.

Abstract: Semiconductor device and the manufacturing method thereof are disclosed herein. An exemplary semiconductor device comprises a semiconductor fin disposed over a substrate, wherein the semiconductor fin includes a channel region and a source/drain region; a gate structure disposed over the channel region of the semiconductor fin, wherein the gate structure includes a gate spacer and a gate stack; a source/drain structure disposed over the source/drain region of the semiconductor fin; and a fin top hard mask vertically interposed between the gate spacer and the semiconductor fin, wherein the fin top hard mask includes a dielectric layer, and wherein a sidewall of the fin top hard mask directly contacts the gate stack, and another sidewall of the fin top hard mask directly contacts the source/drain structure.

Abstract: Disclosed herein are humanized antibodies, antigen-binding fragments thereof, and antibody conjugates, that are capable of specifically binding to certain biantennary Lewis antigens, which antigens are expressed in a variety of cancers. The presently disclosed antibodies are useful to target antigen-expressing cells for treatment or detection of disease, including various cancers. Also provided are polynucleotides, vectors, and host cells for producing the disclosed antibodies and antigen-binding fragments thereof. Pharmaceutical compositions, methods of treatment and detection, and uses of the antibodies, antigen-binding fragments, antibody conjugates, and compositions are also provided.

Abstract: An apparatus includes an ultrasonic sensor stack, a foldable display stack that includes a display stiffener, and an additional stiffener between the ultrasonic sensor stack and the foldable display stack. The additional stiffener forms an acoustic resonator with the display stiffener and an adhesive layer between the display stiffener and the additional stiffener in order to amplify transmission of ultrasonic waves transmitted by the ultrasonic sensor stack. The additional stiffener includes a material having a high modulus of elasticity, low density, and high acoustic impedance value. In some cases, the additional stiffener includes a metal, a ceramic, a glass, or a glass ceramic. The additional stiffener increases an overall stiffness and mechanical integrity of the apparatus so that a foam backer may be omitted from the ultrasonic sensor stack.

Abstract: In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.

Abstract: An apparatus may include an ultrasonic sensor stack, a foldable display stack and a transmission enhancement layer. The foldable display stack may include a display stiffener and display stack layers. The display stack layers may form one or more display stack resonators configured to enhance ultrasonic waves transmitted by the ultrasonic sensor stack in a first ultrasonic frequency range. In some implementations, a transmission enhancement resonator may include the display stiffener and the transmission enhancement layer. In some examples, the transmission enhancement resonator may include at least a portion of the ultrasonic sensor stack. The transmission enhancement resonator may be configured to enhance the ultrasonic waves transmitted by the ultrasonic sensor stack in the first ultrasonic frequency range.