Abstract: The present invention relates to a manufacturing method of a unique textured yarn by upgrading the equipment and processing the modified single-material precursor, the textured yarn thereof, and the fabric made with the textured yarn thereof. According to the method, titanium dioxide is added into a precursor of PET pre-oriented yarn with single filament DPF<0.5 to form the first precursor. Then, the first precursor is fed into a flat conveying roller, and then into a differential roller, and then into an accelerating roller to form a dark and light double colored textured yarn with linen-like appearance and tone. Then, the dark and light double colored textured yarn is conveyed to a heater for heating and setting, and then conveyed to a false twisting machine for processing. Finally, it is conveyed to a nozzle for spraying.

Abstract: A method includes forming a package component, the package component comprising an integrated circuit die, attaching the package component to a package substrate; placing a heat spreader over the package component and the package substrate to form an integrated circuit package, wherein a height of the integrated circuit package is in a range from 2.5 mm to 6 mm, and performing a first automatic optical inspection (AOI) process on the integrated circuit package using an AOI apparatus to determine if the orientation and alignment of the heat spreader with regards to the package substrate is within specification, wherein the AOI apparatus comprises a lens that has a maximum depth of field that is greater than the height of the integrated circuit package, and wherein during the first AOI process the depth of field encompasses an entirety of the height of the integrated circuit package.

Abstract: A display panel includes a circuit substrate, light emitting elements, a side wire, and a chip-on-film package structure. The circuit substrate includes a circuit structure located on a first surface. The side wire includes a first bonding portion disposed on the first surface of the circuit substrate and bonded to the circuit structure, a first extension portion, a second extension portion, and a second bonding portion that are sequentially connected and have the same resistivity. The first extension portion is disposed on a side surface of the circuit substrate. The second extension portion is disposed on a second surface of the circuit substrate and overlapped with a peripheral region. The second bonding portion is disposed on the second surface of the circuit substrate. An orthogonal projection of the second bonding portion is overlapped with a display region. The chip-on-film package structure is bonded to the second bonding portion.

Abstract: Disclosed herein is a genetically modified mouse whose genome comprises a transgene encoding a Miltenberger blood group antigen subtype III (Mi.II antigen). According to embodiments of the present disclosure, the Mi.III antigen comprises the amino acid sequence of SEQ ID NO: 1. Also disclosed herein are a method of producing the genetically modified mouse, and uses of the genetically modified mouse in selecting a drug candidate for treating hypertension.

Abstract: A backlight module includes a light guide plate and a light source module. The light guide plate includes a light receiving surface, a light exit surface, and a bottom surface. The light exit surface is connected to a first end of the light receiving surface. The bottom surface is connected to a second end of the light receiving surface opposite to the first end and located opposite to the light exit surface. The bottom surface includes a central region and a peripheral girdle region at least partially surrounding the central region. The central region includes a plurality of first reflecting structures, and the peripheral girdle region includes a plurality of second reflecting structures. The second reflecting structure is different from the first reflecting structure. The light source module is disposed along the light receiving surface and provides light beams incident into the light receiving surface.

Abstract: An optical adjustment mechanism of wearable device includes a fixed portion, a movable portion, and an adjusting element. The fixed portion includes an outer frame connected with a first optical element, and the first optical element has an optical axis, wherein the outer frame forms a sectional plane along a direction parallel to the optical axis. The movable portion is movable relative to the fixed portion, and includes a holder. The holder holds a second optical element and is movably connected to the outer frame. The adjusting element connects the movable portion and the fixed portion, wherein the movable portion may be moved relative to the fixed portion by the adjusting element.

Abstract: An ultrasonic transducer includes a piezoceramic element with a first surface and a second surface opposite to each other through the piezoceramic element and a lateral surface connecting the first surface and the second surface, an acoustic matching layer with a third surface and a fourth surface opposite to each other through the acoustic matching layer and the third surface connecting with the second surface of the piezoceramic element, a first damping element with a fifth surface and a sixth surface opposite to each other through the first damping element and the sixth surface connecting with the first surface of the piezoceramic element, and a second damping element encapsulating the first damping element and the lateral surface of the piezoceramic element.

Abstract: A signal processing device includes a circuit system, in which the circuit system includes an amplifier, a temperature compensating circuit and a computing circuit. The amplifier is configured to amplify an input signal according to a temperature compensating current, in order to generate an output signal. A direct current offset of the output signal is related to the temperature compensating current. The temperature compensating circuit includes a detecting resistor and a comparator. The detecting resistor is configured to generate a detecting voltage according to the temperature compensating current. The comparator is configured to compare the detecting voltage with a reference voltage to generate a comparison signal. The computing circuit is configured to adjust the temperature compensating current according to the comparison signal so as to make the detecting voltage approximate to the reference voltage.

Abstract: Aspects of this disclosure relate to side-view mirror assemblies in vehicles and associated mirror controllers. A side-view mirror assembly may be configured with mirror tilt, power extend/retract, and power fold/unfold functionalities that may be electronically controllable via a mirror controller. The mirror controller may be interfaced with a tilt control switch and the side-view mirror assembly. The mirror controller may be configured to receive commands, via the mirror tilt control switch, and activate and/or deactivate the power extend/retract and power fold/unfold functionalities. Based on activation of the power extend/retract and power fold/unfold functionalities, the mirror tilt control switch may be used to cause extension, retraction, folding, and/or unfolding of a side-view mirror.

Abstract: An apparatus for cleaning a package device is provided. The apparatus includes a package device loader; a package device unloader; a first cleaning area disposed between the package device loader and the package device unloader; and a conveyor. The conveyor includes a frame extending from the package device loader to the package device unloader and through the first cleaning area; and a belt wrapping the frame, wherein the belt includes a movable upper surface between the package device loader and the package device unloader, wherein the movable upper surface is configured to move relative to and over the frame, and a first distance between the movable upper surface and the frame in the first cleaning area increases in a direction from the package device loader to the package device unloader.

Abstract: An ultrasonic transducer, including a piezoelectric element with an upper surface and a lower surface opposite to each other through the piezoelectric element and a lateral surface connecting the upper surface and the lower surface, a first acoustic matching layer with a first surface and a second surface opposite to each other through the first acoustic matching layer, and the first surface of the first acoustic matching layer is connected with the upper surface of the piezoelectric element, and a second acoustic matching layer with a third surface and a fourth surface opposite to each other through the second acoustic matching layer, and the third surface of the second acoustic matching layer is connected with the second surface of the first acoustic matching layer, and the glass transition temperature of the second acoustic matching layer is smaller than the glass transition temperature of the first acoustic matching layer.

Abstract: A heat dissipation structure is provided and includes: bonding portions disposed on electronic elements on an electronic carrier board of a test apparatus; and a board body having a first side and a second side opposing the first side, and the board body is disposed on the bonding portions via the first side and formed with heat transfer members on the second side.

Abstract: An optoelectronic device includes a base layer, a functional area, a semiconductor element, and a encapsulation layer. The base layer has a first side and a second side opposite to the first side. The functional area is on the first side of the base layer. The semiconductor element is on the second side of the base layer. The semiconductor element includes a first electrode and a second electrode, and the semiconductor element corresponds to the functional area. The encapsulation layer is on the second side of the base layer to surround the semiconductor element. A portion of the first electrode and a portion of the second electrode are exposed out of the encapsulation layer.

Abstract: A semiconductor laser (1000, 1001, 1002, 1003, 1004, 1005, 1006, 1007, 1000a, 1000a1, 1000a2, 1000a3, 1000b, 1000b1, 1000b2, 1000b3, 1000b4, 1000b, 2400), comprising a semiconductor stack (10), a first electrode structure, a second electrode structure, and an insulating layer (30, 30B, 301, 302, 601, 601, 602, 90, 93, 108). The semiconductor stack (10) has a first surface (11), a second surface (12), and a side surface (13). The semiconductor stack (10) comprises a first-type semiconductor layer (101, 101U1, 101U2), a second-type semiconductor layer (102, 102U1, 102U2, 102U3, 102U4), and an active layer (103, 103A, 103U1, 103U2, 103U3, 103U4) arranged between the first-type semiconductor layer (101, 101U1, 101U2) and the second-type semiconductor layer (102, 102U1, 102U2, 102U3, 102U4). The first electrode structure is arranged on the first surface (11) and the side surface (13).

Abstract: An optical adhesive film structure having an alignment function is provided. The optical adhesive film structure includes an optical adhesive layer and a release film. The release film is disposed on the optical adhesive layer. A first film surface of the release film facing away from the optical adhesive layer has a plurality of marks. The marks are recessed into the release film relative to the first film surface and do not run through the release film. A stitching display module and a manufacturing method of the stitching display module are also provided.

Abstract: An optical sensing apparatus includes an optical signal receiving circuit configured to receive a photocurrent signal from an optoelectronic detector and generate a differential voltage signal. The optical signal receiving circuit includes a transimpedance amplifier coupled to the optoelectronic detector and configured to convert the photocurrent signal from the optoelectronic detector into a first voltage signal. The optical signal receiving circuit includes a first power source configured to provide a first bias voltage for the optoelectronic detector. The optical signal receiving circuit includes an adjustment circuit coupled to the transimpedance amplifier and configured to adjust the first voltage signal to generate a second voltage signal. The optical signal receiving circuit includes a single-ended-to-differential converter coupled to the adjustment circuit and configured to convert the second voltage signal into the differential voltage signal.

Abstract: A display device includes a first pixel and a second pixel. The first pixel includes first light-emitting diodes. Each first light-emitting diode includes a first bottom semiconductor layer and a first top semiconductor layer stacked along a vertical direction. The second pixel includes second light-emitting diodes. Each second light-emitting diode includes a second bottom semiconductor layer and a second top semiconductor layer stacked along the vertical direction. In one of the first light-emitting diodes of the first pixel, a first mesa region is located in a first direction of a first overlap region, and in another of the first light-emitting diodes of the first pixel, the first mesa region is located in a second direction opposite to the first direction of the first overlap region. In each second light-emitting diode of the second pixel, a second mesa region is located in the second direction of a second overlap region.

Abstract: A lens assembly and AR glasses, including a lens, a sensing assembly, and one or more conducting assemblies. The sensing assembly is arranged on a first side of the lens. The conducting assemblies are arranged on the first side of the lens. Each conducting assembly comprises a transparent conductive layer, and a metal mesh layer. Wherein, the transparent conductive layer is placed on the first side of the lens. The metal mesh layer is placed on a side of the transparent conductive layer away from the lens. The metal mesh layer comprises a plurality of metal wires arranged at intervals. The plurality of the metal wires are electrically connected to the sensing assembly. The AR glasses includes a frame, and the lens assembly. The lens assembly is mounted on the frame.

Abstract: A lens assembly and Augmented Reality (AR) glasses, including a waveguide substrate, a wiring layer, a protective layer, an eye tracking component, and a lens. The waveguide substrate includes a first surface. The wiring layer is disposed on the first surface. The protective layer is disposed on the first surface and covering the wiring layer. The eye tracking component is disposed in the protective layer and is electrically connected with the wiring layer for tracking position of an eyeball. The lens is connected to a side of the protective layer away from the waveguide substrate. The AR glasses includes a display device and two lens assemblies. The display device is positioned between the two lens assemblies for emitting image light to the waveguide substrates of the two lens assemblies.