Patents by Inventor Lung-Chen Wei

Lung-Chen Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7875335
    Abstract: The present invention provides a polishing pad. The polishing pad comprises a transparent part and a high molecular weight layer. The transparent part has an uneven side surface and the profile of the uneven side surface is selected from a group consisting of a serrated shape, a wavy shape and a toothed shape. The high molecular weight layer encircles the transparent part.
    Type: Grant
    Filed: April 24, 2006
    Date of Patent: January 25, 2011
    Assignee: IV Technologies Co., Ltd.
    Inventors: Wen-Chang Shih, Yung-Chung Chang, Min-Kuei Chu, Lung-Chen Wei
  • Patent number: 7285233
    Abstract: A method of manufacturing a polishing pad is described. A mold having a mold cavity therein is provided. At least a strip is buried in the mold. A polymer foam material is injected into the mold cavity of the mold. The polymer foam material is cured to mold the polymer foam material into a molding polymer article. A mold release process is performed to obtain the molding polymer article. The strip on the molding article is removed to form a polishing pad having at least one groove thereon.
    Type: Grant
    Filed: January 10, 2006
    Date of Patent: October 23, 2007
    Assignee: IV Technologies Co., Ltd.
    Inventors: Wen-Chang Shih, Yung-Chung Chang, Min-Kuei Chu, Lung-Chen Wei
  • Patent number: 7241408
    Abstract: The present invention provides a method of fabricating a polishing pad having a detection window thereon. A mold having a cavity therein and a transparent thermosetting plastic part that is incompletely hardened are provided. The transparent thermosetting plastic part is disposed in the mold and a high molecular weight foam is injected into the cavity of the mold. The transparent thermosetting plastic part and the high molecular weight foam are hardened at the same time. After the step of demolding is performed, a polishing pad having a detection window thereon is formed. Moreover, the transparent thermosetting plastic part can be designed to have the central portion thicker than its peripheral portion for preventing deformation that is caused by the material difference of the detection window and other portions of the polishing pad.
    Type: Grant
    Filed: April 24, 2006
    Date of Patent: July 10, 2007
    Assignee: I.V. Technologies Co., Ltd.
    Inventors: Wen-Chang Shih, Yung-Chung Chang, Min-Kuei Chu, Lung-Chen Wei
  • Patent number: 7132070
    Abstract: A method of manufacturing a polishing pad is described. A mold having a mold cavity therein is provided. At least a strip is buried in the mold. A polymer foam material is injected into the mold cavity of the mold. The polymer foam material is cured to mold the polymer foam material into a molding polymer article. A mold release process is performed to obtain the molding polymer article. The strip on the molding article is removed to form a polishing pad having at least one groove thereon.
    Type: Grant
    Filed: May 14, 2003
    Date of Patent: November 7, 2006
    Assignee: IV Technologies, Co., Ltd.
    Inventors: Wen-Chang Shih, Yung-Chung Chang, Min-Kuei Chu, Lung-Chen Wei
  • Publication number: 20060198992
    Abstract: The present invention provides a polishing pad. The polishing pad comprises a transparent part and a high molecular weight layer. The transparent part has an uneven side surface and the profile of the uneven side surface is selected from a group consisting of a serrated shape, a wavy shape and a toothed shape. The high molecular weight layer encircles the transparent part.
    Type: Application
    Filed: April 24, 2006
    Publication date: September 7, 2006
    Inventors: Wen-Chang Shih, Yung-Chung Chang, Min-Kuei Chu, Lung-Chen Wei
  • Publication number: 20060197249
    Abstract: The present invention provides a method of fabricating a polishing pad having a detection window thereon. A mold having a cavity therein and a transparent thermosetting plastic part that is incompletely hardened are provided. The transparent thermosetting plastic part is disposed in the mold and a high molecular weight foam is injected into the cavity of the mold. The transparent thermosetting plastic part and the high molecular weight foam are hardened at the same time. After the step of demolding is performed, a polishing pad having a detection window thereon is formed. Moreover, the transparent thermosetting plastic part can be designed to have the central portion thicker than its peripheral portion for preventing deformation that is caused by the material difference of the detection window and other portions of the polishing pad.
    Type: Application
    Filed: April 24, 2006
    Publication date: September 7, 2006
    Inventors: Wen-Chang Shih, Yung-Chung Chang, Min-Kuei Chu, Lung-Chen Wei
  • Publication number: 20060113705
    Abstract: A method of manufacturing a polishing pad is described. A mold having a mold cavity therein is provided. At least a strip is buried in the mold. A polymer foam material is injected into the mold cavity of the mold. The polymer foam material is cured to mold the polymer foam material into a molding polymer article. A mold release process is performed to obtain the molding polymer article. The strip on the molding article is removed to form a polishing pad having at least one groove thereon.
    Type: Application
    Filed: January 11, 2006
    Publication date: June 1, 2006
    Inventors: Wen-Chang Shih, Yung-Chung Chang, Min-Kuei Chu, Lung-Chen Wei
  • Publication number: 20040094855
    Abstract: The present invention provides a method of fabricating a polishing pad having a detection window thereon. A mold having a cavity therein and a transparent thermosetting plastic part that is incompletely hardened are provided. The transparent thermosetting plastic part is disposed in the mold and a high molecular weight foam is injected into the cavity of the mold. The transparent thermosetting plastic part and the high molecular weight foam are hardened at the same time. After the step of demolding is performed, a polishing pad having a detection window thereon is formed. Moreover, the transparent thermosetting plastic part can be designed to have the central portion thicker than its peripheral portion for preventing deformation that is caused by the material difference of the detection window and other portions of the polishing pad.
    Type: Application
    Filed: May 14, 2003
    Publication date: May 20, 2004
    Inventors: Wen-Chang Shih, Yung-Chung Chang, Min-Kuei Chu, Lung-Chen Wei
  • Publication number: 20040096529
    Abstract: A method of manufacturing a polishing pad is described. A mold having a mold cavity therein is provided. At least a strip is buried in the mold. A polymer foam material is injected into the mold cavity of the mold. The polymer foam material is cured to mold the polymer foam material into a molding polymer article. A mold release process is performed to obtain the molding polymer article. The strip on the molding article is removed to form a polishing pad having at least one groove thereon.
    Type: Application
    Filed: May 14, 2003
    Publication date: May 20, 2004
    Inventors: Wen-Chang Shih, Yung-Chung Chang, Min-Kuei Chu, Lung-Chen Wei
  • Publication number: 20040021243
    Abstract: A method for manufacturing a PU (polyurethane) polishing pad is provided. Resins containing active hydrogen functional groups such as polyol resins, polyamine resins, and polythiol resins, and polyisocyanate resins containing —NCO functional groups are mixed to form a foamed PU polishing pad with excellent polishing properties by reaction injection-molding under high pressure, low temperature and auxiliary gas-adding. The PU polishing pad in accompany with an abrasive slurry can be widely used to polish high-level products such as wafers and optical glass.
    Type: Application
    Filed: March 27, 2003
    Publication date: February 5, 2004
    Inventors: Wen-Chang Shih, Yung-Chung Chang, Min-Kuei Chu, Lung-Chen Wei, Wen-Pin Chen