Abstract: A forming operation of resistive memory device is provided. The operation includes: applying a pre-forming gate voltage and a pre-forming bit line voltage to a target memory cell; performing a dense switching forming operation, wherein the dense switching forming operation includes alternately performing dense set operations and dense reset operations on the target memory cell, wherein the dense set operation includes applying a dense switching gate voltage and a dense set bit line voltage; and performing a normal set operation on the target memory cell, wherein the normal set operation includes applying a normal set gate voltage and a normal set bit line voltage to the target memory cell, the normal set gate voltage is greater than the pre-forming gate voltage and the dense switching gate voltage, and the normal set bit line voltage is less than the pre-forming bit line voltage and the dense set bit line voltage.

Abstract: An example non-transitory computer-readable medium storing machine-readable instructions that, when executed by a processor, cause the processor to: set a graphical processing unit (GPU) power allocation, the GPU power allocation indicating power available for use by a GPU. The processor sets a processor power allocation, the processor power allocation indicating power available for use by the processor. The processor receives a GPU usage value and modifies the GPU power allocation to a modified GPU power allocation based on the GPU usage value. The processor modifies the processor power allocation to a modified processor power allocation based on the modification of the GPU power allocation.

Abstract: An example non-transitory computer-readable medium storing machine-readable instructions that, when executed by a processor, cause the processor to: set a graphical processing unit (GPU) power allocation, the GPU power allocation indicating power available for use by a GPU. The processor sets a processor power allocation, the processor power allocation indicating power available for use by the processor. The processor receives a GPU usage value and modifies the GPU power allocation to a modified GPU power allocation based on the GPU usage value. The processor modifies the processor power allocation to a modified processor power allocation based on the modification of the GPU power allocation.

Abstract: An electronic apparatus includes a chassis and a heat dissipation module. The chassis includes a first panel, a second panel substantially parallel to the first panel, and a motherboard attached on the first panel and located between the first panel and the second panel. The heat dissipation module is attached on the motherboard and includes a fan with a cover, a first fin assembly attached to a first side of the fan, and a second fin assembly attached to a second side of the fan. The cover includes a main plate with an opening and a resisting flange extending slantwise from an edge of the opening. A portion of the first fin assembly is exposed by the opening. The resisting flange resists against the second panel to keep the main plate away from the second panel.

Abstract: An electronic apparatus includes a chassis and a heat dissipation module. The chassis includes a first panel, a second panel substantially parallel to the first panel, and a motherboard attached on the first panel and located between the first panel and the second panel. The heat dissipation module is attached on the motherboard and includes a fan with a cover, a first fin assembly attached to a first side of the fan, and a second fin assembly attached to a second side of the fan. The cover includes a main plate with an opening and a resisting flange extending slantwise from an edge of the opening. A portion of the first fin assembly is exposed by the opening. The resisting flange resists against the second panel to keep the main plate away from the second panel.

Abstract: A heat-dissipation module and an electronic device including a first heat source and the heat-dissipation module are provided. The heat-dissipation module includes a first heat pipe, a second heat pipe, a first set of heat fins, a second set of heat fins and a fan. One end of the first heat pipe and one end of the second heat pipe are respectively in contact with the first heat source. The first set of heat fins and the second set of heat fins are, respectively, in contact with the other end of the first heat pipe and the other end of the second heat pipe. Heat generated by the first heat source is transferred to the two sets of heat fins through the first and the second heat pipes. The fan is used for providing an air-flow blowing toward the two sets of heat fins to dissipate heat.

Abstract: A heat-dissipation module and an electronic device including a first heat source and the heat-dissipation module are provided. The heat-dissipation module includes a first heat pipe, a second heat pipe, a first set of heat fins, a second set of heat fins and a fan. One end of the first heat pipe and one end of the second heat pipe are respectively in contact with the first heat source. The first set of heat fins and the second set of heat fins are, respectively, in contact with the other end of the first heat pipe and the other end of the second heat pipe. Heat generated by the first heat source is transferred to the two sets of heat fins through the first and the second heat pipes. The fan is used for providing an air-flow blowing toward the two sets of heat fins to dissipate heat.