Patents by Inventor Lung-Chuan Tsao

Lung-Chuan Tsao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9111659
    Abstract: Electrodes of a solar cell formed by an active solder and a method therefor are provided. The method includes steps of: providing a solar cell substrate; providing an active solder having at least one type of soldering alloy mixed with 6 wt % or less of at least one type of active component and 0.01-2.0 wt % of at least one type of rare earth element (Re); firstly melting the active solder at a temperature lower than 450° C.; then applying the molten active solder on the solar cell substrate (or firstly applying and then melting); and cooling to solidify the active solder, so as to form an electrode pattern.
    Type: Grant
    Filed: June 29, 2012
    Date of Patent: August 18, 2015
    Assignee: NATIONAL PINGTUNG UNIVERSITY OF SCIENCE & TECHNOLOGY
    Inventor: Lung-chuan Tsao
  • Publication number: 20130323530
    Abstract: An active solder is revealed. The active solder includes an active material and a metal substrate. There are two kinds of active materials, titanium together with rare earth elements and magnesium. The metal substrate is composed of a main component and an additive. The main component is tin-zinc alloy and the additive is selected from bismuth, indium, silver, copper or their combinations. The active solder enables targets and backing plates to be joined with each other directly in the atmosphere. The target is ceramic or aluminum with low wetting properties. The bonding temperature of the active solder ranges from 150° C. to 200° C. so that the problem of thermal stress can be avoided.
    Type: Application
    Filed: August 7, 2013
    Publication date: December 5, 2013
    Applicant: NATIONAL YUNLIN UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Shih-Ying CHANG, Lung-Chuan TSAO, Tung-Han CHUANG, Yen-Huan LEI, Cheng-Kai LI, Wei-Chia HUANG
  • Publication number: 20130029178
    Abstract: An active solder is revealed. The active solder includes an active material and a metal substrate. There are two kinds of active materials, titanium together with rare earth elements and magnesium. The metal substrate is composed of a main component and an additive. The main component is tin-zinc alloy and the additive is selected from bismuth, indium, silver, copper or their combinations. The active solder enables targets and backing plates to be joined with each other directly in the atmosphere. The target is ceramic or aluminum with low wetting properties. The bonding temperature of the active solder ranges from 150° C. to 200° C. so that the problem of thermal stress can be avoided.
    Type: Application
    Filed: July 27, 2011
    Publication date: January 31, 2013
    Inventors: Shih-Ying CHANG, Lung-Chuan Tsao, Tung-Han Chuang, Yen-Huan Lei, Cheng-Kai Li, Wei-Chia Huang
  • Publication number: 20130000718
    Abstract: Electrodes of a solar cell formed by an active solder and a method therefore are provided. The method includes steps of: providing a solar cell substrate; providing an active solder having at least one type of soldering alloy mixed with 6 wt % or less of at least one type of active component and 0.01-2.0 wt % of at least one type of rare earth element (Re); firstly melting the active solder at a temperature lower than 450° C.; then applying the melt active solder on the solar cell substrate (or firstly applying and then melting); and cooling to solidify the active solder, so as to form an electrode pattern.
    Type: Application
    Filed: June 29, 2012
    Publication date: January 3, 2013
    Inventor: Lung-chuan TSAO
  • Publication number: 20110318886
    Abstract: A method for forming circuit patterns on a surface of a substrate is provided and has steps of: providing and pre-heating a substrate having an insulation surface on one side thereof; providing an activation connection device for oscillating and painting an activation solder onto the pre-heated insulation surface to heat and melt the activation solder; applying ultrasonic waves to the melted activation solder by the activation connection device, so as to activate the activation solder and the insulation surface by the ultrasonic waves; and moving the activation connection device, so as to form a circuit pattern on the insulation surface by the activation solder.
    Type: Application
    Filed: June 17, 2011
    Publication date: December 29, 2011
    Applicant: NATIONAL PINGTUNG UNIVERSITY OF SCIENCE & TECHNOLOGY
    Inventor: LUNG-CHUAN TSAO
  • Publication number: 20110070122
    Abstract: An alloy composition comprises 73.0 to 74.5 wt % of Ag and 25.5-27.0 wt % of Sn; 30.0-67.5 wt % of Ag and 32.5-70.0 wt % of In; or 29.0-60.0 wt % of Ag, 19.0-35.0 wt % of Sn and 20.0-35.2 wt % of In, wherein the particle diameter of Ag is between 10 nm to 200 ?m. The alloy composition in the present invention has characters of low melting point, low hardness and high ductility. On the other hand, after a heat treatment, the alloy composition is tended to be high in melting point, hardness, strength, stability and conductivity.
    Type: Application
    Filed: August 25, 2010
    Publication date: March 24, 2011
    Inventor: Lung-Chuan Tsao