Abstract: An LED packaging includes a substrate having a top surface and a bottom surface opposite to the top surface, a recess defined in the top surface, an LED mounted on the top surface of the substrate, a zener diode received in the recess, and a reflecting layer formed in the recess and enclosing the zener diode therein.

Abstract: An LED bulb includes a connecting member having an Edison male screw base and an LED module engaging with the connecting member. The LED module includes a circuit board, a first LED and a plurality of second LEDs mounted on the circuit board. The first LED is arranged on a center of the circuit board. The second LEDs are located surround the first LED. The LED bulb furthermore includes a plurality of lens. Each lens covers a corresponding second LED. Each lens includes a light-guiding portion which includes a light input surface and a light output surface. Light emitted from each of the second LEDs travels into the lens via the light input surface, and is refracted out to lateral directions of the LED bulb by the light output surface of the light-guiding portion to obtain a wider illumination range.

Abstract: A method for manufacturing an LED (light emitting diode) with bat-wing emitting field lens is disclosed. Firstly, a substrate is provided. The substrate includes a plurality of depressions each corresponding to a pair of electrodes. A plurality of LED chips are fastened in the depressions and electrically connected to the pairs of electrodes. A plurality of unsolidified lenses are formed in the depressions to cover the LED chips. A pressing mold including a plurality of protrusions is provided. The pressing mold is moved towards the substrate to force the protrusions of the pressing mold to insert into the unsolidified lenses. The lenses are solidified and the pressing mold is removed and concavities are defined at the lenses. The substrate is cut to obtain a plurality of separated and finished LEDs.

Abstract: An optical lens includes a first optical surface located at a bottom thereof, a third optical surface located at a top thereof and arranged oppositely to the first optical surface, and a second optical surface extending between the first optical surface and the third optical surface. The third optical surface is recessed downwardly towards the first optical surface. The light from the LED light source enters into the optical lens through the first optical surface, most of the entering light is directly refracted out of the optical lens through the second optical surface, and a part of the entering light that strikes the third optical surface is first reflected by the third optical surface towards the second optical surface via total internal reflection and then refracted out of the optical lens through the second optical surface. A backlight module incorporating the optical lens is also provided.

Abstract: An exemplary lens includes a bottom surface, a first light exit surface extending upwardly from an outer periphery of the bottom surface, a second light exit surface extending upwardly from a top of the first light exit surface, and a reflecting surface extending inwardly and downwardly from a top of the second light exit surface towards the bottom surface to have a funnel-shaped configuration. A receiving space is defined in the bottom surface to receive a light source therein. The receiving space is defined by a top surface and a side surface interconnecting the top surface and the bottom surface. A pyramid surface is in the middle of the top surface and recessed upwardly and inwardly away from the bottom surface.

Abstract: An LED module includes a PCB with a first electrode and a second electrode formed thereon, an LED mounted on the PCB, a lens mounted on the PCB and covering the LED. The LED includes a base, an LED die mounted on the base, and a packaging layer arranged on the base and covering the LED die therein. The base is flat. The lens includes a bottom surface, a first light output surface extending from the bottom surface, a second light output surface extending upwardly from a central of the first light output surface and away from the bottom surface, and a reflecting surface recessing downwardly from a top end of the second light output surface and oriented towards the bottom surface. A chamber is defined in the bottom surface to receive the LED therein.

Abstract: An exemplary method for manufacturing an LED package includes following steps: providing a substrate; forming a reflector on the substrate with a receiving chamber defined in the reflector; providing an LED chip and mounting the LED chip on the substrate wherein the LED chip is received in the receiving chamber; providing a gelatinous phosphor layer and arranging the gelatinous phosphor layer on a top end of the reflector wherein the gelatinous phosphor layer covers the receiving chamber and phosphor powder is evenly distributed in the gelatinous phosphor layer; providing a pressing mold and arranging the pressing mold on a top end of the gelatinous phosphor layer; pressing the pressing mold toward the gelatinous phosphor layer to make the gelatinous phosphor layer fill in the receiving chamber; solidifying the gelatinous phosphor layer.

Abstract: A method for packaging an LED, includes steps: providing a supporting board and then dripping a gel mixed with fluorescent therein on the supporting board; scraping the gel over the supporting board with a scraper form a gelatinous fluorescent film on the supporting board, and solidifying the gelatinous fluorescent film pieces to form a solidified fluorescent film; cutting the solidified fluorescent film into individual pieces, and peeling the solid fluorescent films from the supporting board; attaching one piece of the fluorescent film on a light outputting surface of an LED die; mounting the LED die on a substrate, and electrically connecting the LED die to the circuit structure; and forming an encapsulation on the substrate to cover the LED die.

Abstract: A method for manufacturing an LED package comprising steps of: providing a substrate and forming spaced electrode structures on the substrate; providing a mold on the top surface of the substrate wherein the mold defines spaced annular grooves which cooperate with the top surface of the substrate to define cavities; filling the cavities with metal material; removing the mold and hardening the metal material to form reflection cups wherein each reflection cup surrounds a corresponding electrode structure and defines a recess; polishing surfaces of the reflection cups and the electrode structures; arranging LED chips in the recesses with each LED chip electrically connected to the electrode structure; injecting an encapsulation layer in the recesses to seal the LED chips; and cutting the substrate to obtain individual LED packages.

Abstract: A light emitting diode package for mounting to a printed circuit board by surface mounting technology includes a substrate, first and second electrodes and a light emitting diode. The first electrode and the second electrode each have a first end and a second end. The second end of the first electrode is adjacent to the first end of the second electrode and a distance therebetween is increased along a top-to-bottom direction of the light emitting diode package. The first end of the first electrode extends out of the substrate and forms a tapered structure. The second end of the second electrode extends out of the substrate and forms a tapered structure. The light emitting diode chip is electrically connected with the first and second electrodes. A method for manufacturing the light emitting diode package is also provided.

Abstract: A method for manufacturing LED packages includes steps: providing a lead frame including many pairs of first and second electrodes and first and second tie bars respectively located at opposite ends of each pair of the electrodes, the first and second electrodes each including a main body and an extension electrode protruding outwardly from the main body; forming many molded bodies to engage with the first and second electrodes, the first and second main bodies being embedded into the molded bodies, and the first and second extension electrodes being exposed from a periphery of the molded body; removing the first and second tie bars from the lead frame; disposing LED dies in corresponding receiving cavities defined by the molded bodies; and cutting the molded bodies and the lead frame to obtain a plurality of individual LED packages.

Abstract: An exemplary light emitting diode package includes a substrate, a first electrode and a second electrode embedded in the substrate, and a light emitting chip fixed onto the first electrode by first glue. The first electrode has a first barrier member at a periphery of the first glue and below the light emitting chip. The first barrier member obstructs the first glue from spreading toward a side of the first barrier member away from the first glue and the light emitting chip, whereby a contamination by the first glue to an area of the top surface beside the side of the first barrier of the first electrode away from the first glue and the light emitting chip is prevented.

Abstract: An light-emitting diode (LED) package includes a substrate, a electrode structure embedded in the substrate, and a plurality of LED chips electrically connecting with the electrode structure. The substrate includes a main portion and a protruding portion extending from a bottom surface of the main portion. The main portion is located above the protruding portion. The electrode structure includes a first, a second and a third electrode spaced from each other. The third electrode is located between the first and second electrodes. Top surfaces of the first, second and third electrodes are exposed out of the top surface of the main portion. Bottom surfaces of the first and second electrodes are exposed out of the bottom surface of the main portion. Bottom surface of the third electrode is covered by the protruding portion. The present disclosure also relates to a method for manufacturing the LED package.

Abstract: An exemplary light emitting diode (LED) package includes a substrate, a first electrode penetrating downward through the substrate, a second electrode penetrating downward through the substrate and spaced from the first electrode, an LED die arranged on the substrate and mounted to the first and second electrodes by flip-chip technology, and an encapsulation layer formed on the substrate to encapsulate the LED die therein. The substrate includes a top surface and a bottom surface at opposite sides thereof. Top ends of the first and second electrodes are exposed at the top surface of the substrate, and bottom ends of the first and second electrodes are exposed at the bottom surface of the substrate. A moisture barrier layer is attached on the bottom of the LED package to cover a joint of the first and/or second electrode and the substrate.

Abstract: An LED device includes a substrate having a top surface and a bottom surface. The substrate defines a through hole at a center thereof. The LED device also includes an electrode board. The electrode board defines a concave portion at a center thereof, and a convex portion connected to and surrounding two sides of the concave portion. The concave portion includes a first electrode and a second electrode isolated from each other, and is located in the through hole of the substrate. A bottommost surface of the concave portion is substantially coplanar with the bottom surface of the substrate, and a top surface of the convex portion is substantially coplanar with the top surface of the substrate. An LED chip is arranged on the concave portion, and is electrically connected to the first electrode and the second electrode. A method for manufacturing plural such LED devices is also provided.

Abstract: A method for manufacturing an LED package structure is disclosed wherein a substrate with a first electrode, a second electrode and a connecting layer is provided. A photoresist coating is provided to cover the substrate, the first electrode, the second electrode and the connecting layer. A portion of the photoresist coating is removed to define a groove corresponding to the connecting layer. A metal layer is formed in the groove to join the connecting layer. A remaining portion of the photoresist coating is removed and a concave is formed and surrounded by the metal layer. A reflective layer is formed on an inside surface of the concave to join the metal layer to form a reflective cup. An LED die is mounted in the reflective cup and electrically connects with the first and second electrodes.

Abstract: A light emitting diode (LED) package includes a substrate, a first electrode, a second electrode, an LED die mounted on the substrate and electrically connected to the first and the second electrodes, and an encapsulation layer encapsulating the LED die. Both the first and the second electrodes are embedded in the substrate and spaced from each other. Each of the first and the second electrodes includes a top face and a bottom face, with the top face and the bottom face thereof being exposed at a top surface and a bottom surface of the substrate, respectively. The top face of the first electrode defines a first groove therein. An oxidation-resistant metal coating layer is filled in the first groove. A positive bonding pad of the LED die directly contacts with a top face of the first oxidation-resistant metal coating layer.

Abstract: A light emitting diode (LED) package includes a substrate, a first electrode and a second electrode embedded in the substrate and spaced from each other, an LED die mounted on a top surface of the substrate and electrically connected to the first and the second electrodes. Both the first and the second electrodes include a top face and a bottom face, with the top face and the bottom face of each of the first and the second electrodes being exposed at the top surface and a bottom surface of the substrate, respectively. The top face of the first electrode defines a first groove corresponding to a positive bonding pad (p-pad) of the LED die. The p-pad is partially inserted into the first groove. An oxidation-resistant metal coating layer is filled between an insertion portion of the p-pad and an inner surface of the first groove.

Abstract: A fabrication method for a light-emitting element package, the method comprising: providing a high precision wafer level mold module, the high precision wafer level mold module comprising an upper mold and a bottom mold; mounting a substrate with a plurality of light-emitting elements between the upper mold and the bottom mold; filling package materials into the high precision wafer level mold module to obtain package members mounted on the light-emitting elements; and removing the high precision wafer level mold module.

Abstract: A method for manufacturing LED packages includes steps: providing a lead frame including many pairs of first and second electrodes, and first and second tie bars, the first electrodes and second electrodes each including a main body and an extension electrode protruding outward from the main body; forming many molded bodies to engage with the pairs of the first and second electrodes, the first and second main bodies being embedded into the molded bodies, and the first and second extension electrodes being exposed out from a corresponding molded body; preforming many first grooves at a bottom of each molded body; disposing LED dies in the corresponding receiving cavities; and cutting the molded bodies along edges thereof defining the first grooves in a first direction and then along a second direction perpendicular to the first direction to obtain many individual LED packages.