Patents by Inventor Lung-jo Tao

Lung-jo Tao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4415987
    Abstract: A passive replicator for bubble devices receives a bubble from an input channel and splits that bubble into two bubbles which go into two separate output channels when a rotating magnetic field is applied. The bubble replicator is a single element which has at least three peripheral areas in spaced relation that are associated with different propagation channels. In preferred embodiments, an elongated bar is present in the propagation channels and it is positioned adjacent to and in spaced relation with a peripheral area of the replicator.
    Type: Grant
    Filed: March 31, 1980
    Date of Patent: November 15, 1983
    Assignee: International Business Machines Corporation
    Inventors: Thomas W. Collins, Lung-jo Tao
  • Patent number: 4187553
    Abstract: An improved magnetic bubble domain chip and processes for making the chip are described. The chip is comprised of a magnetic bubble domain film in which small bubble domains can be moved, and overlying layers of metallurgy. The layer of metallurgy closest to the bubble film is an electrically conductive layer having apertures (or recesses) therein. This layer is patterned to provide current carrying conductors. The next overlayer is a layer of magnetic material having in-plane magnetization which is patterned to provide the propagation elements used to move the bubble domains. In a particular embodiment, the magnetic layer is comprised of a magnetically soft material, such as permalloy. The chip is characterized by the provision of insulating pedestals located in the apertures of the conductive layer. These insulating pedestals are located in the regions of the chip used for sensing (and/or bubble generation). That is, they take the place of the thick conductive material in those areas of the chip.
    Type: Grant
    Filed: December 23, 1977
    Date of Patent: February 5, 1980
    Assignee: International Business Machines Corporation
    Inventors: Kie Y. Ahn, Mitchell S. Cohen, John V. Powers, Lung-jo Tao