Patents by Inventor Lung-Kun Yu

Lung-Kun Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic Component
    Publication number: 20250218989
    Abstract: An electronic component includes an integrated circuit die, having an upper surface including a plurality of bonding pads, wherein the plurality of bonding pads are electrically connected to a circuit of the integrated circuit die; and at least one passive component, electrically connected to the plurality of bonding pads by soldering.
    Type: Application
    Filed: December 27, 2024
    Publication date: July 3, 2025
    Applicant: INTELPRO INC.
    Inventors: Lung-Kun Yu, Huai-Yi Hsu, Yu-Kuang Lien, Shang-Ta Tsai, Wen-Yuan Hsiao, Yen-Chih Chen